[go: up one dir, main page]

JPS61252534A - Liquid crystal display device - Google Patents

Liquid crystal display device

Info

Publication number
JPS61252534A
JPS61252534A JP9367085A JP9367085A JPS61252534A JP S61252534 A JPS61252534 A JP S61252534A JP 9367085 A JP9367085 A JP 9367085A JP 9367085 A JP9367085 A JP 9367085A JP S61252534 A JPS61252534 A JP S61252534A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
display device
wiring
display element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9367085A
Other languages
Japanese (ja)
Other versions
JP2539360B2 (en
Inventor
Kiichiro Kubo
毅一郎 久保
Shinobu Taima
当間 忍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Japan Display Inc
Original Assignee
Hitachi Device Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Device Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Device Engineering Co Ltd
Priority to JP60093670A priority Critical patent/JP2539360B2/en
Publication of JPS61252534A publication Critical patent/JPS61252534A/en
Application granted granted Critical
Publication of JP2539360B2 publication Critical patent/JP2539360B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は各種文字あるいは図形表示用として広範囲に使
用されている液晶表示装置に係わシ、特に液晶表示素子
を構成する絶縁性基板に金属配線を形成し、これに直接
液晶駆動用素子を接続したいわゆるチップオングラスタ
イプの液晶表示装置に関するものである0 〔発明の背景〕 従来、この種の液晶表示装置においては、例えば特開昭
56−50368号会報に示されているように一般に液
晶表示素子を構成するガラス基板上に金属配線を形成し
、その上に液晶駆動用のLSI素子を半田接続する、い
わゆるフェースダウンポンディングして構成されている
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a liquid crystal display device that is widely used for displaying various characters or graphics, and particularly relates to a liquid crystal display device that uses metal wiring on an insulating substrate constituting a liquid crystal display element. This invention relates to a so-called chip-on-glass type liquid crystal display device in which a liquid crystal driving element is directly connected to the liquid crystal display device. As shown in Bulletin No. 50368, metal wiring is generally formed on a glass substrate constituting a liquid crystal display element, and an LSI element for driving the liquid crystal is soldered onto the metal wiring, which is so-called face-down bonding. ing.

しかしながら、近年では液晶表示画素数の増加に伴ない
、1個のガラス基板に複数個のLSI素子を接続する必
要が生じておシ、この場合、複数個のLSI素子相互間
を電気的に接続する際、配線交差を行なう必要上、いわ
ゆる多層配線構造が不可欠となる。
However, in recent years, with the increase in the number of liquid crystal display pixels, it has become necessary to connect multiple LSI elements to one glass substrate. When doing so, a so-called multilayer wiring structure is essential because of the need for wiring crossings.

〔発明の目的〕[Purpose of the invention]

本発明はこのような事情に鑑みてなされたものであシ、
その目的は多層配線構造を低コストで実現可能にした液
晶表示装置を提供することにある。
The present invention has been made in view of these circumstances.
The purpose is to provide a liquid crystal display device that can realize a multilayer wiring structure at low cost.

〔発明の概要〕[Summary of the invention]

多層配線の一般的な構造線、第1配線層に絶縁層を設け
、接続を必要とする個所にスルーホールを形成し、引き
続き第2配線層を形成するものであるが、本発明は第1
配線層として液晶表示素子の電極として用いる透明導電
膜を用いたものである0 〔発明の実施例〕 次に図面を用いて本発明の実施例を詳細に説明する。
The general structural line of multilayer wiring is to provide an insulating layer in the first wiring layer, form through holes at locations where connections are required, and then form the second wiring layer, but the present invention
A transparent conductive film used as an electrode of a liquid crystal display element is used as a wiring layer. [Embodiments of the Invention] Next, embodiments of the present invention will be described in detail with reference to the drawings.

第1図は本発明の一実施例を示す断面図、第2図はその
多層配線構造を示す拡大断面図である。
FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is an enlarged sectional view showing its multilayer wiring structure.

第1図において、1は液晶表示素子を構成する上板ガラ
ス基板、2はその下板ガラス板である。3は上板ガラス
基板1に形成したコモン電極、4は下板ガラス基板2に
形成したセグメント電極を示し、その間に液晶5が注入
されてシール材6によって封止されている。
In FIG. 1, reference numeral 1 indicates an upper glass substrate constituting a liquid crystal display element, and reference numeral 2 indicates a lower glass plate thereof. Reference numeral 3 indicates a common electrode formed on the upper glass substrate 1, and 4 indicates a segment electrode formed on the lower glass substrate 2, between which liquid crystal 5 is injected and sealed with a sealing material 6.

一方、7は半導体チップからなる液晶駆動用LSI素子
であシ、とのLSI素子7は下板ガラス基板2上にセグ
メント電極4またはコモン電極3に接続して形成された
第1の接続用配線8上に半田9によって機械的に固着さ
れるとともに電気的に接続されている。また10はLS
I素子7の保i用の樹脂コート材、11は第1の接続用
配線8の保護用の樹脂コート材である。12は下板ガラ
ス基板2上に配設される複数個のLSI!7相互間に接
続して形成された第2の接続用配線であシ、この第2の
接続用配線12は前記コモン電極3、セグメント電極4
と同一構成部材により第1の接続用配線8の下層に絶縁
膜13を介して形成されている。またこの多層配線構造
は第2図に示すように必要に応じて第2の接続用配線1
2上に第1の接続用配線8がA部においてスルーホール
接続されている。
On the other hand, 7 is a liquid crystal driving LSI element made of a semiconductor chip, and the LSI element 7 is connected to the segment electrode 4 or the common electrode 3 on the lower glass substrate 2 and is connected to the first connection wiring 8. It is mechanically fixed and electrically connected by solder 9 on the top. Also 10 is LS
A resin coating material 11 is used to protect the I element 7, and a resin coating material 11 is used to protect the first connection wiring 8. 12 is a plurality of LSIs arranged on the lower glass substrate 2! 7, and this second connection wire 12 is connected to the common electrode 3 and the segment electrode 4.
It is formed of the same structural members as below the first connection wiring 8 with an insulating film 13 interposed therebetween. In addition, this multilayer wiring structure can be used as shown in FIG.
A first connection wiring 8 is connected to the portion A through a through-hole on the portion A.

ここで、第1の接続用配線8は半田9とぬれ性の良好な
金属例えばN1からなる厚さ約0.5 μmのNi金属
膜から形成されておシ、第2の接続用配線12はコモン
電極3.セグメント電極4と同一部材からなる透明導電
膜、すなわちInzos。
Here, the first connection wiring 8 is made of a metal having good wettability with the solder 9, such as N1, and is made of a Ni metal film with a thickness of about 0.5 μm, and the second connection wiring 12 is made of a Ni metal film with a thickness of about 0.5 μm. Common electrode 3. A transparent conductive film made of the same material as the segment electrode 4, that is, Inzos.

5n203  等の金属酸化物からなる厚さ約0.1μ
mの透明導電膜により形成されている。また、絶縁膜1
3は厚さ約0.3μmのポリイミド系樹脂膜、第1の接
続用配線8を保護する樹脂コート材11は厚さ約2μm
のポリイミド系樹脂膜によりそれぞれ形成されている。
Approximately 0.1μ thick made of metal oxide such as 5n203
It is formed of a transparent conductive film of m. In addition, insulating film 1
3 is a polyimide resin film with a thickness of about 0.3 μm, and a resin coating material 11 that protects the first connection wiring 8 has a thickness of about 2 μm.
They are each formed from a polyimide resin film.

また、このように構成される液晶表示装置を実現するた
めには、例えば次のようなプロセスを行えば良い。すな
わち、まず最初に第2の接続用配線12は液晶表示素子
のセグメント電極4の形成時に同時に形成する。次いで
層間絶縁膜13としてポリイミド樹脂を塗布、焼成し、
第1の接続用配線8と電気的接続を取るために必要な個
所にスルーホールを形成する0次いで第1の接続用配線
8としてのNiを蒸着等の成膜方法によりNi金属膜を
形成してフォトリソグラフィ技術により配線形成を行な
い、LSI素子7接続部分以外の領域に樹脂コート材1
1の形成を行なった後、通常の液晶表示素子の組立てを
行なう。最後にLSI素子7の接続を行ない、LSI素
子7保護用の樹脂コート材10をボッティング形成して
完成する。
Further, in order to realize a liquid crystal display device configured as described above, the following process may be performed, for example. That is, first, the second connection wiring 12 is formed simultaneously with the formation of the segment electrodes 4 of the liquid crystal display element. Next, polyimide resin is applied as an interlayer insulating film 13 and baked.
Through-holes are formed at necessary locations to establish electrical connection with the first connection wiring 8.Next, a Ni metal film is formed as the first connection wiring 8 by a film-forming method such as vapor deposition. Then, wiring is formed using photolithography technology, and resin coating material 1 is applied to areas other than the connection parts of LSI elements 7.
After forming 1, a normal liquid crystal display element is assembled. Finally, the LSI element 7 is connected, and a resin coating material 10 for protecting the LSI element 7 is formed by botting to complete the process.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、液晶表示素子を構
成する絶縁性基板上に形成する多層金属配線の少なくと
も一層を、液晶表示素子の電極膜と同一な透明導電膜に
よ多構成したことにより、液晶表示装置が低コストで実
現可能となる。また、情報グラフィック液晶表示素子な
ど複数個のLSI素子を必要とするデバイスについても
チップオングラス化が可能となシ、従来のプリント基板
実装モジュールに比べて軽量、薄形化がはかれるなどの
極めて優れた効果が得られる。
As explained above, according to the present invention, at least one layer of the multilayer metal wiring formed on the insulating substrate constituting the liquid crystal display element is made of the same transparent conductive film as the electrode film of the liquid crystal display element. Accordingly, a liquid crystal display device can be realized at low cost. In addition, it is possible to use chip-on-glass for devices that require multiple LSI elements, such as information graphic liquid crystal display elements, and has extremely superior features such as being lighter and thinner than conventional printed circuit board mounted modules. You can get the same effect.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す断面図、第2図はその
多層配線構造を示す要部拡大断面図である0 1.2・・・・液晶表示素子を構成するカラス基板、3
,4・・・・電極、5・Φ・・液晶、6・−・・シール
材、7拳・・・液晶駆動用LSI素子、8・・・・第1
の接続用配線、9・・・・半田、10.11 拳・・・
樹脂コート材、12・・・・第2の接続用配線、13・
・・・絶縁膜。
FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is an enlarged sectional view of essential parts showing its multilayer wiring structure.
, 4... Electrode, 5... Φ... Liquid crystal, 6... Seal material, 7... LSI element for driving liquid crystal, 8... First
Wiring for connection, 9...Solder, 10.11 Fist...
Resin coating material, 12...Second connection wiring, 13.
...Insulating film.

Claims (1)

【特許請求の範囲】[Claims] 液晶表示素子を構成する絶縁性基板上に絶縁膜を介して
多層金属配線を形成し、この金属配線に複数個の液晶駆
動用回路素子を接続してなる液晶表示装置において、前
記多層金属配線の少なくとも一層を、液晶表示素子の電
極を形成する透明導電膜により構成したことを特徴とす
る液晶表示装置。
In a liquid crystal display device in which a multilayer metal wiring is formed on an insulating substrate constituting a liquid crystal display element via an insulating film, and a plurality of liquid crystal driving circuit elements are connected to the metal wiring, the multilayer metal wiring is A liquid crystal display device characterized in that at least one layer is constituted by a transparent conductive film forming an electrode of a liquid crystal display element.
JP60093670A 1985-05-02 1985-05-02 Liquid crystal display Expired - Lifetime JP2539360B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60093670A JP2539360B2 (en) 1985-05-02 1985-05-02 Liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60093670A JP2539360B2 (en) 1985-05-02 1985-05-02 Liquid crystal display

Publications (2)

Publication Number Publication Date
JPS61252534A true JPS61252534A (en) 1986-11-10
JP2539360B2 JP2539360B2 (en) 1996-10-02

Family

ID=14088835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60093670A Expired - Lifetime JP2539360B2 (en) 1985-05-02 1985-05-02 Liquid crystal display

Country Status (1)

Country Link
JP (1) JP2539360B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10005010C2 (en) 2000-02-04 2002-11-21 Daimler Chrysler Ag Method and safety restraint for restraining an occupant in a vehicle seat

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158179U (en) * 1983-04-07 1984-10-23 三洋電機株式会社 liquid crystal display device
JPS59201085A (en) * 1983-04-30 1984-11-14 富士通株式会社 Drive circuit element mounting structure of flat display panel
JPS60108822A (en) * 1983-11-18 1985-06-14 Alps Electric Co Ltd Terminal connecting method of liquid crystal display element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158179U (en) * 1983-04-07 1984-10-23 三洋電機株式会社 liquid crystal display device
JPS59201085A (en) * 1983-04-30 1984-11-14 富士通株式会社 Drive circuit element mounting structure of flat display panel
JPS60108822A (en) * 1983-11-18 1985-06-14 Alps Electric Co Ltd Terminal connecting method of liquid crystal display element

Also Published As

Publication number Publication date
JP2539360B2 (en) 1996-10-02

Similar Documents

Publication Publication Date Title
KR100321883B1 (en) Structure and method of mounting semiconductor device and liquid crystal display device
US7087987B2 (en) Tape circuit substrate and semiconductor chip package using the same
JPH0540274A (en) Liquid crystal device
JPS629642A (en) Manufacture of semiconductor device
US4283118A (en) Liquid crystal display with a substrate carrying display electrodes and integrated circuit chip connected thereto
JP3202525B2 (en) Electric circuit board and display device having the same
JPH0432541B2 (en)
US7279794B2 (en) Semiconductor device and electronic device, and methods for manufacturing thereof
JP2539360B2 (en) Liquid crystal display
JPH0325419A (en) liquid crystal display device
JPH01235922A (en) Liquid crystal display device
JP3601455B2 (en) Liquid crystal display
JPH02259728A (en) Liquid crystal display device
JPH06110071A (en) Liquid crystal display device
JPH04217228A (en) Liquid crystal display device
US6720205B2 (en) Electronic device and method of manufacturing the same, and electronic instrument
JPH04242939A (en) Packaging structure of semiconductor device and its manufacture
JPS62161187A (en) Liquid crystal display unit
JP3987288B2 (en) Semiconductor element mounting structure and liquid crystal display device
JP2003007749A (en) Integrated circuit and display
JP3113669B2 (en) Liquid crystal display
JP3272772B2 (en) Liquid crystal device
JPH04177224A (en) Liquid crystal display device
JPH04338599A (en) Mounting board and mounting structure thereof
JP2007042868A (en) Semiconductor device

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term