JPS6142859B2 - - Google Patents
Info
- Publication number
- JPS6142859B2 JPS6142859B2 JP53152526A JP15252678A JPS6142859B2 JP S6142859 B2 JPS6142859 B2 JP S6142859B2 JP 53152526 A JP53152526 A JP 53152526A JP 15252678 A JP15252678 A JP 15252678A JP S6142859 B2 JPS6142859 B2 JP S6142859B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- crimping
- crimping tool
- gigantic
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は半導体装置に用いるギヤング・ボンデ
イング圧着工具に開する。DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a gigantic bonding crimping tool used for semiconductor devices.
従来、この種のギヤング・ボンデイング圧着工
具は、剛体のみで形成されていたため、圧着され
る多端子の位置凸凹があると、加圧されないリー
ドが生じ、しかもリード加圧が一様でない欠点が
あつた。 Conventionally, this type of gigantic bonding crimping tool was made of only a rigid body, so if the position of the multiple terminals to be crimped was uneven, some leads would not be pressurized, and the lead pressure would not be uniform. Ta.
本発明の目的は、このような欠点を除去したギ
ヤング・ボンデイング圧着工具を提供することに
ある。 An object of the present invention is to provide a gigantic bonding crimping tool that eliminates such drawbacks.
この発明は、弾性体よりなる圧着部と、この圧
着部に伝達する気体または流体を内包する支持部
とを備えたことを特徴としている。 The present invention is characterized in that it includes a crimping section made of an elastic body and a support section containing gas or fluid to be transmitted to the crimping section.
この発明にかかるギヤング・ボンデイング圧着
工具によれば、圧着されるべき多端子の位置の凸
凹に追従し、しかもリードそれぞれに均一な加圧
力を加えることができる。 According to the gigantic bonding crimping tool according to the present invention, it is possible to follow the unevenness of the position of multiple terminals to be crimped, and to apply a uniform pressing force to each lead.
第１図は、本発明の一実施例を説明した斜視図
で剛体部１と弾性体でできた加圧部２より成るギ
ヤング・ボンデイング圧着工具を示している。 FIG. 1 is a perspective view illustrating an embodiment of the present invention, showing a gigantic bonding crimping tool comprising a rigid body part 1 and a pressing part 2 made of an elastic body.
金属等の物質でできており、加圧部２は耐熱性
のよい弾性体（たとえばポリイミド）でできてい
る。第２図は第１図のＡ−Ａ断面図である。剛体
部１の空胴部３の下端内側に弾性体がとりつけて
あり、加圧部２を形成している。空胴部３内には
加熱された気体又は液体４が入つており、加圧部
２に圧力を伝える。第３図は第１図のギヤング・
ボンデイング圧着工具を使つてＩ・Ｃ等の電子部
品の多端子をギヤング・ボンデイングする場合を
説明した斜視図である。多端子電子部品５のリー
ド６をパターン７にギヤング・ボンデイング圧着
工具で熱圧着する。第４図は多端子電子部品５が
パターン上にギヤング・ボンデイング圧着工具に
より熱圧着させられた状態を説明する断面図であ
る。リード６は圧着部２によりパターン７に圧着
されている。このとき、加圧力は気体又は液体４
を通して行なわれるためリードには均一な圧力が
かかりやすく、又同時に必要な熱は気体又は液体
４を通して均一に供給される。第５図は第４図の
Ｂ−B′断面図である。パターン７の凹凸にともな
うリード６の凹凸と、基盤８の凹凸とを加圧部２
の弾性膜が吸収してリード６を加圧する。 It is made of a substance such as metal, and the pressurizing part 2 is made of an elastic material (for example, polyimide) with good heat resistance. FIG. 2 is a sectional view taken along the line AA in FIG. 1. An elastic body is attached to the inside of the lower end of the cavity 3 of the rigid body part 1, forming a pressurizing part 2. A heated gas or liquid 4 is contained in the cavity 3 and transmits pressure to the pressurizing part 2. Figure 3 shows the Giyang of Figure 1.
FIG. 2 is a perspective view illustrating a case where multiple terminals of an electronic component such as an I/C are subjected to gigantic bonding using a bonding crimping tool. The leads 6 of the multi-terminal electronic component 5 are thermocompression bonded to the pattern 7 using a Guyang bonding crimping tool. FIG. 4 is a sectional view illustrating a state in which the multi-terminal electronic component 5 is thermocompression bonded onto a pattern using a Guyang bonding crimping tool. The lead 6 is crimped to the pattern 7 by the crimping part 2. At this time, the pressurizing force is 4
Since it is carried out through the lead, uniform pressure is easily applied to the lead, and at the same time, the necessary heat is uniformly supplied through the gas or liquid 4. FIG. 5 is a sectional view taken along line BB' in FIG. 4. The unevenness of the lead 6 due to the unevenness of the pattern 7 and the unevenness of the base 8 are pressed by the pressure unit 2.
The elastic membrane absorbs the pressure and pressurizes the lead 6.
なお、本発明による弾性体２は剛体部１の中に
はめ込む例をあげたが、シリコンゴム等のゴム系
の弾性体を用いて、これを剛体部１の外周をおゝ
うように装置してもよい。 Although an example has been given in which the elastic body 2 according to the present invention is fitted into the rigid body part 1, it is also possible to use a rubber-based elastic body such as silicone rubber and install it so as to cover the outer periphery of the rigid body part 1. It's okay.
以上のように本発明のギヤング・ボンデイング
圧着工具を用いると、多数個の圧着部をその位置
の凸凹を吸収して同時にギヤング・ボンデイング
できる。本発明のギヤング・ボンデイング圧着工
具は多ピンのＩ・Ｃリードのギヤング・ボンデイ
ングに適用すると特に効果的である。 As described above, when the gigang bonding crimping tool of the present invention is used, it is possible to simultaneously gigang bond a large number of crimped parts while absorbing the unevenness of the positions. The gigang bonding crimping tool of the present invention is particularly effective when applied to gigang bonding of multi-pin I/C leads.
第１図は本発明の一実施例であるギヤング・ボ
ンデイング圧着工具を説明した斜視図、第２図は
第１図Ａ−Ａ矢視断面図、第３図は多端子電子部
品のリード圧着のために第１図で示したギヤン
グ・ボンデイング圧着工具を適用した状態を説明
する斜視図、第４図は第３図で示したギヤング・
ボンデイング圧着工具が降下し、多端子電子部品
を圧着中の状態を説明した断面図、第５図は第４
図のＢ−Ｂ矢視断面図である。
なお、図において、１……剛体部、２……加圧
部、３……空胴部、４……気体又は液体、５……
多端子電子部品、６……リード、７……パター
ン、８……基盤をそれぞれ示す。
Fig. 1 is a perspective view illustrating a gigantic bonding crimping tool which is an embodiment of the present invention, Fig. 2 is a sectional view taken along the line A-A in Fig. 1, and Fig. 3 is a crimping tool for lead crimping of multi-terminal electronic components. Fig. 4 is a perspective view illustrating the state in which the Guyang bonding crimping tool shown in Fig. 1 is applied.
A cross-sectional view illustrating the state in which the bonding crimping tool is descending and crimping a multi-terminal electronic component.
It is a sectional view taken along the line BB in the figure. In addition, in the figure, 1... Rigid body part, 2... Pressure part, 3... Cavity part, 4... Gas or liquid, 5...
A multi-terminal electronic component, 6...lead, 7...pattern, and 8...substrate are shown, respectively.
Claims (1)
ングするギヤング・ボンデイング圧着工具におい
て、 圧着時に前記複数の端子と接触する弾性体より
なる前記圧着部と、 該圧着部を保持し、圧着時に前記弾性体を加圧
するための気体または流体を内包する支持部とを
備えたことを特徴とするギヤング・ボンデイング
圧着工具。[Scope of Claims] 1. A gigantic bonding crimping tool for bonding a plurality of terminals of a semiconductor device with a crimping part, comprising: a crimping part made of an elastic body that comes into contact with the plurality of terminals during crimping; and a crimping part that holds the crimping part. A gigantic bonding crimping tool comprising: a supporting portion containing gas or fluid for pressurizing the elastic body during crimping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5578537A JPS5578537A (en) | 1980-06-13 |
| JPS6142859B2 true JPS6142859B2 (en) | 1986-09-24 |
Family
ID=15542354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15252678A Granted JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5578537A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01233795A (en) * | 1988-03-15 | 1989-09-19 | Mitsubishi Electric Corp | Hybrid integrated circuit |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831546A (en) * | 1981-08-18 | 1983-02-24 | Nec Corp | Manufacture of semiconductor device |
| JPH05211208A (en) * | 1992-01-23 | 1993-08-20 | Nec Corp | Bonding device |
| JP2001230528A (en) * | 2000-02-15 | 2001-08-24 | Sony Corp | Mounting device and mounting method |
-
1978
- 1978-12-08 JP JP15252678A patent/JPS5578537A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01233795A (en) * | 1988-03-15 | 1989-09-19 | Mitsubishi Electric Corp | Hybrid integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5578537A (en) | 1980-06-13 |
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