JPS61279651A - Joining material - Google Patents

Abstract

PURPOSE:To improve adhesion to ceramics materials in a wide temp. range by using as joining material a metallic material containing Ti by a specific quantity or above. CONSTITUTION:The metallic material containing >=85% Ti is used as the joining material with the ceramics materials. As to the above metallic material, it includes the one containing 100% Ti and, as other metals, Nb, Mo, Ta, Al, Sn, Cr, Fe, Mn, Co, Ni, V, Cu, etc. are used. This joining material can be used for the joining with the ceramics materials having an average thermal expansion coefficient, at 20-300 deg.C, of <=12X10<-6>/ deg.C and further it enables firm adhesion to ceramics by means of brazing, shrinkage fit, adhesion, mechanical bond, fit, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Use Needles (1)] The present invention relates to a bonding material used for bonding with ceramic materials.

[Background of the invention/prior art]

Recently, the use of ceramics for the auxiliary combustion chambers and cylinders of internal combustion engines, and the high-temperature parts of Ganu turbine engines, etc., has been considered, but because ceramics have poor workability and are hard and brittle, parts made of them are not suitable. The mechanical strength was not satisfactory, and there were also difficulties in assembling it into the device. In order to compensate for the above-mentioned drawbacks of ceramics, metals are joined together to form a composite.

[Problem that the invention seeks to solve]

However, ceramics and metals have significantly different coefficients of thermal expansion α, and specifically, FfJ', ts
″hb-tx y i 9 y-(D a 1TfaO
idli″TJ6° [On the other hand, α of metal is as follows.

・、: 2″J bonded chain 6 material phases″1-00″significantly different
If the value is 1, the bonding strength may have decreased due to distortion caused by the cooling process from heating during bonding or temperature changes during use, or one of the bonded materials, such as ceramics, may have been damaged. It's deformed.

As mentioned above, the structural metal materials that have been widely used in the past have insufficient K to bond with ceramics.

As a means to solve the above problems, it has been proposed to bond a metal material with a small a to ceramics. As such a metal material, for example, W (aj4.5X 10
/”C), Mo (α′:5.5X 10/
``C)'' has been considered, but it is easily oxidized and cannot be used at high temperatures in the atmosphere, and its mechanical properties are brittle and difficult to process, so it has not yet been put to practical use. Invar alloy (α= 1.OX 10
/'C, from room temperature to 100°C)% Fe-42
Ni alloy (α=4.2X10/'C1 nitrogen temperature to 10
0″C) or Kovar alloy (α=6.7XI
There are alloys conventionally used for sealing such as O/'C, from room temperature to 100"C, but these alloys show a small α from room temperature to about 200"C, and above that α increases rapidly at high temperatures, and the strength is low (tensile strength at room temperature ≦50 kqf/d).Furthermore, the strength decreases significantly at high temperatures, making these alloys unsuitable for structural use. Furthermore, it has not yet been put into practical use.

[Means for Solving the Problems] As a means for solving the above-mentioned conventional problems, the present invention provides a metal material containing 85% or more of Ti as a bonding material with ceramics.

The invention will be explained in detail below.

The metal material of the present invention contains 85% or more of Ti, and of course, 100% Ti is also included as the metal material of the present invention.

By containing 85% or more of Ti, the metal material of the present invention has an α of 10 over a wide range from room temperature to 500'O.
Since it is less than X 10 '/'O, the bondability with ceramics is higher than that of the above-mentioned conventional alloys. Furthermore, the metal material of the present invention has a Young's modulus of steel material (19000 kg
C12000kQ/ which is extremely small compared to C12000kQ/
d or less), therefore, it easily absorbs the stress generated and exhibits high bonding properties. When the metal material of the present invention is made of 100% Ti, the tensile strength at room temperature is 60tcHH" or less, and the strength may be insufficient depending on the application. In such cases, foil.

Mo+Ta* All, Sn, Or, Fe, Mn,
By adding 15% or less, preferably 5 to 18%, of one or more other metals such as Co, Ni, V, and O to form an alloy, the alloy can be made into an alloy with a temperature of 100% or more at room temperature and 50% at 500°C. Tensile strength of 1/1 or more can be obtained. Of course, the tensile strength can be adjusted by the type and content of the other metals mentioned above. Furthermore, when the metal material of the present invention has a high Ti content, strength and strength can be improved by adding OlC or N.
can also be improved. Furthermore, the strength can also be improved by cold working, which can be used depending on the manufacturing process.

However, when the Ti content of the metal material of the present invention is 85% or less, α becomes 1oxto''rc or more, so Ti
The content should be at least 85%.

The ceramics to which the bonding material of the present invention is bonded are those whose α is not significantly different from that of the metal material that is the bonding material. Such ceramics have an average α of 12 X I F'/'C or less in the range of 20°C to 800°C], and Ut
's * Z! ()! r 8 too '1rOe
Examples include TsN, ZrN, 8r74, etc.

[For production]

The effects of the present invention are as follows.

The bonding material and ceramics of the present invention are brazed.

Although they are joined by methods such as shrink fitting, adhesion, mechanical bonding, and fitting, the joining material of the present invention and ceramics do not differ greatly in a, so the cooling process from heating during joining and the temperature during use Since the strain caused by the change is small and the McYoung's modulus is small, the stress generated is easily absorbed. Further T
Since i is an active metal, the bonding material of the present invention containing a large amount of it is easily compatible with ceramics and has strong adhesive strength. Furthermore, the book i″4O!+$tia’l”
"t*mVC'a"tr*J6IIINi %@@
The specific gravity is about 55 to 58% compared to gold steel materials.

[Effect of the invention]: 1 Therefore, in the present invention, metal and ceramics
1) Even when used at high temperatures, there is almost no chance of the ceramic being damaged or the metal being deformed, and the adhesion between the metal and ceramics is excellent, and layer peeling almost never occurs. do not have.

The bonding material of the present invention is used for bonding with ceramics as described above, but the bonding material is used as an intermediate layer and further a
It is also possible to join other metals with a large value.

〔Example〕

The end face of an 8 i N4 sintered body with a diameter of 20 M and a length of 25 fl was ground with a #600 diamond grindstone to obtain a test piece for bonding.

On the other hand, various metal materials having the same shape as the above test piece, ie, diameter 20III+1° and length 25ff, were prepared as shown in Table 1, and the end faces were ground with a #600 alumina grindstone to obtain metal test pieces.

The above bonding test piece and the above metal test piece were bonded together using silver solder in an oxidizing atmosphere with a buffer layer of appropriate thickness interposed between them.
Bonding was carried out by applying a pressure of d and heating.

After bonding, the above bonding test piece was inspected for cracks, and a sample with length and width of 5×51tI11 and length of 5Q11H including the bonded portion was collected.
For this sample, upper span 10H1 lower span 3Q11
11. A four-point bending test was conducted with the joint at the center of the upper span to measure the strength. Furthermore, 5 conjugated bodies with a diameter of 20n were
After repeating the process of heating for 10 minutes in a furnace at 00° C. and cooling with air for 10 minutes 100 times, the bonding sample pieces were examined for cracks.

On the other hand, a tensile test was conducted on each of the above metal sample pieces to measure their strength, and the average a in the range from room temperature to 500''C was also measured.

The results of the above tests are shown in Table 1. In the table, O indicates the case where there was no cracking and X-chip cracking was present.

According to Table 1, it is clear that the samples of this example show no cracking after bonding and have high strength.

Claims (1)

[Claims] The average coefficient of thermal expansion in the range of 20℃ to 300℃ is 12
A metal material for bonding with a ceramic material at a temperature of ×10^-^6/℃ or less, and a bonding material characterized in that its composition contains 85% or more of Ti.