JPS62161187A - Liquid crystal display unit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to the structure of a liquid crystal display device.

[Ni-rice technology]

The liquid crystal panel and integrated circuit of a conventional liquid crystal display device (hereinafter referred to as L8)
The connection between the terminals (abbreviated as "Vs") is made by placing the LB process on the substrate that makes up the liquid crystal panel, and then using a thin wire such as a gold wire to plate the board with gold. T.J.
Terminal for outputting the bow to the outside on Bx (abbreviated as pad)
A method using wire bonding was used to connect the two.

[Problem that the invention seeks to solve]

However, the above-mentioned conventional technology "C:it" requires the use of high-purity gold wire, high-purity gold plating on the terminals on the board, aluminum evaporation, etc., and the cost of materials is high. Wire bonding connects one wire at a time, so while the number of I-rads for a 1ffiu TiB process is now over 100 for a liquid crystal 1-recommended LSI, it is difficult to connect a 1l11i1 L8 process. This increases the amount of time required for implementation, leading to an increase in implementation costs.

Although the pitch between the nodes is becoming finer due to the increase in the number of rads in the LEi process, it is structurally difficult to make a wire bonding device compatible with pads having a pitch of 200 μgrL or more.

Therefore, the present invention aims to solve these problems.
The purpose is to avoid using expensive precious metals and to
Preventing the increase in implementation costs due to the increase in the number of pads on SI,
In addition, by easily responding to the miniaturization between pads, it is possible to reduce the cost of the product, and to reduce the number of LSIs used in the product by increasing the size of the LSI and increasing the number of pads. , to make it more compact.

[Means for solving problems]

In the liquid crystal display device of the present invention, an LSI pad for driving the liquid crystal panel is provided on at least one substrate of the liquid crystal panel consisting of two substrates sandwiching a liquid crystal layer of gold, which constitutes the entire liquid crystal display device. A protrusion with at least a conductive surface is formed at the position where the protrusion is to be connected, and a conductive adhesive is applied on the protrusion, so that the terminal on the board and the pad of the LSI are matched and bonded. All features are as follows.

[Function] According to the above structure of the present invention, the protrusions, at least the surface of which is conductive, formed on the substrate in which the liquid crystal panel is housed in the groove are connected to the L-chip via a conductive adhesive. is connected to the pad.

[Implementation row 1] In the following, the present invention will be described based on implementation series.

FIG. 1 shows an embodiment of the present invention, and shows a cross section of a connection part between a substrate constituting a liquid crystal panel and an LSI circuit.

1 is a LE chip with the active surface facing downward. 2
These are two substrates (1) that sandwich a liquid crystal layer constituting a liquid crystal panel. In this implementation row, glass or transparent plastic is used entirely, and 3 is a protrusion, which is formed at a position corresponding to a pad 4 for external extraction formed on the active surface of the LSI chip 1. pad 4
Since the size of the pad is 120 .mu.m square, the protrusion 3 is 80 to 100 .mu.m, which is one size smaller than the pad, considering the percentage error in alignment. The height of the protrusion 3 differs depending on the level of passivation @ 5 that determines the active surface of the LSI chip 1 used, but in this implementation, the height of the passivation 5 is 3.
.mu.m, so the height of the protrusion 3 is set at t-4 .mu.m to 8 .mu.m. The protrusions 3 may be made of either an insulating material or a conductive material, but the present embodiment column "C" is made of photosensitive polyimide.

Reference numeral 6 indicates that the electrode is integrally formed with the display panel of the liquid crystal panel, and is made of a transparent electrode made of indium oxide, tin oxide, etc. with a current of about 1000 to 5000 A. If necessary, you can plate with m4 etc. on top of this.
A pattern is created so as to cover the top of protrusion 3. 7
with conductive adhesive.

insulation! l: Among all the adhesives shown, 1 g of highly elastic plastic with a heavy seam ratio of 5 to IO% and a diameter of 3 to 10 μm.
17) Ball O A mixture of balls whose surfaces are plated with metal to make them conductive, and exhibits conductivity only in the thickness direction.

By using an anaerobic Q adhesive as the adhesive, the LSI chip 1 and the substrate 2 are brought into close contact and fixed. Also, as in this example row, the substrate 2° protrusion 3. and 1
Since 0 is transparent, it is possible to use an ultraviolet curable fi-Xif agent or to use a thermoplastic or thermosetting adhesive to bond the LE3LSI chip 1. Since this adhesive 7 exhibits conductivity only in the thickness direction, it is not necessary to selectively apply 1c only to the pad 4 portion, and it may be applied to the entire surface.

This adhesive 7 can electrically connect the LSI chip ICI pad 4 and the electrode on the substrate 2, and
The LEI chip 1 can also be fixed onto the substrate 2 mechanically.

[Implementation row 2] FIG.
It is dented by ~2 μm. This allows the conductive sphere in the adhesive 7 to be stably housed between the electrode 6 and the pad 4.

[Implementation row 3] In Fig. 3 μ implementation row 1, a slope was formed on the ht plate 2 soil, and about 60 to 70% by weight of metal particles or metal-plated plastic balls were added. The protrusions 3 are formed by mixing the resin. As a method of formation, it may be formed by printing or photo-etching using a photosensitive resin. By this method, the protrusion 4 is formed after the electrical shield 6 is formed, which facilitates manufacturing. Ta.

[Implementation row 4] In the i+x row 1, the protrusions 8 are formed by attaching them to a molten solder bath, and the solder resist 9 is printed or photo-etched in advance to form the protrusions 8 with solder. It is removed after being applied to the solder bath.

This facilitates formation of the protrusion 8.

[Run 5] In row 1, the protrusions 8 are formed by gold plating, and the resist 10 is printed or photo-etched in advance to limit the plated portions.

〔Effect of the invention〕

Because of the structure described above, there is no need for precious metals such as gold or vapor deposition, and regardless of the number of pads on LSI 1, the pads on LSI 1 and protrusions 3 on substrate 2 are simply connected.
■Connection can be made by simply gluing after positioning, reducing mounting costs and reducing the pitch between pads 4 to 2.
00 μm or less, it is possible to increase the number of pads without increasing the size of LSI 1, and the number of L8 processes 1 used can be reduced by t-%, making it possible to reduce costs. .

[Brief explanation of drawings]

FIG. 1 is a sectional view of the #1 row of the liquid crystal display device of the present invention. 2 to 5 are diagrams showing other implementations of the liquid crystal display device of the present invention. Applicant: Seiko Epson Aji Shiki Co., Ltd.

Claims (1)

[Claims] A drawer to the outside formed on an active surface of an integrated circuit element that drives the liquid crystal panel on at least one of the two substrates of a liquid crystal panel that sandwiches a liquid crystal layer constituting a liquid crystal display device. forming a projection having at least a conductive surface at a position corresponding to the terminal for the
A liquid crystal display device characterized in that the protrusion and the end of the integrated circuit element are bonded to each other in a corresponding manner via a conductive adhesive layer.