[go: up one dir, main page]

JPS61131532A - Heat treatment device for sheet-like material - Google Patents

Heat treatment device for sheet-like material

Info

Publication number
JPS61131532A
JPS61131532A JP25358184A JP25358184A JPS61131532A JP S61131532 A JPS61131532 A JP S61131532A JP 25358184 A JP25358184 A JP 25358184A JP 25358184 A JP25358184 A JP 25358184A JP S61131532 A JPS61131532 A JP S61131532A
Authority
JP
Japan
Prior art keywords
heat treatment
work
workpiece
endless belt
hot air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25358184A
Other languages
Japanese (ja)
Inventor
Hidetaka Jo
城 英孝
Reiichiro Sensui
泉水 礼一郎
Munenori Ishimi
宗憲 石見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP25358184A priority Critical patent/JPS61131532A/en
Priority to US06/802,468 priority patent/US4693777A/en
Priority to EP85115144A priority patent/EP0187249B1/en
Priority to DE3587830T priority patent/DE3587830T2/en
Publication of JPS61131532A publication Critical patent/JPS61131532A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To perform a uniform heat treatment as well as to contrive improvement in the efficiency of heat treatment by a method wherein an endless belt, having a work conveying function, maintains the work in the state wherein its lower surface comes in contact with a heating plate or in the state approximate to contact, and hot air is blown against the work from above. CONSTITUTION:The work 2, whereon an etching process is finished in an etching chamber 4, is sent to a load lock chamber 5, the work 2 which is brought into an N2 gas chamber 6 is guided into a case 8 from the inserting hole 9 of a heat treatment device 7, and it is conveyed to the upper surface of the endless belt 13 located in the case 8. Then, the work 2 is moved to the endless belt 13 toward a pick-up hole 10. In the meantime, the work 2 is heated up from the lower side of the belt 13 by a heating plate 16, and at the same time, hot air is blown out from the upper surface of the belt, and also hot air blows out from a pipe 19. As a result, the substance grown by chlorine gas is removed and exhausted from an exhaust hole 22. Besides, after heat treatment is performed, the following works are successively conveyed by rotating the endless belt 13 after a heat treatment, and a heat treatment operation is performed continuously.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明はシリコンウェハなどの薄片状シー、ト拐の熱処
理装置に係り、特にドライエツチング後の熱処理に用い
て最適な熱処理装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a heat treatment apparatus for thin sheets and strips of silicon wafers, and more particularly to a heat treatment apparatus suitable for use in heat treatment after dry etching.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

従来から塩素系ガス用いてエツチングを行なうエツチン
グ装置においては、エツチング後に装置よりワークを取
り出した時、ワーク上の塩素系の物質、例えばAlCl
3と大気中の酸素とが反応し、腐蝕が発生する。
Conventionally, in etching equipment that performs etching using chlorine-based gas, when a workpiece is taken out from the equipment after etching, chlorine-based substances such as AlCl on the workpiece are removed.
3 reacts with oxygen in the atmosphere, causing corrosion.

そこでこのような場合の対策として、]ツチング処理後
に電気炉または工業用ドライヤーを臓えたケースの中に
多数のワークを収容したカセットに、カセットごと挿入
して熱処理を行なっている装置がある。
Therefore, as a countermeasure for such cases, there is an apparatus in which the cassette is inserted into a cassette containing a large number of works in a case equipped with an electric furnace or an industrial dryer after the cutting process, and the cassette is then heat-treated.

すなわち、第4図に示すように、ケースaの中に、上下
に仕切る多数孔の穿設された仕切板すを設け、その仕切
板すの上に1カセツトGに収容された多くのワーク6群
を載置し、そしてこのケースaはWeにより密閉できる
ようになっており、ケースaの上部に設けられたドライ
%=−fに、よりワークdを乾燥し、その排気は前記仕
切板すの孔を通過してケースa下部に設りられた排気孔
qより排出されるようになっている。
That is, as shown in FIG. 4, a partition plate with multiple holes is provided in the case a to separate the upper and lower parts, and many works 6 stored in one cassette G are placed on the partition plate. This case a can be sealed with We, and the workpiece d is dried through the dry %=-f provided at the top of the case a, and the exhaust air is passed through the partition plate. It passes through the hole and is discharged from the exhaust hole q provided at the bottom of the case a.

しかしながら、上記の装置によると、ワークはカセット
により部分的に加熱が妨げられているため、ワークの昇
温のためには加熱時間を長くしなければならず、また温
度分布も均一にならないため、後処理の効果にもバラツ
キが生ずるという欠点があった。
However, according to the above-mentioned apparatus, heating of the workpiece is partially prevented by the cassette, so the heating time has to be longer to raise the temperature of the workpiece, and the temperature distribution is not uniform. There was also a drawback that the effects of post-treatment varied.

さらにカセット毎に行なうためバッチ処理方式とならざ
るを得ず、そのためエツチング装置と連結して使用する
ことができない欠点があった。
Furthermore, since the process is carried out for each cassette, a batch process is required, which has the disadvantage that it cannot be used in conjunction with an etching device.

(発明の目的) 本発明はこれに鑑み、ワークの加熱時間を短縮し、しか
も温度分布を均一とするとともにワークの搬送機能を備
え、かつエツチング装置と連結したとき連続自動処理能
力を発揮することができるシート状材料の熱処理装置を
提供して従来技術の欠点の解消を計ることを目的として
なされたちにである。
(Objective of the Invention) In view of this, the present invention aims to shorten the heating time of a workpiece, make the temperature distribution uniform, provide a workpiece conveyance function, and exhibit continuous automatic processing ability when connected to an etching device. The purpose of this work is to provide an apparatus for heat treatment of sheet-like materials capable of overcoming the drawbacks of the prior art.

′孕 4     〔発明の概要〕 上記目的を達成するため本発明においては、箱型に形成
されたケースに、ワークの挿入口を一側に、反対側に取
出口を同一高さ位置に設け、該挿入口から挿入されたワ
ークを取出口へ搬送できるよう上面を前記挿入口および
取出口の下面と一致させた搬送部材を設け、その搬送部
材の上方には、・搬送部材上を移動するワークに近接し
て加熱媒体としての熱風吹き出し部を、下方には前記搬
送部材に近接してワークの加熱板をそれぞれ対向して設
けた構成を特徴とするものである。
4 [Summary of the Invention] In order to achieve the above object, the present invention provides a box-shaped case with a workpiece insertion port on one side and an output port on the opposite side at the same height. A transport member whose upper surface is aligned with the lower surfaces of the insertion port and the removal port is provided so that the workpiece inserted from the insertion port can be transported to the exit port, and above the transport member, the workpiece to be moved on the transport member is provided. The apparatus is characterized by a structure in which a hot air blowing part serving as a heating medium is disposed adjacent to the conveying member, and a heating plate for the workpiece is disposed downwardly adjacent to the conveying member so as to face each other.

5 (発明の実施例〕 以下、本発明を第1図乃至第3図に示す一実施例を参照
して説明する。
5 (Embodiment of the Invention) The present invention will be described below with reference to an embodiment shown in FIGS. 1 to 3.

塩素系ガスを用いてエツチングを行なうエツチング工程
は、その−例を第3図に示すように、カセット状のワー
クケース1に収容されたシート状のワーク2を、大気圧
と真空圧とを交互に切替えるロードロツタ室3に1個ず
つ搬入させ、真空状態に切替ったとき、真空のエツチン
グ室4に導入してエツチング加工を行ない、こ)でエツ
チングが完了すると、導入側とその反対側に設けられた
ロードロック室5に送、られ、こ)で再び真空から大気
圧に切替えられたとき、次のN2ガス室6へ送り込んで
酸化を防止し、その)ち、水洗または加熱等の後処理室
に送られるようになっている。
An example of the etching process in which etching is performed using chlorine-based gas is shown in FIG. The etching process is carried out one by one into the load rotter chamber 3, which is switched to a vacuum state, and then introduced into the vacuum etching chamber 4 for etching. When the pressure is switched from vacuum to atmospheric pressure again, it is sent to the next N2 gas chamber 6 to prevent oxidation, and then undergoes post-treatment such as washing with water or heating. It is now sent to the room.

N2ガス室6は、空気中の水分と反応してワークの腐蝕
を早めることを防止するために設けられる。
The N2 gas chamber 6 is provided to prevent premature corrosion of the workpiece due to reaction with moisture in the air.

本発明にか・るシート状材料の熱処理装置7は1、L記
工程の場合にはそのin工程に設けられるもので、前記
N2ガス室6に接続される。
The heat treatment apparatus 7 for sheet-like materials according to the present invention is provided at the in-step in the case of the steps 1 and L, and is connected to the N2 gas chamber 6.

寸なわら、箱形状に形成されたケース8には、第1図に
おいてその左右方向の同一^ざ位置に、左側にワークの
挿入口9が、右側にワークの取出口10がそれぞれ設け
られている。
The box-shaped case 8 is provided with a workpiece insertion port 9 on the left side and a workpiece ejection port 10 on the right side at the same positions in the left and right direction in FIG. There is.

前記ケース8内には、機枠11を介して軸支された一対
のベルト車12.12があって、このベルト車12.1
2に断面が円形の一対の無端ベルト13.13が幅方向
に所定間隔をおいて巻装され、この巻装された無端ベル
ト13.13の上面のisさは、前記挿入口9および取
出口10の下面と同じ高さとされ、これにより挿入口9
から挿入されたり−ク2は無端ベルト13.13へ搬入
されて取出口10方向へ移送される。
Inside the case 8, there are a pair of belt pulleys 12.12 that are pivotally supported via the machine frame 11.
A pair of endless belts 13.13 having a circular cross section are wound around the 2 at predetermined intervals in the width direction. The height is the same as the bottom surface of the insertion port 9.
The tray 2 inserted from the tray 2 is carried onto the endless belt 13, 13, and is transported in the direction of the outlet 10.

前記ベルト13.13は、モータ14から図示しない駆
動機構を経て回動されるようになっている。
The belt 13.13 is rotated by the motor 14 via a drive mechanism (not shown).

前記機枠11には、絶縁物15を介して加熱板16が取
付けられており、前記巻装された。?!!@ベルト13
.13の上:部裏面に近接しかつその加熱板16の上面
には無端ベルト13上のワーク2との距離をさらに最接
近、またはワーク2ど接触さ   □せるよう無端ベル
ト13.13の径よりも大きい幅の一対の満17.17
が設けられている。そしてこの加熱板16はワーク2を
下面から加熱するようになっている。
A heating plate 16 is attached to the machine frame 11 via an insulator 15, and the heating plate 16 is wrapped around the machine frame 11. ? ! ! @Belt 13
.. Upper part of 13: Close to the back surface of the heating plate 16, and on the upper surface of the heating plate 16, a wire is attached to the endless belt 13, which is closer to the workpiece 2 on the endless belt 13, or closer to the workpiece 2, or closer to the workpiece 2 than the diameter of the endless belt 13. A pair of large widths of 17.17
is provided. This heating plate 16 is designed to heat the workpiece 2 from the bottom surface.

前記無端ベルト13.13の上面に対向する上方には、
別の機枠18を介して支持された加熱媒体としての熱風
の吹き出しtil19が設けてあり、二の内部にはニク
ロム線などのヒータ20が設けられている。前記熱風吹
ぎ出し筒19の下部には吹き出し口21が、ワーク2の
上面に接近して設けられており、これにより前記の吹き
出し筒19内で発生した熱風が、この吹ぎ出し口21よ
り吹ぎ出すことによりワーク2を上面から加熱すること
になる。
On the upper side opposite to the upper surface of the endless belt 13.13,
A hot air blowout til 19 as a heating medium is provided which is supported via another machine frame 18, and a heater 20 such as a nichrome wire is provided inside the tile 19. A blowout port 21 is provided at the bottom of the hot air blowout tube 19 in close proximity to the top surface of the workpiece 2, so that the hot air generated within the blowoff tube 19 is discharged from the blowout port 21. By blowing out the air, the workpiece 2 is heated from the upper surface.

前記ケース8の下面には、外気と接触する排気口22が
下面よ′り突出して設けられている。
The lower surface of the case 8 is provided with an exhaust port 22 that protrudes from the lower surface and comes into contact with the outside air.

つぎに作用について説明する。Next, the effect will be explained.

エツチング工程において、エツチング室4内でエツチン
グ加工を完了したワーク2はロードロック室5内に送ら
れ、こ)からざらにN2ガス室6に入ったワーク2は、
本発明の熱処理装置7の挿入口9よりケース8内に導入
され、ケース8内の無端ベルト13.13の上面上に搬
入される。
In the etching process, the workpiece 2 that has been etched in the etching chamber 4 is sent to the load-lock chamber 5, and the workpiece 2 that has roughly entered the N2 gas chamber 6 from here is
It is introduced into the case 8 through the insertion port 9 of the heat treatment apparatus 7 of the present invention, and is carried onto the upper surface of the endless belt 13, 13 inside the case 8.

こ)でモータ14の回転によりワーク2は無端ベルト1
3.13上を取出口10へ向って移動するが、この間に
ベルト13.13の下面から加熱板16により加熱され
ると同時に、上面からは熱風の吹き出し筒19からの熱
風を吹き付けられる南   ことにJ−り、塩素系ガス
による生成物の除去が行なわれ、その排気は排気口22
より排出される。
With this), the workpiece 2 is rotated by the endless belt 1 due to the rotation of the motor 14.
3.13 The upper part of the belt 13.13 is moved toward the outlet 10, but during this time it is heated by the heating plate 16 from the lower surface of the belt 13.13, and at the same time hot air is blown from the hot air blowing tube 19 from the upper surface. The products are removed using chlorine-based gas, and the exhaust is discharged through the exhaust port 22.
more excreted.

そしてさらに熱処理後は無端ベルト13.13を回転さ
せることにより、後続のワークら順次移送され、熱処理
作業が連続的に行なわれることになる。
Further, after the heat treatment, by rotating the endless belts 13, 13, subsequent works are sequentially transferred, and the heat treatment work is performed continuously.

なお、本実施例においては無端ベルトの断面が円形状の
ものを一対使用した場合についC説明したが、必ずしも
これに限定されるものでなく、角形の場合、さらには一
対でなく1個の幅広の平板状で、長手方向の中央部に適
宜間隔の孔を設けlζものであってもよい。
In addition, in this embodiment, the case where a pair of endless belts with a circular cross section is used is described, but the invention is not necessarily limited to this. It is also possible to have a flat plate shape with holes provided at appropriate intervals in the center in the longitudinal direction.

〔発明の効果〕〔Effect of the invention〕

本発明は以上説明したように構成したので、ワークの下
面を加熱板に接触または接触に近い状態に保持し、上面
からは熱風を吹き付(プることにより短時間にワークを
加熱することができるため均一に熱処理が行なわれ、従
来の欠点であった温度分布の不均一が解消されるととも
に、ワークもエツチング装置と連結して用いることがで
きるのでワークを1個毎に連続的に送ることが可能とな
り、従来のようにまとめて行なうものと違って処即効率
を著しく向上させることができるなどの優れた効果を右
づる。
Since the present invention is configured as described above, the workpiece can be heated in a short time by holding the lower surface of the workpiece in contact with or close to contact with the heating plate and blowing hot air from the upper surface. As a result, heat treatment can be performed uniformly, eliminating the uneven temperature distribution that was a drawback of the conventional method, and since the workpiece can also be used in conjunction with an etching device, it is possible to continuously feed the workpieces one by one. This makes it possible to achieve superior effects such as significantly improving treatment efficiency compared to conventional treatments that are carried out all at once.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明にか)るシート状材料の熱処理装置の一
実施例を示す正面断面図、第2図は第1図の側面断面図
、第3図は本発明を適用したエツチング工程の説明図、
第4図は従来の熱処理装置の斜視図である。 1・・・ワークケース、2・・・ワーク、3・・・ロー
ドロック室、4・・・エツチング室、5・・・ロードロ
ック室、6・・・N2ガス至、7・・・熱処理装置、8
・・・ケース、9・・・挿入口、10・・・取出口、1
3・・・搬送部材、16・・・加熱板、21・・・熱風
の吹き出し部。 出願人代理人  猪  股    清 篇1図 第2図 第3図 篤4図
FIG. 1 is a front cross-sectional view showing an embodiment of the heat treatment apparatus for sheet-like materials according to the present invention, FIG. 2 is a side cross-sectional view of FIG. 1, and FIG. Explanatory diagram,
FIG. 4 is a perspective view of a conventional heat treatment apparatus. 1... Work case, 2... Work, 3... Load lock chamber, 4... Etching chamber, 5... Load lock chamber, 6... N2 gas, 7... Heat treatment equipment , 8
...Case, 9...Insertion port, 10...Ejection port, 1
3... Conveying member, 16... Heating plate, 21... Hot air blowing part. Applicant's agent Kiyoshi Inomata Figure 1 Figure 2 Figure 3 Atsushi Figure 4

Claims (1)

【特許請求の範囲】[Claims]  箱型に形成されたケースに、ワークの挿入口を一側に
、反対側に取出口を同一高さ位置に設け、該挿入口から
挿入されたワークを取出口へ搬送できるよう上面を前記
挿入口および取出口の下面と一致させた搬送部材を設け
、その搬送部材の上方には、搬送部材上を移動するワー
クに近接して加熱媒体としての熱風吹き出し部を、下方
には前記搬送部材に近接してワークの加熱板をそれぞれ
対向して設けてなるシート状材料の熱処理装置。
A box-shaped case is provided with a workpiece insertion port on one side and a workpiece removal port on the opposite side at the same height position, and the upper surface is set at the same height so that the workpiece inserted from the insertion port can be transported to the exit. A conveyor member is provided that is aligned with the lower surface of the opening and the outlet, and above the conveyor member there is a hot air blowing unit as a heating medium close to the workpiece that moves on the conveyor member, and below the conveyor member. A heat treatment device for sheet-like materials, in which heating plates for workpieces are placed close to each other and facing each other.
JP25358184A 1984-11-30 1984-11-30 Heat treatment device for sheet-like material Pending JPS61131532A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP25358184A JPS61131532A (en) 1984-11-30 1984-11-30 Heat treatment device for sheet-like material
US06/802,468 US4693777A (en) 1984-11-30 1985-11-27 Apparatus for producing semiconductor devices
EP85115144A EP0187249B1 (en) 1984-11-30 1985-11-29 Apparatus for producing semiconductor devices
DE3587830T DE3587830T2 (en) 1984-11-30 1985-11-29 Apparatus for manufacturing semiconductor devices.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25358184A JPS61131532A (en) 1984-11-30 1984-11-30 Heat treatment device for sheet-like material

Publications (1)

Publication Number Publication Date
JPS61131532A true JPS61131532A (en) 1986-06-19

Family

ID=17253362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25358184A Pending JPS61131532A (en) 1984-11-30 1984-11-30 Heat treatment device for sheet-like material

Country Status (1)

Country Link
JP (1) JPS61131532A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293921A (en) * 1987-05-27 1988-11-30 Tokuda Seisakusho Ltd Heat-treating equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5888082A (en) * 1981-09-25 1983-05-26 株式会社日立製作所 Liquid injector apparatus
JPS58165323A (en) * 1982-03-25 1983-09-30 Nec Corp Method and apparatus for dry etching
JPS58223340A (en) * 1982-06-22 1983-12-24 Dainippon Screen Mfg Co Ltd Drier for semiconductor wafer
JPS59208836A (en) * 1983-05-13 1984-11-27 Hitachi Ltd semiconductor manufacturing equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5888082A (en) * 1981-09-25 1983-05-26 株式会社日立製作所 Liquid injector apparatus
JPS58165323A (en) * 1982-03-25 1983-09-30 Nec Corp Method and apparatus for dry etching
JPS58223340A (en) * 1982-06-22 1983-12-24 Dainippon Screen Mfg Co Ltd Drier for semiconductor wafer
JPS59208836A (en) * 1983-05-13 1984-11-27 Hitachi Ltd semiconductor manufacturing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293921A (en) * 1987-05-27 1988-11-30 Tokuda Seisakusho Ltd Heat-treating equipment

Similar Documents

Publication Publication Date Title
US4693777A (en) Apparatus for producing semiconductor devices
KR102266685B1 (en) heat treatment furnace
JPS59186326A (en) Dry-etching apparatus
JP2002283330A (en) Manufacturing method of honeycomb formed body and drying equipment thereof
JPS61131532A (en) Heat treatment device for sheet-like material
JPS63109174A (en) Sheet-fed cvd device
JPS59208836A (en) semiconductor manufacturing equipment
JPS6232619A (en) Thermal treatment equipment for sheet-like material
JPS63293921A (en) Heat-treating equipment
JP2701810B2 (en) Plasma processing method and apparatus
JPS61263127A (en) Etching apparatus
JPH028379A (en) Dry etching device
JP3017132B2 (en) Processing device and processing method
US6647641B1 (en) Device and method for the treatment of substrates in a fluid container
JPH09246231A (en) Treatment equipment and method
JP2000146448A (en) Continuous heat treatment method, and heat treatment furnace
JP2931992B2 (en) Heat treatment equipment
JP2701811B2 (en) Plasma processing method and apparatus
JPH04155821A (en) Heat treatment device
JPH0691059B2 (en) Cleaning equipment
JPH08136144A (en) Continuous heat treatment furnace
JPS6220347A (en) processing equipment
JPH0215628B2 (en)
JPH07113150B2 (en) Thin film forming equipment
JPH06196428A (en) Treating device for semiconductor substrate