JPS58154250A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To realize automatic sealing process by dry sealing a hybrid integrated circuit with a packing material, cover and fixing piece. CONSTITUTION:A packing material 12 formed as a frame of almost the same shape as the periphery of a substrate 11 at the periphery of a hybrid integrated circuit substrate 11 comprising the desired circuit element. A cover 13 which perfectly covering circuit element on the substrate 11 is placed on the packing material 12. Then, a U-shape fixing piece 14 which has been formed by shaping a metal plate is provided in such a way as holding the cover 13 and substrate 11 by pressurizing them. As a result, the packing material 12 is pressurized. Thereby, a hermetical sealing structure can be easily realized. The one end of fixing piece 14 is engaged with a cut-away part 15 provided at the opposite main surface of substrate 11 in order to enhance the fixing condition without interfering installation of substrate 11 onto a heat sink.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in hybrid integrated circuits, and particularly to hybrid integrated circuits that realize a simple package structure.

In conventional hybrid integrated circuits,! As shown in the It diagram, the desired I
The end of the hybrid integrated one-way board (1) incorporating the Gl-way element is impregnated with an adhesive resin having approximately the same shape.
3, place the resin lid (33) in contact with each other, apply pressure and heat, and seal the two together with a t.

Since a wet sealing method using adhesive resin is used for hybrid integrated circuits, it is not necessary to place a large amount of hybrid integrated circuits in a heating furnace and heat them for a long time, such as opening for more than 1 hour, during the bonding process described above. Must not be. Therefore, as long as you adopt the wet sealing method〕
However, it has drawbacks that impede mass production.

The present invention has been made in view of the drawbacks of the prior art and provides a hybrid integrated circuit which eliminates the drawbacks of the prior art and employs a nine-way sealing method. Embodiments of the present invention will be described in detail below with reference to FIGS. 2 to 4.

The hybrid integrated circuit according to the present invention is composed of a hybrid integrated circuit board aυ incorporating desired circuit elements (not shown), a frame-shaped backing material 112J, a lid a3, and a fixing piece (2).

The hybrid integrated one-way board aυ may be an aluminum laminate board whose surface is anodized, or an iron or aluminum laminate board with an insulating material such as Nereau.

On the nose plate συ, there is a conductive path made of copper foil, a resistor with a resistor base printed and fired, or a transistor pellet or chip element fixed on the conductive path with solder paste, etc. II! U path element tube element attachment L''CC configures desired path T.

The backing material Ia is the periphery #1 of the base tjia1) for sealing.
It is formed into a frame shape of approximately II shape, as shown in Fig. 2.
/9 Use a material shaped with only silicone rubber or a material with silicone rubber (122) pasted on both sides of the Evokin resin core material (121) as shown in Figure 1.The thickness of this backing material Although it varies depending on the shape of the body a3, when using the flat cover body (13) shown in Fig. 2, it is necessary to ensure a height sufficient to protect the circuit elements on the substrate συ, for example, a thickness of 101. Set to

As shown in Figure 4, when the lid body (13) is shaped like a bottomed container, 2 [
A sheet of glue with a root length of 1 to 5 m is sufficient.

The lid body (13 is formed by shaping epoxy V resin, and can be flat plate-like as shown in Fig. 2 or bottomed vessel-like shape as shown in Fig. It is sufficient that the IP! circuit elements have full KWi')m functionality.

The fixing pieces Q41 are formed into a U-shape as shown in FIGS. 2 and 4, and are arranged 1T so as to have an interval that allows the lid 03 and the substrate 11 to be crimped and clamped. As a result, since the banking material (121) is crimped, a VC sealing structure can be easily realized.Also, one end of the fixed piece Q4 is connected to the board u1) CD
It is fitted into the notch 115 provided on the opposite main surface to prevent the fixed piece from becoming an obstacle to the heat dissipation plate of the substrate (111).Furthermore, as shown in FIG. 4, the lid body a3 The aesthetic appearance can also be improved by forming a cutoff NAl 151 so that the fixed piece a fathom is exposed only on the @ side of the hybrid accumulation 1 crystal. According to the structure of the present invention, the backing material (121
And since a sealed structure can be achieved by the fixed piece a fathom,
This results in a number of advantages:

First, since it is a completely dry seal, there is no need for any equipment for wet sealing in the sealing process, and since there is no contact, it is possible to use a machine that can be used for assembly line work. ]Sealing is performed on 1. As a result, automation of the sealing process, which was previously considered impossible, is now possible.
li! can.

Second, if a metal craftsman is used as one board, there is no risk of the board (11) cracking even if the force e from the fixed piece Q4 is increased, and the sealing degree is good.Fifth, remove the fixed piece I4 This makes it easy to open the m body, which is convenient for identifying defects.
3? It is also possible to perform regeneration (in exchange).

As described in detail above, the present invention has made it possible to easily realize a dry V-type circuit, which was previously absent in hybrid integrated circuits, and also made it possible to automate manufacturing. Nowadays, the moisture resistance of the elements themselves has improved significantly, and it is clear that the dry seal method proposed by @Mei will become the mainstream for future hybrid integrated circuits.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view explaining the conventional example, vPI2 to 4.
The figure is a sectional view illustrating the invention in detail. Explanation of the earthy book αυ is a hybrid integrated circuit board, α3 is a backing material, 0 is a lid, and a knob is a fixed piece.

Claims (1)

[Scope of Claims] t. A hybrid integrated one-way board incorporating desired circuit elements, a frame-shaped backing material disposed at the end of the board, and a lid member that comes into contact with the backing material and covers the & board. and a fixing piece that presses and clamps the substrate and the lid. 2. The hybrid integrated circuit according to claim 1, wherein the backing material allows the lid body and the Ik plate to be spaced apart as desired. 5. The hybrid integrated circuit according to claim 1, wherein the backing material is made of v-lip rubber bonded to both sides of the resin frame. 4. Special I! F. The hybrid integrated circuit according to claim 1, wherein one end of the fixing piece is scattered in a notch on the bottom surface of the substrate.