JPS61245544A - Tool for gang bonding - Google Patents
Tool for gang bondingInfo
- Publication number
- JPS61245544A JPS61245544A JP8703085A JP8703085A JPS61245544A JP S61245544 A JPS61245544 A JP S61245544A JP 8703085 A JP8703085 A JP 8703085A JP 8703085 A JP8703085 A JP 8703085A JP S61245544 A JPS61245544 A JP S61245544A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- bonding
- gang bonding
- gigantic
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明はギヤングボンディング用ツールの構造に関する
。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to the structure of a gigantic bonding tool.
「発明の概要」
本発明はギヤングボンディング用ツールにおいて、半導
体の電極と接する部分のみを突出させたことにより、ボ
ンディング時に半導体表面圧キズがつかないようにした
ものである。"Summary of the Invention" The present invention provides a gigantic bonding tool in which only the portion of the semiconductor in contact with the electrode is protruded, thereby preventing semiconductor surface pressure scratches during bonding.
「従来の技術」
従来のボンディング用ツールの構造は、第２図の様にボ
ンディング部が平面であった。"Prior Art" In the structure of a conventional bonding tool, the bonding part was flat as shown in FIG.
「発明が解決しようとする問題点及び目的」しかし、前
述の従来技術ではボンディング時に半導体表面とツール
との間隔が狭い為、半導体表面にキズをつけるという問
題点を有する。"Problems and Objects to be Solved by the Invention" However, the above-mentioned prior art has the problem of scratching the semiconductor surface because the distance between the semiconductor surface and the tool is narrow during bonding.
そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは半導体表面にキズをつけないボン
ディング用ツールを提供するところにある。The present invention is intended to solve these problems, and its purpose is to provide a bonding tool that does not damage the semiconductor surface.
「問題点を解決するための手段」
本発明のギヤングボンディング用ツールは、半導体の電
極と接する部分のみ全突出させたことを特徴とする。"Means for Solving the Problems" The gigantic bonding tool of the present invention is characterized in that only the portion that contacts the semiconductor electrode is fully protruded.
「実施例」
第１図は本発明の実施例におけるギヤングボンディング
用ツールの断面図であって、半導体の電極と接する部分
のみを突出させたことにより、半導体表面とツールのボ
ンディング面との間隔が広くなり、半導体表面に異物が
あってもボンディング時に押しつけてキズをつけること
がなくなる。Embodiment FIG. 1 is a cross-sectional view of a gigantic bonding tool according to an embodiment of the present invention, and by protruding only the part that contacts the semiconductor electrode, the distance between the semiconductor surface and the bonding surface of the tool is increased. This makes it possible to prevent foreign objects from pressing against the surface of the semiconductor and causing scratches during bonding.
「発明の効果」
以上述べたように発明によれはギヤングボンディング用
ツールを半導体の電極と接する部分のみを突出させるこ
とにより、ボンディング時に半導体表面にキズがっかな
いという効果を有する。"Effects of the Invention" As described above, the present invention has the effect that the semiconductor surface is not scratched during bonding by protruding only the portion of the gigantic bonding tool that contacts the semiconductor electrode.
第１因は本発明のギヤングボンディング用ツールの一実
施例を示す主要断面図。
第２図は従来のギヤングボンディング用ツールを示す主
要断面図。
第６図は第１図の平面図。
１・・・・・・突出部
以上The first factor is a main sectional view showing an embodiment of the gigantic bonding tool of the present invention. FIG. 2 is a main sectional view showing a conventional gigantic bonding tool. FIG. 6 is a plan view of FIG. 1. 1... More than the protruding part
Claims (1)
するギャングボンディング用ツール。A gang bonding tool characterized by protruding only the part that contacts the semiconductor electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8703085A JPS61245544A (en) | 1985-04-23 | 1985-04-23 | Tool for gang bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8703085A JPS61245544A (en) | 1985-04-23 | 1985-04-23 | Tool for gang bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61245544A true JPS61245544A (en) | 1986-10-31 |
Family
ID=13903552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8703085A Pending JPS61245544A (en) | 1985-04-23 | 1985-04-23 | Tool for gang bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61245544A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5349317A (en) * | 1992-04-03 | 1994-09-20 | Mitsubishi Denki Kabushiki Kaisha | High frequency signal transmission tape |
-
1985
- 1985-04-23 JP JP8703085A patent/JPS61245544A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5349317A (en) * | 1992-04-03 | 1994-09-20 | Mitsubishi Denki Kabushiki Kaisha | High frequency signal transmission tape |
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