JPS6169151A - Soldering device of cap for hermetic seal - Google Patents

Abstract

PURPOSE:To shorten the time required for soldering, and to reduce production cost by holding and fixing a laminate, in which a thermal conductive adapter, a ceramic substrate and a cap made of a metal are superposed through solder, while exposing the greater part of the lower surface of the ceramic substrate. CONSTITUTION:A ceramic substrate 26 to be soldered is placed on a heat transfer surface in a heater 18, and fastened by a guide 19, and heated up to a temperature required for soldering through the conduction of a heating wire in the heater 18. A cap 25 made of a metal is superposed at the predetermined position of the ceramic substrate 26 while holding solder 27, and two cap temporary fixing jigs 21 are attached pinchingly at the facing positions of a unit. When the temperature of a thermal conductive adapter 20 reaches the temperature necessary for soldering, the unit to which the cap temporary fixing jigs 21 are set is placed at a prescribed position, and solder 27 is melted to fasten the cap 25 made of the metal. Accordingly, heat from the heater 18 is transmitted rapidly over solder 27, thus shortening the time required for soldering.

Description

Detailed Description of the Invention [Technical Field of the Invention 1] The present invention relates to a hermetic sealing cap used when a gold FF cap is fixed by soldering onto a hybrid TC substrate for hermetically sealing a hybrid IC. This invention relates to a soldering device.

[Technical background of the invention] Generally, in the final step of hybrid TC production,
A metal cap with a through hole is fixed on a ceramic substrate by soldering, aged at high temperature to remove volatile components, and after replacing the inside of the metal cap with an inert gas, the through hole is removed. A hermetic seal is applied by sealing with solder.

In order to solder a metal cap onto a ceramic substrate in such a hermetic sealing work, conventionally, as shown in FIG. , a cap soldering device for airtight sealing consisting of a temporary cap device e15 for temporarily fixing the metal cap 2 on the ceramic substrate 4 via the solder 3!
! 6 was used.

Here, the cap temporary fixing device 5 has a flat heat transfer surface that is in contact with the heat transfer surface of the heater 1, and is used to allow protrusions such as the leads 7 of the ceramic substrate 4 to escape to this heat transfer surface. A metal heat exchanger plate 9 with grooves 8 carved thereon and this gold jlK
A pair of holding tanks 10 provided at the rear corner of the manufactured heat exchanger plate 9
A guise consisting of. Note that this holding mechanism 10 is attached to the upper end of a support 11 erected on a metal heat exchanger plate 9.
A rotating arm 12 with axis 1 is attached, and the rotating arm 12
Insert the spring 13 on the outside into the through hole at the tip of the knob 16 and attach the clamp 14 to the tip.
It is said to have a fixed structure.

Conventionally, soldering of ceramic substrates has been carried out using such an airtight sealing cap soldering device M6 according to the procedure shown below.

■ Turn on the heater 1 to heat the heat transfer surface to the required temperature required for soldering in advance.

■ Overlap the metal cap 2 and the ceramic substrate 4 with the M solder sheet 3 necessary for soldering interposed, and as shown in FIG. Place it on top and press it from above with the presser mechanism 10.

■ Place the metal cap 2 and ceramic substrate 4 together
It's F..., E□. 7□5- Yao.

The metal cap 2 is fixed onto the ceramic substrate 4 by placing it on the ceramic substrate 4 and melting the solder 3.

[Problems with Background Art] However, in the conventional method using such an airtight sealing cap soldering device 6, heat from the heater 1 is transferred to the solder via the cap temporary fixing device 5. This is due to the respective thermal resistances of the heater 1 and the cap temporary fixing device 5, the cap temporary fixing device 3 and the ceramic substrate 4, and the heat absorption caused by the heat capacity of the cap temporary fixing device 5 and the heat dissipation from its surface. Due to heat loss, it takes time for a sufficient amount of heat to be transferred to the solder 3, resulting in a problem of poor work efficiency.

In addition, when soldering mass-produced products, it is usually necessary to prepare 20 to 30 temporary cap fixing devices for each heater, which costs the entire cap soldering device for airtight sealing. There was a problem that the amount of

[Object of the Invention] The present invention has been made to solve these conventional problems, and provides an airtight sealing cap solder that can shorten the time required for the soldering described above and reduce production costs. The purpose is to provide an attached device.

[Summary of the Invention] That is, the hermetic sealing cap solder material device of the present invention includes a heater having a built-in heat source and a heat transfer surface on the top surface, and a heat transfer surface on the top surface of which a ceramic substrate to be heated can be brought into contact. A stack of a thermally conductive adapter placed on the heater, a ceramic substrate, and a cap made of gold I laminated together via solder is sandwiched with most of the lower surface of the ceramic substrate exposed. and a temporary cap fixing jig for fixing the cap.

[Embodiments of the invention] The present invention will be described below with reference to embodiments shown in the drawings.

FIG. 1 is an exploded perspective view of one embodiment of the present invention.

As shown in the figure, the hermetic sealing cap soldering device a17 of this embodiment includes a heater 18 which has a built-in heating means such as an electric heater and has a flat heat transfer surface on the upper surface. It consists of a heat conduction adapter 20 that is locked so as not to shift in the horizontal direction by a guide 19 fixed on a heat transfer surface, and a plurality of cap temporary fixing jigs 21.

As shown in FIG. 4, the cap temporary fixing jig 21 is a thin elastic metal plate 22 having a shape in which a protrusion is formed in the opposite direction to the arms of the mouth shape. The support points 23 and 24 are formed on opposing surfaces of the tips thereof, respectively, so as to protrude toward the opposing sides.

In addition, the distance between the two support points 23 and 24 in the vertical direction is as follows: The size is slightly smaller than the dimension between 251 planes.

Due to this dimensional difference, when the metal cap 25 stacked on the ceramic substrate 26 is sandwiched from above and below by the cap temporary fixing jig 21, an appropriate pressing force is generated, and the metal cap 25 is fixedly held. .

When the aforementioned unit is held between the cap temporary fixing jig 21, the upper support point 23 is in contact with the upper surface of the metal cap 25, and the lower support point 24 is in contact with the lower surface of the ceramic substrate 26, so that the metal cap 25 and the ceramic substrate 26 are sandwiched, but it is desirable that the area of the arm portion of the cap temporary fixing jig 21 that comes into contact with the lower surface of the ceramic substrate 26 be as small as possible with respect to the whole from the viewpoint of thermal efficiency.

The heat conduction adapter 20 is placed on the heat transfer surface of the heater 18 and is secured by a guide 19 that is piped onto the top surface of the heater 18, but this is held in place so as to be in sufficient contact with the top surface of the heater 18. It has a flat underside.

In addition, the heat transfer surface of the upper part of the heat conduction adapter 20 is connected to the lead 28 of the ceramic board 26 and the cap temporary when the navigation unit is placed thereon with the cap temporary fixing jig 21 clamped thereon. In order to prevent the fixing jig 21 from coming into contact with it, both sides are stepped lower than the central part, and the whole has a step-like shape.

The hermetic sealing cap soldering device 17 of the embodiment configured as described above is used as follows.

■ Prepare a heat conduction adapter 20 with a shape that matches the ceramic substrate 26 to be soldered, place it on the heat transfer surface of the heater 18 and lock it with the guide 19, and then energize the heating wire inside the heater 18. Heat it to the temperature required for soldering.

(2) Overlap the metal cap 25 at a predetermined position on the ceramic substrate 26 with the solder 27 in between, and sandwich the two cap temporary fixing jigs 21 at opposing positions of this unit.

■When the temperature of the thermally conductive adapter 20 reaches the required temperature for soldering, place the unit with the cap temporary fixing jig 21 set thereon in a predetermined position with the ceramic substrate 26 facing down, and melt the solder 27. metal cap 2
5. Fix it on top.

In this way, the hermetic sealing cap solder size device 17 of the embodiment
According to , since the heat from the heater 18 is quickly transferred to the solder 27, the time required to solder the metal cap 25 is shorter than that using a conventional hermetic sealing cap soldering device. The time is reduced to about 1/10, and the work can be done about 10 times more efficiently.

In addition, for one heater 18, a heat conduction adapter 201
Although 20 to 30 bases and cap temporary fixing jigs 21 are prepared, the simple structure of the cap temporary fixing jigs 21 is extremely low cost, so compared to conventional cap soldering equipment for airtight sealing, the cost is about 20 to 30. The device cost can be reduced by 1/20 to 1/30.

Note that the cap temporary fixing jig 21 in the hermetic sealing cap soldering device of the present invention is not limited to the structure shown above.

In other words, as shown in Fig. 4, there is a rectangular thin metal plate with both ends bent in the same direction to form two support points, or an elastic metal wire as shown in Fig. 5. A similar effect can be achieved by using a curved shape.

Further, in the above embodiments, an example using a solder sheet has been described, but preliminary solder may be formed in advance at the joint portion of the metal cap on the ceramic plate.

[Effect of the invention 1] As is clear from the above embodiments, according to the hermetic sealing cap soldering device of the present invention, half-bonding of the hermetic sealing metal cap to the ceramic substrate can be carried out in an extremely short time. This has the advantage that the equipment cost is also very low.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view of an embodiment of the present invention, Fig. 2 is an exploded perspective view of a conventional hermetic sealing gear knob soldering device, and Fig. 3 is a conventional hermetic sealing cap half-day soldering device. A perspective view showing a state in which a metal cap and a ceramic substrate are attached, and FIGS. 4 and 5 are perspective views showing other examples of temporary cap fixing jigs used in other embodiments of the present invention, respectively. 1.18... Heater 2.25... Metal cap 3.27... Solder 4.26... Ceramic board 5... Cap temporary fixing device 6.1
7... Airtight sealing cap soldering device 9... Metal flat plate 10...
・・・・・・Patent attorney for presser mechanism Satoshi Suyama - Figure 1 Figure 2 Figure 3 Figure 5 Figure 6 Proceedings Amendment (Method) October 7, 1985 Commissioner of the Patent Office 1. Indication of the case: Japanese Patent Application No. 59-100271 2. Title of the invention: Air-tight sealing cap soldering device 3. Person making the amendment: Relationship with the case. Patent applicant: Shio, Saiwai-ku, Yozaki City, Kanagawa Prefecture. 72 Yomachi (307) Toshiba Corporation 4, Agent Address: 2-1 Kanda Tamachi, Chiyoda-ku, Tokyo 101, page 10, line 14, ``Figure 4 and Figure 5'' has been replaced with ``Figure 4 represents the present invention.'' 5 and 6 are plan views of a thin elastic metal plate used to form a temporary cap fixing jig according to an embodiment of the present invention. that's all

Claims (1)

[Claims] (1) a heater having a built-in heat source and a heat transfer surface on the top surface; a heat conduction adapter placed on the heater and having a heat transfer surface on the top surface to which a ceramic substrate to be heated can be brought into contact; A cap temporary fixing jig for clamping and fixing a laminate in which a ceramic substrate and a metal cap are laminated via solder while leaving most of the lower surface of the ceramic substrate exposed. Sealing cap soldering device.