JPS611011A - Method of producing solid electrolytic condenser - Google Patents
Method of producing solid electrolytic condenserInfo
- Publication number
- JPS611011A JPS611011A JP12158984A JP12158984A JPS611011A JP S611011 A JPS611011 A JP S611011A JP 12158984 A JP12158984 A JP 12158984A JP 12158984 A JP12158984 A JP 12158984A JP S611011 A JPS611011 A JP S611011A
- Authority
- JP
- Japan
- Prior art keywords
- organic semiconductor
- solid electrolytic
- case
- lead
- producing solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Oxygen Concentration In Cells (AREA)
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （イ）産業上の利用分野 本発明は固体電解コンデンサの製造方法に関する。[Detailed description of the invention] (b) Industrial application fields The present invention relates to a method for manufacturing a solid electrolytic capacitor.
（ロ）従来技術
陽極や陰極のための電極箔をセパレータ紙と共に巻回し
たコンデンサ素子に、液化された有機半導体を含浸し、
冷却固化せる固体電解コンデンサの製造方法は、既に特
開昭５８−１２５７１５号公報等によ）知られている。(b) Prior art A capacitor element in which electrode foils for anodes and cathodes are wound together with separator paper is impregnated with liquefied organic semiconductor,
A method of manufacturing a solid electrolytic capacitor by cooling and solidifying is already known (see, for example, Japanese Unexamined Patent Publication No. 125715/1983).
第３図及び第４図はこの様にして作られた固体電解コン
デンサの構造を示し、（１）はコンデンサ素子、（２）
は該素子の各電極箔に連なるリードボス、（３１はリー
ドボス（２１より延びるリード、（４）は素子（１１を
収納するアルミニ９ム等のケース、（５１は素子ｆｉｌ
とケース（４）との間に充填さｎた封止樹脂である。Figures 3 and 4 show the structure of the solid electrolytic capacitor made in this way, where (1) is the capacitor element, (2)
(31 is a lead boss (lead extending from 21), (4) is a case made of aluminum 9mm or the like that houses the element (11), (51 is a case such as aluminum 9mm that houses the element (11),
A sealing resin is filled between the case (4) and the case (4).
こ＼で問題となるのは１図中黒塗りで示す有機半導体の
はみ出し部（６）の存在である。はみ出し部（６）は、
素子（１１に有機半導体を含浸した際に、その含浸量が
適当でなかった場合に形成さ几たり（第３図）、あるい
は、素子の径が小さく、従ってリードボス（２１ｆ２＋
の間隔が小さい場合に毛管棉象によ′シ形成さｎた９（
第４図）するものである。この様なはみ出り部（６）は
陽極、陰極の各リードボス間での漏れ電流を大にするの
で好ましくない。The problem here is the presence of a protruding part (6) of the organic semiconductor shown in black in Figure 1. The protruding part (6) is
When the element (11) is impregnated with an organic semiconductor, lead bosses (21f2+
When the distance between the two is small, the capillary pattern forms a 9
Figure 4). Such a protruding portion (6) is undesirable because it increases the leakage current between the anode and cathode lead bosses.
（／１ 発明の目的
本発明は上記の如きはみ出し部の影響を除去し得る製造
方法を提供するものである。(/1 Object of the Invention The present invention provides a manufacturing method capable of eliminating the influence of the protruding portion as described above.
に）発明の構成
本発明の固体電解コンデンサの製造方法は、電極箔ｔセ
パレータ紙と共に巻回したコンデンサ素子に液化された
有機半導体を含浸し、冷却固化せる製造方法において、
上記有機半導体の含浸前に、上記胤ｉ箔に運なるリード
ポスに絶縁皮膜を設けることｔ−特徴とする。B) Structure of the Invention The method for producing a solid electrolytic capacitor of the present invention includes impregnating a liquefied organic semiconductor into a capacitor element wound together with electrode foil and separator paper, and cooling and solidifying the capacitor element.
It is characterized in that an insulating film is provided on the lead posts leading to the seed i-foil before being impregnated with the organic semiconductor.
（ホ）実施例
第１図は本笑厖例の方法によシ形成ｉｎたコンデンサ素
子を示し、第６図、第４図と同一部分には同−ｔｆ号が
付されている。（７１は、本発明の特徴となる絶縁皮膜
で、それは、素子（１）に融解液化状態の有機半導体を
含浸する前に形成され、従って、リードボス（２）は絶
縁皮膜（７）により、はみ出し部（６）から隔縞保護さ
れ、従来の如きリードポス１２１ｉ２１間の漏れ′―流
の発生は抑えらｒしる。(E) Embodiment FIG. 1 shows a capacitor element formed by the method of this embodiment, and the same parts as in FIGS. 6 and 4 are designated by the same symbol -tf. (71 is an insulating film that is a feature of the present invention. It is formed before the element (1) is impregnated with the organic semiconductor in a molten and liquefied state. Therefore, the lead boss (2) is exposed to the insulating film (7). Since the lead posts 121i21 are protected by stripes from the part (6), the occurrence of leakage flow between the lead posts 121i21 as in the conventional case is suppressed.
結縁皮ｄ（７）の祠″Ｘは、シリコーン樹脂、あるいは
１ポリテトラフルオロエチレン、ポリトリフルオロクロ
ルエチレン、フッ化ビニル、フッ化ヒニリデン、ジクロ
ルフルオロエチレンなどの重合体や共重合体に代表さｎ
る弗素樹脂等が好適である。The hole "X" of the binding skin d (7) is typically made of silicone resin or a polymer or copolymer such as polytetrafluoroethylene, polytrifluorochloroethylene, vinyl fluoride, hnylidene fluoride, or dichlorofluoroethylene. san
Fluororesins and the like are suitable.
皮膜（７）の形成方法としては、信越化学■裂のシリコ
ーンＫＯ−８８ｖｅシンナーで薄めたものを筆にてリー
ドボス（２１に塗布し、その後室温装置で乾燥するのが
適当である。皮膜（７）の厚みは、政μｍ程度である。A suitable method for forming the film (7) is to apply diluted silicone KO-88ve thinner from Shin-Etsu Chemical Co., Ltd. with a brush to the lead boss (21), and then dry it at room temperature. ) has a thickness of approximately micrometers.
又、この場合、塗布作業を容易にすべく、塗布液内に、
例えば赤色を呈する試薬、１扱スダンｌを少量混ぜてお
き、塗布領域を目視できる様になしてもよい。In addition, in this case, in order to facilitate the coating work, in the coating liquid,
For example, a small amount of a red reagent may be mixed in one liter of sugar so that the applied area can be visually observed.
皮膜（７）の他の形成例は、ダイキン工業■裂のダイ７
リ−ＭＳ−５４１７七トンで薄めたものを同様に筆に”
Ｃ塗布し、その後、１００°Ｃで２分以上乾燥すること
である。この場合は、弗素樹脂系皮膜（７）が形成され
、同様の４ｎ心流防止効果ｔもたらす。この場合の皮膜
（７）は、加えて離型作用をもっているので、リードボ
ス（２）への有機半導体の付１そり６ｃＤｔ＠減し、よ
シ効来的である。Another example of forming the film (7) is Daikin Industries ■ Crack Die 7
Dilute it with 7 tons of Lee MS-5417 and use it in the same way.
C coating and then drying at 100°C for 2 minutes or more. In this case, a fluororesin film (7) is formed to provide the same 4n cardiac flow prevention effect. In this case, the film (7) additionally has a mold release effect, so that the warpage of the organic semiconductor to the lead boss (2) is reduced by 6 cDt, which is highly effective.
以上の如く１本発明にリードポス間の漏ｎ電流防止効果
を有するが、その他、第２図に示す如く、ケース（４）
内で素子ｆｉ＋が傾い℃収納さｎ、このため陽極リード
ポスがケース（４）に接触した場合の電気的短絡會防ぐ
こともできる。As described above, the present invention has the effect of preventing leakage n current between lead posts, but as shown in Fig. 2, case (4)
The element fi+ is housed at an angle of 0.degree. C., which prevents an electrical short circuit if the anode lead point contacts the case (4).
本発明を実施する際に、絶縁皮膜（７）を形成し、有機
半導体を含浸、冷却した後、斯る素子（１） ’ｔ−ケ
ース（４）に収納し、樹脂（５）で封止する方法、ある
いは、絶縁皮膜（７）全形成した後、斯る素子（Ｉｌ’
ｉクース（４）に収納し、この状態でケース内に有機半
導体を注入することによシ索子内への有機半導体の含浸
、冷却ｔなし、次いでケース（４）の開口部を樹脂封止
する方法の何れでも艮い。又、絶縁皮膜（７）は陽極側
のり−ドボスにのみ設けても良い。When carrying out the present invention, an insulating film (7) is formed, an organic semiconductor is impregnated, and after cooling, the element (1) is housed in a t-case (4) and sealed with a resin (5). Alternatively, after the insulating film (7) is completely formed, such an element (Il'
By storing the organic semiconductor in the case (4) and injecting the organic semiconductor into the case in this state, the organic semiconductor is impregnated into the cord, without cooling, and then the opening of the case (4) is sealed with resin. Any method is fine. Further, the insulating film (7) may be provided only on the glued boss on the anode side.
（へ）発明の効果
本発明によれば、コンデンサ素子への有機半導体の含浸
時に、リードボスにはみ出し付層する有機半導体の不所
望な影響をなくすことができ、コンデンサの歩留りや信
頼性の向上を区れる。(f) Effects of the Invention According to the present invention, when impregnating a capacitor element with an organic semiconductor, it is possible to eliminate the undesirable effects of the organic semiconductor that protrudes from the lead boss and improves the yield and reliability of the capacitor. Can be separated.
第１図、第２図は本発明実施例を示す断面図、第５図、
第４図は従来例を示Ｔ断面図である。1 and 2 are cross-sectional views showing embodiments of the present invention, and FIG.
FIG. 4 is a T sectional view showing a conventional example.
Claims (1)
素子に液化された有機半導体を含浸し、冷却固化せる製
造方法において、上記有機半導体の含浸前に、上記電極
箔に連なるリードボスに絶縁皮膜を設けることを特徴と
する固体電解コンデンサの製造方法。(1) In a manufacturing method in which a capacitor element in which electrode foil is wound together with separator paper is impregnated with a liquefied organic semiconductor and cooled and solidified, an insulating film is provided on the lead boss connected to the electrode foil before impregnation with the organic semiconductor. A method for manufacturing a solid electrolytic capacitor, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12158984A JPS611011A (en) | 1984-06-13 | 1984-06-13 | Method of producing solid electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12158984A JPS611011A (en) | 1984-06-13 | 1984-06-13 | Method of producing solid electrolytic condenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS611011A true JPS611011A (en) | 1986-01-07 |
Family
ID=14814983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12158984A Pending JPS611011A (en) | 1984-06-13 | 1984-06-13 | Method of producing solid electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611011A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185308A (en) * | 1986-02-10 | 1987-08-13 | 信英通信工業株式会社 | Manufacture of electrolytic capacitor |
| JPH0379418U (en) * | 1989-12-01 | 1991-08-13 | ||
| JP2001284174A (en) * | 2000-03-30 | 2001-10-12 | Nippon Chemicon Corp | Solid electrolytic capacitor and its manufacturing method |
| JP2002083738A (en) * | 2000-06-23 | 2002-03-22 | Matsushita Electric Ind Co Ltd | Lead wire for capacitor, solid electrolytic capacitor, and manufacturing method therefor |
-
1984
- 1984-06-13 JP JP12158984A patent/JPS611011A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185308A (en) * | 1986-02-10 | 1987-08-13 | 信英通信工業株式会社 | Manufacture of electrolytic capacitor |
| JPH0379418U (en) * | 1989-12-01 | 1991-08-13 | ||
| JP2001284174A (en) * | 2000-03-30 | 2001-10-12 | Nippon Chemicon Corp | Solid electrolytic capacitor and its manufacturing method |
| JP2002083738A (en) * | 2000-06-23 | 2002-03-22 | Matsushita Electric Ind Co Ltd | Lead wire for capacitor, solid electrolytic capacitor, and manufacturing method therefor |
| JP4501270B2 (en) * | 2000-06-23 | 2010-07-14 | パナソニック株式会社 | Capacitor lead wire and solid electrolytic capacitor using the same |
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