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JPS61248530A - Wire-bonding - Google Patents

Wire-bonding

Info

Publication number
JPS61248530A
JPS61248530A JP60088810A JP8881085A JPS61248530A JP S61248530 A JPS61248530 A JP S61248530A JP 60088810 A JP60088810 A JP 60088810A JP 8881085 A JP8881085 A JP 8881085A JP S61248530 A JPS61248530 A JP S61248530A
Authority
JP
Japan
Prior art keywords
bonding
wire bonding
pellets
wire
information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60088810A
Other languages
Japanese (ja)
Inventor
Masayoshi Yamaguchi
政義 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60088810A priority Critical patent/JPS61248530A/en
Publication of JPS61248530A publication Critical patent/JPS61248530A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to significantly improve the working efficiency of wire- bonding by a method wherein, when the wire-bonding is performed on a hybrid substrate with plural kinds of mounted semiconductor pellets, information on bonding of the pellets, which are memorized in advance in the same memory medium, are selected and a continuous bonding is performed based on the information. CONSTITUTION:Plural pellets, such as the first kind of an IC pellet 2 and the second kind of an IC pellet 3, and printed wirings 8 to be connected to these IC pellets 2 and 3 are mounted on a printed circuit substrate 1, this substrate 1 is housed in a square-type container 4 with the mutually opposed two sides 5 and 6, through which external leads 7 respectively pierce, and the substrate 1 is connected to the container 4 using wires (a). In this constitution, information on the bonding positions of the pellets 2 and 3, the program of the bonding procedures, information on bonding of the wirings 8 and the leads 7 and so forth are memorized in the floppy disc and these are made to do self-teaching in the pellets, the wirings and the leads and a wire-bonding is performed on the substrate with the mounted pellets. By such a way, the wire-bonding can be performed at a higher speed and the working efficiency thereof is improved.

Description

【発明の詳細な説明】 〔発明の技術分計〕 こあ発明はハイブリッド基板のワイヤボンディング方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Summary of the Invention] The present invention relates to a wire bonding method for a hybrid substrate.

〔発明の技術的背景および問題点〕[Technical background and problems of the invention]

リードフレームにダイボンディングされた半導体ペレッ
トの電極端子と、リードフレームの端子とを全自動ワイ
ヤボンディングするには、準備として最初に当該半導体
ペレットの電極端子におけるボンディング位置通常は当
該を漸の中心と、リードフレームのボンディング位置と
をセルフティーチングしたのち、予め記憶された全自動
ワイヤボンディングプログラムに従って多数のリードフ
レームについてワイヤボンディングすることは当業者に
おいて周知である。このようにリードフレームのワイヤ
ボンディングの場合には一種の半導体ペレットがダイボ
ンディングされているので、−リードフレーム単位につ
いて、一枚の７０ツピーデイスクで連続してワイヤボン
ディングすることができた。ところが゛、最近印刷回路
基板に複数種の半導体ペレットがダイボンディングされ
たハイブリッド基板についての全自動ワイヤボンディン
グが要望されている。この印刷基板は２〜３ｆ！１の半
導体ペレットから数十種、数百種の半導体ペレットを取
着するものなどがあり、これらのワイヤボンディングが
要望されている。これらのワイヤボンディングは従来、
半導体ペレットの種類別に全自動ワイヤボンディングプ
ログラムを入力し、一枚の回路基板のワイヤボンディン
グを実行するのに、半導体ペレットの種類だけフキζ−
・ディスクを用意し、順次７０ツビーデイスクを交換し
て一枚の回路基板のワイヤボンディング作業を行ってい
た。In order to perform fully automatic wire bonding between the electrode terminal of the semiconductor pellet die-bonded to the lead frame and the terminal of the lead frame, first, as a preparation, the bonding position on the electrode terminal of the semiconductor pellet is usually set at the center of the wire, It is well known to those skilled in the art to self-teach the bonding positions of lead frames and then wire bond a large number of lead frames according to a fully automatic wire bonding program stored in advance. In the case of lead frame wire bonding, since a type of semiconductor pellet is die-bonded, it was possible to continuously wire bond each lead frame using one 70-tip disk. However, recently there has been a demand for fully automatic wire bonding for hybrid boards in which multiple types of semiconductor pellets are die-bonded to printed circuit boards. This printed circuit board is 2~3F! There are devices that attach one semiconductor pellet to several dozen or even hundreds of types of semiconductor pellets, and wire bonding for these is in demand. Traditionally, these wire bonding
To perform wire bonding on one circuit board by inputting a fully automatic wire bonding program for each type of semiconductor pellet, only the type of semiconductor pellet is required.
・We prepared disks, replaced the 70-tube disks one by one, and performed wire bonding work on one circuit board.

即ち、一種類の半導体ペレットについて、予め定められ
た数量例えば数百枚、数十枚の半導体ペレットについて
ワイヤボンディングしたのち、他の種類の半導体ペレッ
トのワイヤボンディングを実行し、印刷回路に取着され
た半導体ペレットの種類数だけ繰返しワイヤボンディン
グしていた。That is, after wire bonding is performed on a predetermined number of semiconductor pellets of one type, for example, hundreds or tens of semiconductor pellets, wire bonding is performed on other types of semiconductor pellets, and the semiconductor pellets are attached to a printed circuit. Wire bonding was repeated as many times as there were different types of semiconductor pellets.

しかしながら、このようなワイヤポンディング方フテイ
ーチングのためにオペレータの拘束時間が長くなり、オ
ペレーター人当りの持ち分のワイヤボンディング数にも
限界が生じ、さらにワイヤボンディング作業も長時間か
かるなど高速化を含めた省力化が要望されていた。However, due to this type of wire bonding method, the operator is tied up for a long time, and there is a limit to the number of wire bonding operations that each operator can handle.Furthermore, the wire bonding work takes a long time, making it difficult to increase the speed. There was a demand for labor savings including:

また、半導体ペレットの種類が多くなると、さらに拘束
時間が長くなるばかりでなく、フロッピーディスクの枚
数が多くなると、その管理もわずられしいなど散着が要
望されていた。Furthermore, as the number of types of semiconductor pellets increases, not only does the binding time become longer, but when the number of floppy disks increases, it becomes difficult to manage them, so scattering is required.

〔発明の目的〕[Purpose of the invention]

この発明は上記点に対処してなされたもので、ハイブリ
ッド基板の全自動ワイヤボンディング作業を実行する際
のセルフティーチングの回数を減少させ、ワイヤボンデ
ィング工程を高速化ならしめたワイヤボンディング方法
を提供するものである。The present invention has been made in view of the above-mentioned problems, and provides a wire bonding method that reduces the number of self-teaching operations when performing fully automatic wire bonding work for hybrid boards and speeds up the wire bonding process. It is something.

〔発明の概要〕[Summary of the invention]

すなわち、複数種の半導体ペレットが取着されたハイブ
リッド基板のワイヤボンディングに際し、予め同一記憶
媒体に記憶された、上記複数種の半導体ペレットのボン
ディング情報により、上記ハイブリッド基板に取着され
た少なくとも２種の半導体ペレットについて連続して全
自動ワイヤボンディングするワイヤボンディング方法を
得るものである。That is, when wire bonding a hybrid substrate to which multiple types of semiconductor pellets are attached, at least two types of semiconductor pellets attached to the hybrid substrate are bonded using bonding information of the plurality of types of semiconductor pellets stored in the same storage medium in advance. The present invention provides a wire bonding method for continuous and fully automatic wire bonding of semiconductor pellets.

〔発明の実施例〕[Embodiments of the invention]

次に本発明方法を２種類のＩＣペレットがダイボンディ
ングされたハイブリット基板のワイヤボンディングに適
用した実施例を図面を参照して説明する。Next, an embodiment in which the method of the present invention is applied to wire bonding of a hybrid substrate on which two types of IC pellets are die-bonded will be described with reference to the drawings.

印刷配線された印刷回路基板（１）に第１の種類の第１
のＩＣペレット（２）と第２の種類の第２のＩＣペレッ
ト（３）をダイボンディング装置によりダイボンディン
グする。この２種類のＩＣペレット（２）　（３）がダ
イボンディングされた印刷回路基板（１）をパッケージ
（４）内に固着する。このパッケージ（４）はワイド（
７）が植設されている〇 この全自動ワイヤボンディング装置によるワイヤボンデ
ィングは次のようにして行なわれる。a first type of a first type on a printed circuit board (1) with printed wiring;
The IC pellet (2) of the second type and the second IC pellet (3) of the second type are die-bonded using a die-bonding device. The printed circuit board (1) to which these two types of IC pellets (2) and (3) are die-bonded is fixed in the package (4). This package (4) is wide (
7) is implanted. Wire bonding using this fully automatic wire bonding apparatus is performed as follows.

すなわち、第１および第２のＩＣＣペッツ（２）（３）
の全自動ワイヤボンディングのための情報、例えばボン
ディング位置情報やボンディング手順のプログラムなど
ソフトがワイヤボンディング装置の同一記憶装置、例え
ばフロッピーディスクＱυに記憶する。この実施例では
、さらに印刷配線（８）と外部リード（力とのワイヤボ
ンディングのための情報も記憶する。この７０ツビーデ
イスクｃ！９をワイヤボンディング装ｆｌｌ（２）にセ
ットしてワイヤボンディング作業を開始する。ボンディ
ング作業に先き立って、第１起因に示めすようなワイヤ
ボンディング位置のセルフティーチングを実行する。即
ち、第１のＩＣペレット（２）の各ボンディング位置お
よび印刷配線のボンディング位置とのティーチングそし
て印刷配線（８）のボンディング位置と外部リード（７
）のボンディング位置とのティーチングを実行する。こ
のティーチング作業は作業者によりエレクトロニックチ
ェスマンを操作してボンディング手順の順序にティーチ
ングすることは当事者において周知である。このセルフ
ティーチング作業後、全自動ワイヤビンディングを実行
する。このワイヤボンディング作業は例えば第１のＩＣ
ペレット（２）と印刷配線（８）とのワイヤボンディン
グ後、第２のＩＣＣペッツ　（３）と印刷配線（８）と
のワイヤボンディングを実行する。次に印刷配線（８）
と外部リード（力とのワイヤボンディングを順次実行し
て−パッケージのワイヤボンディングを終了し、次のパ
ッケージワイヤメンディングを実行する。That is, the first and second ICC Pez (2) (3)
Information for fully automatic wire bonding, such as bonding position information and bonding procedure programs, is stored in the same storage device of the wire bonding apparatus, such as a floppy disk Qυ. In this embodiment, information for wire bonding between the printed wiring (8) and the external lead (force) is also stored. This 70-tube disk C!9 is set in the wire bonding equipment flll (2) and wire bonding is performed. Prior to the bonding operation, self-teaching of the wire bonding positions as shown in the first cause is performed. That is, each bonding position of the first IC pellet (2) and the bonding position of the printed wiring are Teaching and bonding position of printed wiring (8) and external lead (7)
) with the bonding position. It is well known in the art that this teaching work involves an operator operating an electronic chessman to teach the order of the bonding procedure. After this self-teaching work, fully automatic wire binding is performed. This wire bonding work is performed, for example, on the first IC.
After wire bonding between the pellet (2) and the printed wiring (8), wire bonding is performed between the second ICC PETZ (3) and the printed wiring (8). Next, print wiring (8)
and external leads (force) sequentially - finish the wire bonding of the package, and perform the next package wire bonding.

この様子は第１図に示す通りである。このワイヤボンデ
ィングの装置は当業者において周知であり説明するまで
もないが、例えば第２図に示めす通りである。すなわち
、第１および第２のＩＣ￥￥Ｌ／ット（２）　（３）が
ダイビンディングされたハイブリッド基板（１）を有す
るパッケージ（５）をキャリヤ（至）上に載置して多数
マガジン（至）に収納する。This situation is shown in FIG. This wire bonding apparatus is well known to those skilled in the art and need not be described, but is shown, for example, in FIG. That is, the package (5) having the hybrid substrate (1) to which the first and second ICs (2) and (3) are die-bound is placed on a carrier and a large number of magazines are assembled. Store in (to).

このマガジン（財）からマイクロコンピュータ（ハ）の
制御に基づき搬送ベルト（ハ）により、ボンディング位
置に搬送され、停止する。このボンディング位置には、
モータ例えばりニアモータ＠（ハ）によりＸ軸方向Ｙ軸
方向に移動するＸ−Ｙテーブル翰（至）上には２軸方向
に移動するボンディングツールＧｌ）およびボンディン
グ位置認識のためのＩＴＶカメラ８２が固定される。即
ち、上記マイクロコンピュータ器の制御により、ボンデ
ィングツール０１）を予め７０ツピ今デイスク（２υに
記憶された上記プログラムに応じた制御を実行し、ボン
ディングツール（３］）によりワイヤボンディングを実
行する。The magazine is conveyed to the bonding position by a conveyor belt (c) under the control of a microcomputer (c) and stopped. This bonding position has
A bonding tool Gl) that moves in two axes and an ITV camera 82 for recognizing the bonding position are mounted on an X-Y table that moves in the X-axis and Y-axis directions by a motor such as a near motor (c). Fixed. That is, under the control of the microcomputer, the bonding tool 01) is controlled in accordance with the program stored in the 70-piece disk (2υ) in advance, and the bonding tool (3) executes wire bonding.

このボンディング、搬送ベルトＧ３によりマガジン０内
に搬出すると共に、次のパツケ゛−ジ（５）をボンディ
ング位置に搬入する。After this bonding, the conveyor belt G3 transports the package into the magazine 0, and at the same time transports the next package (5) to the bonding position.

このようにして、複数種のＩＣについて一度のセルフテ
ィーチングで連続してワイヤボンディング実行できるの
で、長い調整時間が、かかるセルフティーチングについ
て回数を減少でき、さらに繰り返しセットする準備作業
も曲数を減少できるので実質的に大幅な高速ワイヤボン
ディングが可能である。In this way, wire bonding can be performed continuously for multiple types of ICs with a single self-teaching process, so the long adjustment time can be reduced, and the number of self-teaching steps can be reduced, and the number of preparatory tasks for repeated settings can also be reduced. Therefore, substantially high-speed wire bonding is possible.

上記実施例では一つの印刷配線基板（１）に２種類のＩ
Ｃペレットについて各１個づつワイヤボンディングする
例について説明したが、種類は２種類以上何種類のＩＣ
でもよいことは説明するまでもないことである。特に一
つの印刷回路基板について機能が多くなると＠造メーカ
の異なるペレットが混在することになるが、この場合も
上記実施例と同様な手順でワイヤボンディングできる効
果かある二さらに上記実施例では一つの印刷回路基板に
ついて２種類のＩＣペレット２個１度に連続してワイヤ
ボンディングした例について説明したが、数が増えた場
合例えば数十種のＩＣペレットについてワイヤボンディ
ングする場合、フロッピーディスクを例えば２０刊づつ
２枚に分けて記憶してもよい。In the above embodiment, two types of I on one printed wiring board (1)
We have explained an example of wire bonding one C pellet each, but there are two or more types of ICs.
But the good thing is that there is no need to explain it. In particular, when a single printed circuit board has many functions, pellets from different manufacturers will coexist, but in this case as well, wire bonding can be performed using the same procedure as in the above embodiment.2Furthermore, in the above embodiment, one We have explained an example of wire bonding two types of IC pellets at once for a printed circuit board, but when the number increases, for example, when wire bonding several dozen types of IC pellets, it is possible to wire bond 20 types of floppy disks, for example. It may also be stored in two separate sheets.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明方法によればワイヤボンディ
ングの稼動率を大幅に向上でき、ワイヤボンディング工
程の高速化が達成できる効果がある。As explained above, according to the method of the present invention, the operating rate of wire bonding can be greatly improved, and the wire bonding process can be speeded up.

【図面の簡単な説明】[Brief explanation of drawings]

第１図ＣＡ）ＣＢ）は、本発明方法の実施例を説明する
ためのパッケージ型ＩＣのワイヤボンディング説明図、
第２図は第１図のワイヤボンディングを説明するための
ワイヤボンディング装置説明図であるＯ １・・・印刷配線基板、２．３・・・ＩＣペレット、８
・・・印刷配線FIG. 1 CA) CB) is an explanatory diagram of wire bonding of a packaged IC for explaining an embodiment of the method of the present invention;
FIG. 2 is an explanatory diagram of a wire bonding apparatus for explaining the wire bonding shown in FIG. 1. 1...Printed wiring board, 2.3...IC pellet, 8
・・・Printed wiring

Claims (3)

【特許請求の範囲】[Claims] （１）複数種の半導体ペレットが取着されたハイブリッ
ド基板のワイヤボンディングに際し、予め同一記憶媒体
に記憶された上記複数種の半導体ペレットのボンディン
グ情報により、ボンディングする該当ペレットの情報を
選択して、上記ハイブリッド基板に取着された少なくと
も２種の半導体ペレットについて連続して全自動ワイヤ
ボンディングすることを特徴とするワイヤボンディング
方法。(1) When wire bonding a hybrid substrate to which multiple types of semiconductor pellets are attached, select the information of the pellet to be bonded based on the bonding information of the multiple types of semiconductor pellets stored in the same storage medium in advance, A wire bonding method characterized in that fully automatic wire bonding is performed continuously on at least two types of semiconductor pellets attached to the hybrid substrate. （２）ハイブリッド基板に取着された全ての半導体ペレ
ットについて連続して全自動ワイヤボンディングする情
報は１つの記憶装置に記憶することを特徴とする特許請
求の範囲第１項記載のワイヤボンディング方法。(2) The wire bonding method according to claim 1, wherein information for continuous, fully automatic wire bonding of all semiconductor pellets attached to the hybrid substrate is stored in one storage device. （３）ハイブリッド基板に取着された全ての半導体ペッ
トについての全自動ワイヤボンディングはマイコン制御
により実行することを特徴とする特許請求の範囲第１項
記載のワイヤボンディング方法。(3) The wire bonding method according to claim 1, characterized in that fully automatic wire bonding for all semiconductor pets attached to the hybrid board is executed under microcomputer control.
JP60088810A 1985-04-26 1985-04-26 Wire-bonding Pending JPS61248530A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60088810A JPS61248530A (en) 1985-04-26 1985-04-26 Wire-bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60088810A JPS61248530A (en) 1985-04-26 1985-04-26 Wire-bonding

Publications (1)

Publication Number Publication Date
JPS61248530A true JPS61248530A (en) 1986-11-05

Family

ID=13953245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60088810A Pending JPS61248530A (en) 1985-04-26 1985-04-26 Wire-bonding

Country Status (1)

Country Link
JP (1) JPS61248530A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215940A (en) * 1990-02-05 1993-06-01 Orcutt John W Wire looping method during wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215940A (en) * 1990-02-05 1993-06-01 Orcutt John W Wire looping method during wire bonding

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