JPS61134186A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To obtain a solid-state image pickup device mounted by a miniaturized image pickup lens by a simple method by adhering and fixing integrally the image pickup lens on the photosensitive surface of a solid-state image pickup element. CONSTITUTION:At the side of the photosensitive surface of the solid-state image pickup element 11 the image pickup lens 26 is directly adhered and fixed so as to be laminated through a transparent adhesive 27. Thus the photosensitive surface of the solid-state image pickup element 11 does not directly touch outside air, and protection and airtighness can be obtained. In said state, a resin 25 is filled so as to burry a bonding wire 23 in a space between a ceramic substrate 21, the solid-state image pickup element 11 and the image pickup lens 26. In such a way the protection of the bonding wire 23 and the airtightness of the solid-state image pickup element 11 can be obtained, and the density of each element can be secured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a solid-state imaging device, and particularly to an improved sealing and optical system structure of the solid-state imaging device.

[Technical background of the invention]

Conventional solid-state imaging devices have COD (
A charge-coupled device) resistor, a solid-state image sensor in which a photosensitive element is arranged two-dimensionally, a ceramic package that houses it, an opening in this hole, and a glass plate that seals the photosensitive surface side of the solid-state image sensor. Consists of. Furthermore, a separate imaging lens is prepared in order to guide an optical image from a subject to the photosensitive surface side of the surface-shaped imaging device. In the case of television cameras, a zoom lens is usually used, which is large in size and heavy, so a mechanical screw is installed in the lens frame, and a standard screw called C mount is used for solid-state imaging devices. Integration with the holder is performed.

[Problems with background technology]

However, in recent years, there has been a demand for ultra-miniaturization of television cameras, but the conventional systems described above have reached their limits. In addition, since the imaging lens is mechanically arranged separately, mounting accuracy and component precision are required to align the optical axes of the imaging lens and solid-state image sensor to ideal and accurate positions, which increases manufacturing costs. Don't get too expensive. Moreover, especially with the conventional structure, it is impossible to make something ultra-small like an endoscopic camera.

[Purpose of the invention]

The present invention was made in order to cope with the above-mentioned circumstances, and an object of the present invention is to provide a solid-state imaging device equipped with an ultra-small imaging lens using a simple method.

[Summary of the invention]

For example, as shown in FIG.
6 is integrated with the substrate 2Z, and the imaging lens 26 is laminated on the photosensitive surface of the solid-state image sensor 1z housed in the substrate 21, thereby achieving the above object.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, and 11 is a CCD solid-state image sensor. As shown in FIG. 2 in plan view, this solid-state image sensor Z1 has a photosensitive surface (imaging surface) 12 at the center of the semiconductor chip, and around this is a sensor 4 for projecting a number of electrodes to the outside. Tudo I3 is arranged. This solid-state image sensor 11 is placed on the bottom surface of a package-type ceramic substrate 21 with the photosensitive surface facing toward the opening of the package, and is fixed with an adhesive 22. A large number of pads 24 for leading out electrodes are provided on the peripheral frame of the ceramic substrate 24 in correspondence with the pumping pads 13 of the solid-state imaging device 11. And the corresponding solid-state image sensor 11
The pad 13 of and the pad 24 of the ceramic substrate 21 are
It is connected by a bonding wire 23 made of aluminum or gold.

Next, an imaging lens 26 is directly adhesively fixed to the photosensitive surface side of the solid-state imaging device 11 via a transparent adhesive 27 so as to be laminated thereon. Accordingly, the photosensitive surface of the solid-state image sensor 11 is protected and airtight without coming into direct contact with the outside air. In this state, the resin 25 is further inserted into the gap created between the ceramic substrate 2 and the solid-state image sensor 11 and the image sensor lens 26 so that the bonding wire 23 is buried therein.
is filled. As a result, protection of the sanding wire 23 and airtight sealing of the solid-state image sensor 1 can be obtained, and each element can also be tightly fixed.

In the above embodiment, the substrate 21 is of a package type, but the substrate 2 has at least a housing section for the solid-state image sensor 1, and a storage section A? It is sufficient that there is a part where the rad 4 is to be provided, and the end part (as shown by the dotted line 28 in FIG. It may be configured as follows. This allows the device to be made more compact.

Further, as the material for the substrate 21, other than ceramic, a resin substrate, a metal substrate, etc. may be used.

Further, in the above embodiment, the imaging lens 26 is directly bonded onto the solid-state imaging device 11, but an air layer may be provided between the imaging lenses 26 and 11. This allows the lower layer of the imaging lens to have a different refractive index depending on whether it is air or adhesive, and the difference in refractive index may be corrected depending on the characteristics of the lens design. Furthermore, although the imaging lens has been described as a single lens, it may be configured as a group of three to five lenses. Further, in order to reduce the thickness in the thickness direction, it can be flattened using a cylindrical lens or the like.In short, it may be formed using a material that has a lens effect that allows an optical image to be obtained.

In addition, the aperture of the lens does not necessarily have to cover the entire photosensitive surface, but only needs to be able to cover part or all of the photosensitive surface.
It is sufficient if the lens portion corresponds to the center position. Furthermore, although it has been described that only the imaging lens 26 is provided directly on the photosensitive surface of the solid-state imaging device, in the case of a color solid-state imaging device, various optical components may be inserted into the optical system.

Namely, there are a color filter array, a crystal plate as an optical low-pass filter, a color correction filter, etc., but these may be integrated with the imaging lens 26. Further, a color filter array may be provided in advance on the photosensitive surface of the solid-state image sensor.

〔Effect of the invention〕

As described above, according to the present invention, there is no need to separately assemble the imaging lens by mechanical means, and the imaging lens
Because it is held and fixed on a substrate, this solid-state imaging device has an effective effect in creating an ultra-small television camera.It is used by being swallowed into the body because it is equipped with an imaging lens for condensing light. This is particularly effective for endoscope cameras such as In this case, the solid-state imaging device has an ultra-small external shape and is sealed, so that the photosensitive surface and the like are not soaked with moisture inside the body, improving reliability.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view of a solid-state image sensor. 11... Solid-state image sensor, 21... Ceramic substrate,
22... Adhesive, 23... Dending wire, 2
6...Imaging lens.

Claims (2)

[Claims] (1) A solid-state imaging device characterized in that an imaging lens is integrally adhesively fixed onto a photosensitive surface of a solid-state imaging device. (2) The solid-state imaging device according to claim 1, wherein a color filter array is provided on the photosensitive surface of the solid-state imaging device.