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JPS61125161A - Manufacture of lead frame - Google Patents

Manufacture of lead frame

Info

Publication number
JPS61125161A
JPS61125161A JP24739084A JP24739084A JPS61125161A JP S61125161 A JPS61125161 A JP S61125161A JP 24739084 A JP24739084 A JP 24739084A JP 24739084 A JP24739084 A JP 24739084A JP S61125161 A JPS61125161 A JP S61125161A
Authority
JP
Japan
Prior art keywords
lead frame
lead
coining
inner leads
noses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24739084A
Other languages
Japanese (ja)
Inventor
Minao Isayama
諌山　皆夫
Isao Yonenaga
米永　功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP24739084A priority Critical patent/JPS61125161A/en
Publication of JPS61125161A publication Critical patent/JPS61125161A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To conduct coining without twisting inner leads, and to reduce defectives by punching and forming a beltlike material so that sections in the vicinity of the noses of adjacent inner leads are connected mutually, coining the beltlike material and detaching it. CONSTITUTION:The noses of inner leads 11 facing a pad 10 for a lead frame constituting a semiconductor device, such as an IC, an LSI, etc. are punched and shaped by a lead-frame punching die so as to be slightly connected to the noses of adjacent inner leads by connecting sections 12. Coining for ensuring the flat width of the noses of the inner leads is conducted. The connecting sections 12 for the lead frame through a plating process and a taping process are punched, and the noses of the inner leads are detached mutually.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はリードフレームの製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a lead frame.

〔従来技術〕[Prior art]

ＩＣ，ＬＳＩ等の半導体装置は、半導体集積回路を第１
図に示すようなリードフレームのパッドＩＫ搭載し、こ
の半導体集積回路の端子とリードフレームのインナーリ
ード２とを金線あるいはアルミ線のボンディングにより
接続し、更にこれらを樹脂やセラミックで封入すること
により製造されている。In semiconductor devices such as ICs and LSIs, semiconductor integrated circuits are the first
By mounting a pad IK on a lead frame as shown in the figure, connecting the terminal of this semiconductor integrated circuit and the inner lead 2 of the lead frame by bonding with gold wire or aluminum wire, and further encapsulating these with resin or ceramic. Manufactured.

な窓、第１図において、３はアウターリード、４．５は
サイトレール、６はタイバー（ダムバー）、７はサポー
トバーである。In the window shown in FIG. 1, 3 is an outer lead, 4.5 is a sight rail, 6 is a tie bar (dam bar), and 7 is a support bar.

上記リードフレームは、帯状材料をリードフレーム打抜
用金型内で連続的に打ち抜くことＫより製造されるため
打ち抜かみれたリード表面は第２図（ａ）に示すように
抜きダレ８が原因で凸曲面状となりており、これにより
、インナーリード２先端ではボンディングを確実に行な
うのに十分な平担幅を確保することができない。Since the above lead frame is manufactured by continuously punching out a strip material in a lead frame punching die, the punched lead surface is caused by punching sag 8 as shown in Figure 2 (a). Since the inner lead 2 has a convex curved surface, a sufficient flat width cannot be secured at the tip of the inner lead 2 to ensure bonding.

そこで、従来よりインナーリード先端部の平坦幅を所望
の寸法Ｗ（第２図（ｂ）参照）にする九めにリードフレ
ーム打抜用金型内でコイニングが行なわれているうへ　
リードフレーム材料の内部応力の影響によりインナーリ
ード先端部がねじれたり、リード間隔にばらつきが生じ
たりするため、コイニングの効果が出にくい場合があっ
た。Therefore, in the past, coining was performed in the lead frame punching die to adjust the flat width of the inner lead tip to the desired dimension W (see Figure 2 (b)).
Due to the influence of the internal stress of the lead frame material, the tips of the inner leads may be twisted and the lead spacing may vary, making it difficult to produce coining effects in some cases.

また、メッキ工程やインナーリード部のテーピング工程
においては、打ち抜かれたリードフレームがメッキ槽や
テーピング装置などく連続して送られるため、その途中
でリードが引っかかり不要品が発生するという問題があ
った。In addition, in the plating process and inner lead taping process, the punched lead frame is continuously sent to a plating tank or taping device, so there was a problem that the leads could get caught on the way, creating unnecessary parts. .

〔発明の目的〕[Purpose of the invention]

本発明は上記実情に鑑みてなされたもので、インナーリ
ード先端のコイニングを有効に行なうことができ、また
インナーリード間隔のばらつきをなくシ展品の不良率の
低減を図ることができるリードフレームの製造方法を提
供することを目的とする。The present invention has been made in view of the above-mentioned circumstances, and manufactures a lead frame that can effectively coin the tips of inner leads, eliminate variations in inner lead spacing, and reduce the defective rate of rolled products. The purpose is to provide a method.

〔発明の構成〕[Structure of the invention]

この発明によれば、隣接するインナーリード先端付近を
互いに接続するようく帯状材料を打ち抜き形成し、その
後少なくともインナーリード先端の平坦幅を確保するた
めのコイニングを行なった後、前記インナーリード先端
付近の接続を打ち抜きにより切り離すようＫしている。According to this invention, after forming a strip of material by punching so as to connect adjacent inner lead tips to each other, and then performing coining to ensure at least a flat width of the inner lead tips, The connection is separated by punching.

〔実施例〕〔Example〕

以下、本発明を添付図面を参照して詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

第３図は本発明のリードフレームの製造方法における打
ち抜き工程中のパッド近傍の拡大図である。同図からも
明らかなように１パツド１ｏと対峙するインナーリード
１１の先端を、隣接するインナーリード先端と接続部１
２によってわずかに接続するようにリードフレーム打抜
金型で打ち抜き形成する。FIG. 3 is an enlarged view of the vicinity of the pad during the punching process in the lead frame manufacturing method of the present invention. As is clear from the figure, the tip of the inner lead 11 facing the pad 1o is connected to the tip of the adjacent inner lead at the connecting portion 1.
The lead frame is punched out using a lead frame punching die so that the lead frame is slightly connected by 2.

上記のように、接続部１２によってインナーリード１１
の先端を互いに接続しておくことＫより、リードフレー
ム材料の内部応力等の影響によりインナーリード１１の
先端部がねじれたり、リード間隔にばらつきが生じたり
しなくなる。As described above, the inner lead 11 is
By connecting the tips of the inner leads 11 to each other, the tips of the inner leads 11 will not be twisted or the lead spacing will not vary due to the influence of internal stress of the lead frame material.

次に、インナーリード先端を接続した状態で、インナー
リード先端の平坦幅を確保するためのコイニングを行な
う。Next, with the inner lead tips connected, coining is performed to ensure a flat width of the inner lead tips.

このようにしてリードフレーム打抜金型で連続的に打ち
抜き形成されたリードフレームは、メッキ槽やテーピン
グ装置などに連続して送られる。The lead frames that are continuously punched out using the lead frame punching die in this manner are continuously sent to a plating tank, a taping device, or the like.

なお、テーピング装置は、リード間隔のばらつきやリー
ドの変形を防止するために、インナーリード部に専用の
テープを貼り付けるものである。Note that the taping device attaches a special tape to the inner lead portion in order to prevent variations in lead spacing and deformation of the leads.

最後に、上記メッキ工程やテーピング工程を経由したリ
ードフレームの接続部辻を打ち抜き、各インナーリード
先端を互いに切り離す。第４図は、第３図における接続
部１２が打ち抜かれた後のパッド近傍の拡大図である。Finally, the joints of the lead frame that have gone through the plating process and taping process are punched out, and the tips of each inner lead are separated from each other. FIG. 4 is an enlarged view of the vicinity of the pad after the connecting portion 12 in FIG. 3 has been punched out.

第５図は他の実施例を示すパッド近傍の拡大図で、第３
図の実施例と比べて各インナーリード２１の接続部器の
接続位置が若干異なるものに関して示している。この接
続部ηは、前記と同様にコイニング後のメッキ工程およ
びテーピング工程を経由した後に打ち抜かれる。FIG. 5 is an enlarged view of the vicinity of the pad showing another embodiment;
The connection positions of the connection parts of each inner lead 21 are shown to be slightly different from those of the illustrated embodiment. This connecting portion η is punched out after passing through the plating process and taping process after coining, as described above.

なお、第３図および第４図に示すサポートパー１３およ
び器との接続部分Ａは予め切り離しておいてもよく、ま
たＢ部のようにインナーリードが短い箇所では、インナ
ーリード間を接続しなくてもよい。Note that the connection part A between the support par 13 and the vessel shown in Figures 3 and 4 may be separated in advance, and in places where the inner leads are short like part B, the inner leads should not be connected. It's okay.

また、本実施例ではコイニング後のメッキ工程およびテ
ーピング工程を経由した後、接続部を切り離すようＫし
たが、少なくともコイニング後であれば、コイニング終
了後直ち（、あるいはコイニング後のメッキ工程を経由
した後に接続部を切り離すようにしズもよい。In addition, in this example, the connection part is separated after passing through the plating process and taping process after coining, but at least after coining, it is necessary to disconnect the connection part immediately after coining (or via the plating process after coining). It is also a good idea to disconnect the connection after doing so.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、インナーリード先
端付近が接続され、リードのねじれかない状態でコイニ
ングができるので、均一な平坦幅をもつ製品が得られる
。また、インナーリード先端部を接続した状態でメッキ
工程やテーピング工程を実施すれば、この工程中にリー
ドが引っかかることがないので、製品の不良率の低減を
図ることができる。As explained above, according to the present invention, the vicinity of the tip of the inner lead is connected and coining can be performed without twisting the lead, so that a product with a uniform flat width can be obtained. Further, if the plating process or the taping process is performed with the inner lead tips connected, the leads will not get caught during this process, so it is possible to reduce the defective rate of the product.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はリードフレームの一例を示す平面図、第２図（
ａ）右よび（ｂ）はそれぞれコイニング前およびコイニ
ング後のインナーリード先端の断面図、第３図は本発明
によるリードフレームの製造方法における打ち抜き工程
中のパッド近傍の拡大図、第４図は第３図の接続部が打
ち抜かれた後のパッド近傍の拡大図、第５図は他の実施
例を示すパッド近傍の拡大図である。 ｌり・・−パッド、１１．ツ・・・インナーリード、１
２　、２２・・・接続部、１３．２３・・・サポートバ
ー。 第３図 Ｂ 第４図Figure 1 is a plan view showing an example of a lead frame, Figure 2 (
a) Right and (b) are sectional views of the tip of the inner lead before and after coining, respectively; FIG. 3 is an enlarged view of the vicinity of the pad during the punching process in the lead frame manufacturing method according to the present invention; and FIG. FIG. 3 is an enlarged view of the vicinity of the pad after the connecting portion is punched out, and FIG. 5 is an enlarged view of the vicinity of the pad showing another embodiment. lri...-pad, 11. Twin...inner lead, 1
2, 22...Connection part, 13.23...Support bar. Figure 3B Figure 4

Claims (3)

【特許請求の範囲】[Claims] （１）帯状材料を連続的に打ち抜いてリードフレームを
製造するリードフレームの製造方法において、隣接する
インナーリード先端付近を互いに接続するように帯状材
料を打ち抜き、その後インナーリード先端の平坦幅を確
保するためのコイニングを行なった後、前記インナーリ
ード先端付近の接続を打ち抜きにより切り離すことを特
徴とするリードフレームの製造方法。(1) In a lead frame manufacturing method in which a lead frame is manufactured by continuously punching out a band-shaped material, the band-shaped material is punched out so as to connect the vicinity of the tips of adjacent inner leads to each other, and then a flat width of the tips of the inner leads is ensured. 1. A method for manufacturing a lead frame, characterized in that after coining is performed, the connection near the tip of the inner lead is separated by punching. （２）前記接続の切り離しは、前記コイニング後のメッ
キ工程を経由した後に行なう特許請求の範囲第（１）項
記載のリードフレームの製造方法。(2) The lead frame manufacturing method according to claim (1), wherein the disconnection is performed after the plating step after the coining. （３）前記接続の切り離しは、前記コイニング後のメッ
キ工程およびインナーリード部のテーピング工程を経由
した後に行なう特許請求の範囲第（１）項記載のリード
フレームの製造方法。(3) The lead frame manufacturing method according to claim (1), wherein the disconnection is performed after a plating step after the coining and a taping step of the inner lead portion.
JP24739084A 1984-11-22 1984-11-22 Manufacture of lead frame Pending JPS61125161A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24739084A JPS61125161A (en) 1984-11-22 1984-11-22 Manufacture of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24739084A JPS61125161A (en) 1984-11-22 1984-11-22 Manufacture of lead frame

Publications (1)

Publication Number Publication Date
JPS61125161A true JPS61125161A (en) 1986-06-12

Family

ID=17162715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24739084A Pending JPS61125161A (en) 1984-11-22 1984-11-22 Manufacture of lead frame

Country Status (1)

Country Link
JP (1) JPS61125161A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6410653A (en) * 1987-07-02 1989-01-13 Nec Corp Manufacture of lead frame for semiconductor device
JPH0294552A (en) * 1988-09-30 1990-04-05 Mitsui High Tec Inc Manufacture of lead frame and semiconductor device
JPH02298055A (en) * 1989-05-12 1990-12-10 Mitsui High Tec Inc Manufacture of lead frame
JPH0366153A (en) * 1989-08-04 1991-03-20 Mitsui High Tec Inc Manufacture of lead frame for semiconductor device use
JPH03120852A (en) * 1989-10-04 1991-05-23 Sumitomo Metal Mining Co Ltd Manufacture of lead frame
JPH03124055A (en) * 1989-10-06 1991-05-27 Mitsui High Tec Inc Manufacture of lead frame and semiconductor device using same
JPH03283643A (en) * 1990-03-30 1991-12-13 Mitsui High Tec Inc Manufacture of lead frame
JPH0457347A (en) * 1990-06-27 1992-02-25 Yamada Seisakusho Co Ltd Lead frame and manufacture thereof
EP0623957A4 (en) * 1992-11-24 1995-04-19 Hitachi Construction Machinery PROCESS FOR PRODUCING A MOUNTING FRAME.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6410653A (en) * 1987-07-02 1989-01-13 Nec Corp Manufacture of lead frame for semiconductor device
JPH0294552A (en) * 1988-09-30 1990-04-05 Mitsui High Tec Inc Manufacture of lead frame and semiconductor device
JPH02298055A (en) * 1989-05-12 1990-12-10 Mitsui High Tec Inc Manufacture of lead frame
JPH0366153A (en) * 1989-08-04 1991-03-20 Mitsui High Tec Inc Manufacture of lead frame for semiconductor device use
JPH03120852A (en) * 1989-10-04 1991-05-23 Sumitomo Metal Mining Co Ltd Manufacture of lead frame
JPH03124055A (en) * 1989-10-06 1991-05-27 Mitsui High Tec Inc Manufacture of lead frame and semiconductor device using same
JPH03283643A (en) * 1990-03-30 1991-12-13 Mitsui High Tec Inc Manufacture of lead frame
JPH0457347A (en) * 1990-06-27 1992-02-25 Yamada Seisakusho Co Ltd Lead frame and manufacture thereof
EP0623957A4 (en) * 1992-11-24 1995-04-19 Hitachi Construction Machinery PROCESS FOR PRODUCING A MOUNTING FRAME.
US5548890A (en) * 1992-11-24 1996-08-27 Hitachi Construction Machinery Co., Ltd. Lead frame processing method

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