JPS6129788A - High-heat load structure of nuclear fusion device - Google Patents
High-heat load structure of nuclear fusion deviceInfo
- Publication number
- JPS6129788A JPS6129788A JP15103284A JP15103284A JPS6129788A JP S6129788 A JPS6129788 A JP S6129788A JP 15103284 A JP15103284 A JP 15103284A JP 15103284 A JP15103284 A JP 15103284A JP S6129788 A JPS6129788 A JP S6129788A
- Authority
- JP
- Japan
- Prior art keywords
- heat load
- high heat
- load structure
- nuclear fusion
- fusion device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004927 fusion Effects 0.000 title claims description 7
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 241000234435 Lilium Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Landscapes
- Plasma Technology (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）発明の目的
［産業上の利用分野］
この発明は核融合装置にお（」るリミタやダイバータな
どの高熱負荷構造物に関するものである。[Detailed Description of the Invention] (a) Purpose of the Invention [Field of Industrial Application] The present invention relates to high heat load structures such as limiters and diverters in nuclear fusion devices.
［従来の技術］
核融合装置ではリミタやダイバータなどの高熱負荷構造
物をプラズマに対面する位置に設置する必要がある。し
たがって高熱負荷１構造物はプラズマの高熱に暉される
ので高熱負荷に対する健全性が要求され、また、高熱負
荷構造物のプラズマ側表面では入射粒子による損耗やス
パッタされた不純物イオンのプラズマ中への混入などの
問題があるためプラズマとの相互作用についても考旋す
る必要が生じる。[Prior Art] In a nuclear fusion device, it is necessary to install high heat load structures such as limiters and diverters at positions facing plasma. Therefore, the high heat load 1 structure is subjected to the high heat of the plasma, so it is required to have soundness against the high heat load.In addition, the plasma side surface of the high heat load structure is subject to wear due to incident particles and sputtered impurity ions into the plasma. Since there are problems such as contamination, it is necessary to consider the interaction with plasma.
このような即由から、高熱Ｅ％ ？ｉ？ｉ構造物のプラ
ズマ側表面には、耐熱衝撃性が高（損耗率の比較的小さ
い材料、あるいは低原子番号材料でつくられた保護板を
用いる場合がある。For such reasons, high fever E%? i? A protective plate made of a material with high thermal shock resistance (relatively low wear rate) or a low atomic number material may be used on the plasma side surface of the i-structure.
第４図は基板に対し保護板が鑞トｊけ’ｔＫどの方法に
より接合された高熱負荷構造物の従来例を示すものであ
るが、この方式では基板１（例えばステンレス）に箕秤
材料である保護板２（例えばＳｉＣの焼結物）が鑞付け
６（例えば銀合金など）により接合されるので、第５図
に示づごとく温度変化く潤度上昇など）に伴い基板材料
と保護板材別間の熱膨張ｔ（ΔＪ１．−八β２）八本２
人ぎな熱応力が発生し、保再板材別や基板材料のｌ１ｌ
Ｉｔ脱、はが４′之、ｉ’ｔ１１ ｔ＋、 ＜「どがＩ
ト１′；る問題があった。Figure 4 shows a conventional example of a high heat load structure in which a protective plate is bonded to a substrate using a soldering method. Since a certain protection plate 2 (for example, a sintered product of SiC) is joined by brazing 6 (for example, silver alloy, etc.), as shown in FIG. Thermal expansion t (ΔJ1.-8β2) between 8 pieces 2
Severe thermal stress occurs, and maintenance and maintenance of different board materials and board materials.
It's off, Haga 4', i't11 t+, <'Doga I
There was a problem.
［発明が解決し、ようとする問題点コ
この発明は上記の如き基板材と保護板材間の熱膨張差−
１） 淘ｒｒＦ、差に起因し大きな熱応力が発生してし
、両部材間の強固な接合が維持することができ、し１．
：／ｆつて、両部ＨＡ Ｉ？！１に−ａ３ （Ｊる州税
、はがれ、割れなどの生じデにい核融合択Ｆｊの高熱ｒ
！荷構造物を提４４１することを目的とづるものである
。[Problems to be solved and attempted by the invention] This invention solves the difference in thermal expansion between the substrate material and the protection plate material as described above.
1) A large thermal stress is generated due to the difference in temperature, and a strong bond between the two members can be maintained.1.
:/f and both parts HA I? ! 1 - a3 (J state tax, peeling, cracking, etc.) High heat of nuclear fusion option Fj
! The purpose is to carry cargo structures 441.
〈口）発明の構成
し問題点を解決するＩ、：めの手段］
この目的に対応しで、この発明の核融合装置の高熱負荷
構ｊも物は保護板と基板とを椛付けにより接合づる１５
式の高熱負荷構造物にｅいて、前記保護板あるいは前記
基板の接合面、若しり（，１、前記保護板と前記基板の
双方の接合面に凹凸を設【プたことを特徴とし−（いる
。<Means for constituting the invention and solving the problems] In response to this purpose, the high heat load structure of the nuclear fusion device of the present invention also includes a protective plate and a substrate that are joined together by joining. Zuru 15
The high heat load structure of the formula e is characterized in that unevenness is provided on the bonding surface of the protection plate or the substrate, or (, 1, the bonding surface of both the protection plate and the substrate. There is.
［作用］
基板および保護板の接合面の 方あるいは両りの接合面
に凹凸を形成する鑞材と部材（基板材料または保護板材
料）との接触面積を大きくとることができ、しかも、両
部材間の接合面において鑞材の厚みが厚くなる部分が多
数個所発生覆ることとなるので比較的軟質である鑞材の
特質が作用し、異種材わ１間での熱膨張差の吸収が図ら
れ接合が強固となる。[Function] It is possible to increase the contact area between the solder material and the component (substrate material or the protective plate material) that forms irregularities on one or both of the joint surfaces of the substrate and the protection plate, and also to make the contact area of both components As the solder material becomes thicker in many places at the joint surface between the parts, the comparatively soft properties of the solder material act to absorb the difference in thermal expansion between the different materials. The bond becomes stronger.
［実施例］
次に、この発明の詳細を一実施例を示（１図面について
説明する。[Example] Next, the details of this invention will be explained by an example (one drawing will be explained).
第１図において１は基板であり、基板１のＬ面、すなわ
ちプラズマに面する側に凹凸３が設りられている。前記
凹凸３は、第２図に承りように基板１の保護板２接合面
内の直交づる２方向に沿って設（プられており、保護板
２と基板１の接合面は鑞材６を介して固着される。In FIG. 1, reference numeral 1 denotes a substrate, and unevenness 3 is provided on the L side of the substrate 1, that is, the side facing plasma. As shown in FIG. 2, the unevenness 3 is formed along two orthogonal directions within the bonding surface of the protective plate 2 of the substrate 1, and the bonding surface of the protective plate 2 and the substrate 1 is provided with a solder material 6. It is fixed through.
第３図は、他の構造例を示Ｊ゛もので、前記凹凸を保護
板２側にも設けたものである。FIG. 3 shows another structural example in which the above-described unevenness is also provided on the protection plate 2 side.
尚、凹凸３の形状１、ニノい（１１第２図に示される角
突起（、Ｌかり−Ｃ’ ４；Ｌ ’、ｉ ＜、任意の形
状、例えば、第３図に示される山部および谷部に丸みを
っ（フた断面波クリ形状の−ｂのぐあ−＞ ｔ”ｔ）よ
い。It should be noted that the shape of the unevenness 3 is 1, the angular protrusion shown in FIG. It is good to round the valley (the wavy cross section of the lid ->t''t).
（ハ）発明の効果
保護板（’ｆ’ ｉ１５熱負ｂｉ＋溝ｊ告物Ｃ１−イノ
いて、イの接合面での熱応力の軽減方法とＬ／ ｃｌユ
、保護板もしくは基板を細分化することも一方策ではあ
るが、部材の細分化は構造の複雑化、取Ｇ＋’ ＜ｆの
繁雑化を１６くこととなり、現実にはイの様な４ｍ造を
どることには限瓜がある。(C) Effects of the invention Protective plate ('f' i15 heat stress bi + groove j notice material C1-ino, method of reducing thermal stress at the joint surface of A and L/cl u, subdividing the protective plate or substrate This is one solution, but subdivision of the components complicates the structure and increases the complexity of G+' .
この発明の高熱負荷構造物は基板Ｊ３よび、／′もしく
は保護板の接合面に凹凸を設け、接合強度を増すと同時
に、両部材間に充填された柔軟り鑞材が、熱膨張差や曲
げの変形を吸収する効果がある。しＩ（がつ゛Ｃ，水発
明にょねば接合強度に優れた信頼性の高い異種材料接合
り式の高熱負荷ｍ造物を得ることができる。In the high heat load structure of this invention, unevenness is provided on the bonding surfaces of the substrates J3 and /' or the protective plate to increase the bonding strength, and at the same time, the flexible solder material filled between the two members prevents thermal expansion difference and bending. It has the effect of absorbing the deformation of With this invention, it is possible to obtain a highly reliable structure with high heat load and excellent bonding strength made of dissimilar materials.
第１図ＩＪ本発明の高熱負荷構造物の要部断面図、第２
図は第１図の構造物の各部を承り斜視図、第３図は断面
波型形状の凹凸とした他の構造例の要部断面図、第４図
は従来の高熱負荷構造物の要部断面図、及び第５図は基
板と保護板間の熱膨張差についての説明図である。
１・・・基板 ２・・・保護板 ３・・・凹凸
５・・・冷Ｍｌヂマ？ンネル （５・・・鑞イ（【プ
（抽料） △ム・・・基板の自由＃帳時の膨張層
ΔＪ２・・・保護板の自由膨張時の膨張量
特許出願人 三菱原子カニ業株式会ネＩ代理人
弁理士 川 井 冶 男第１図
（プラス゛マ側）
第２図
（プラスマ４リリ）
第４図Figure 1 IJ A sectional view of the main parts of the high heat load structure of the present invention, Figure 2
The figure is a perspective view of each part of the structure shown in Figure 1, Figure 3 is a cross-sectional view of the main part of another structure example with a corrugated cross-section, and Figure 4 is the main part of a conventional high heat load structure. The cross-sectional view and FIG. 5 are explanatory diagrams regarding the difference in thermal expansion between the substrate and the protection plate. 1... Board 2... Protective plate 3... Unevenness
5...Cold Mljima? (5...Bullet) △Mu...Free #expansion layer of the substrate
ΔJ2...Amount of expansion during free expansion of the protective plate Patent applicant: Mitsubishi Atomic Crab Industry Co., Ltd. Representative Patent Attorney Osamu Kawai Figure 1 (Plasma side) Figure 2 (Plasma 4 lily) Figure 4
Claims (2)
熱負荷構造物において、前記保護板あるいは前記基板の
接合面、若しくは、前記保護板と前記基板の双方の接合
面に凹凸を設けたことを特徴とする核融合装置の高熱負
荷構造物。(1) In a high heat load structure in which a protection plate and a board are joined by brazing, unevenness is provided on the joint surface of the protection plate or the board, or on the joint surface of both the protection plate and the board. A high heat load structure for a nuclear fusion device characterized by:
けられたことを特徴とする特許請求の範囲第１項記載の
核融合装置の高熱負荷構造物。(2) The high heat load structure for a nuclear fusion device according to claim 1, wherein the unevenness is provided along two orthogonal directions within the joint surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103284A JPS6129788A (en) | 1984-07-20 | 1984-07-20 | High-heat load structure of nuclear fusion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103284A JPS6129788A (en) | 1984-07-20 | 1984-07-20 | High-heat load structure of nuclear fusion device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6129788A true JPS6129788A (en) | 1986-02-10 |
Family
ID=15509808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15103284A Pending JPS6129788A (en) | 1984-07-20 | 1984-07-20 | High-heat load structure of nuclear fusion device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6129788A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63210912A (en) * | 1987-02-27 | 1988-09-01 | Ngk Insulators Ltd | Compound body of optical element |
| WO1999066350A1 (en) * | 1998-06-18 | 1999-12-23 | Hamamatsu Photonics K.K. | Scintillator panel and radiation image sensor |
-
1984
- 1984-07-20 JP JP15103284A patent/JPS6129788A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63210912A (en) * | 1987-02-27 | 1988-09-01 | Ngk Insulators Ltd | Compound body of optical element |
| JPH0617928B2 (en) * | 1987-02-27 | 1994-03-09 | 日本碍子株式会社 | Optical element composite |
| WO1999066350A1 (en) * | 1998-06-18 | 1999-12-23 | Hamamatsu Photonics K.K. | Scintillator panel and radiation image sensor |
| US6573506B2 (en) | 1998-06-18 | 2003-06-03 | Hamamatsu Photonics K.K. | Scintillator panel and radiation image sensor |
| US7132665B2 (en) | 1998-06-18 | 2006-11-07 | Hamamatsu Photonics K.K. | Scintillator panel and radiation image sensor |
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