JPS60922B2 - Manufacturing method of thick film thermistor - Google Patents
Manufacturing method of thick film thermistorInfo
- Publication number
- JPS60922B2 JPS60922B2 JP53157437A JP15743778A JPS60922B2 JP S60922 B2 JPS60922 B2 JP S60922B2 JP 53157437 A JP53157437 A JP 53157437A JP 15743778 A JP15743778 A JP 15743778A JP S60922 B2 JPS60922 B2 JP S60922B2
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- thermistor
- manufacturing
- film thermistor
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000004020 conductor Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
【発明の詳細な説明】
本発明は厚膜サーミスタの製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a thick film thermistor.
従来の厚膜サーミスタの製造方法を第１図、第２図によ
り説明する。A conventional method for manufacturing a thick film thermistor will be explained with reference to FIGS. 1 and 2.
厚膜サーミスタは平板状の基板１の表面に下部導体２「
サーミスタ３、上部導体４、ガラスコート５を印刷によ
り形成した後焼付けるため、設備費用「加工費用共に高
い。A thick film thermistor has a lower conductor 2' on the surface of a flat substrate 1.
Because the thermistor 3, upper conductor 4, and glass coat 5 are formed by printing and then baked, equipment costs and processing costs are high.
又、耐水性を向上するためこの厚膜サーミスタを樹脂モ
ールドする場合、アルミナ基板１のエッヂ部よりクラッ
クを生じる恐れがある。本発明はかかる点を改良するた
めになされたものである。Furthermore, when this thick film thermistor is molded with resin to improve water resistance, there is a risk that cracks may occur from the edge portions of the alumina substrate 1. The present invention has been made to improve this point.
以下本発明の一実施例を第３図、第４図に塞いて説明す
る。An embodiment of the present invention will be described below with reference to FIGS. 3 and 4.
１〜５◇のアルミナ棒１３を使用し、これを導体ペース
トに浸簿するか、導体ペーストを噴霧するか、はけ塗り
するかにより塗布した後、導体ペーストを乾燥し、次い
でサーミスタベーストを上記と同一方法にて塗布乾燥し
、次いで上部導体ペーストを上記と同一方法にて塗布乾
燥し、次いでカバーコートガラスペーストを上記と同一
方法にて塗布乾燥した後焼付し、下部導体１４、サーミ
スタ１５、上部導体１６、カバーコートガラス１０を形
成し、その両端に金属電極１１，１２を挿入して下部導
体１４、上部導体１６に導伝授着剤を介して接合したも
のである。Using an alumina rod 13 of 1 to 5◇, apply it by dipping it in the conductor paste, spraying it, or brushing it, then dry the conductor paste, and then apply the thermistor base as described above. The upper conductor paste was applied and dried in the same manner as above, and then the cover coat glass paste was applied and dried in the same manner as above, and then baked. An upper conductor 16 and a cover coat glass 10 are formed, metal electrodes 11 and 12 are inserted into both ends thereof, and the metal electrodes 11 and 12 are bonded to the lower conductor 14 and the upper conductor 16 via a conductive bonding agent.
この方法によりペースト粘度を調整すれば、高価な印刷
装置を使用せずに、塗布により厚膜サーミスタを製作で
きる。又「従来の厚膜サーミスタのように鋭角なェッヂ
の露出もなく、樹脂モ」ルド性を改善することができる
。以上説明した如く、本発明によれ‘ま厚膜サーミスタ
の加工性、樹脂モールド特性は大中に向上し、高性能の
厚膜サーミスタを安価に供給できる。By adjusting the paste viscosity using this method, thick film thermistors can be manufactured by coating without using expensive printing equipment. In addition, unlike conventional thick film thermistors, sharp edges are not exposed, and resin moldability can be improved. As explained above, according to the present invention, the processability and resin molding properties of thick film thermistors are greatly improved, and high performance thick film thermistors can be provided at low cost.
第１図は従来の厚膜サーミスタの平面図、第２図は第１
図のＡ−Ａ断面図「第３図は本発明の厚膜ザーミスタの
平面図「第４図は第３図のＢ−Ｂ断面図である。
１…・・。
アルミナ基板「 ２…・・・下部導体〜 ３・…川サー
ミスタ、４……上部導体、５・…・・カバーコ−トガラ
ス、６・…・，サーミスタ電極ト１３…・・・棒状アル
ミナ、官４……下部導体、１５・・・…サーミスタ「
１６……上部電極「 １０・・・・・・カバーコートガ
ラス「 １１，１２……金属電極。券１図
多２図
多３図
＊４図Figure 1 is a plan view of a conventional thick film thermistor, and Figure 2 is a top view of a conventional thick film thermistor.
3 is a plan view of the thick film thermistor of the present invention. 4 is a sectional view taken along BB in FIG. 3. 1... Alumina substrate 2...・Lower conductor ~ 3... River thermistor, 4... Upper conductor, 5... Cover coat glass, 6..., Thermistor electrode 13... Rod-shaped alumina, Metal 4... Lower conductor, 15... ...Thermistor
16... Upper electrode " 10... Cover coat glass " 11, 12... Metal electrode.
Claims (1)
、上部導体１６、カバーコートガラス１０をこの順に塗
布焼付けた後、一端に下部導体１４に接続する金属電極
１１を取り付け、他端に上部導体１６に接続する金属電
極１２を取り付けた厚膜サーミスタの製造方法。 ２ 金属電極１１，１２を棒状サーミスタ１３に取りつ
ける時圧入した特許請求の範囲第１項記載の厚膜サーミ
スタの製造方法。 ３ 金属電極１１，１２を棒状サーミスタ１３に取りつ
ける時に導伝接着剤にて接合した特許請求の範囲第１項
記載の厚膜サーミスタの製造方法。[Claims] 1. An alumina rod 13, a lower conductor 14, and a thermistor 15.
, the upper conductor 16 and the cover coat glass 10 are applied and baked in this order, and then a metal electrode 11 connected to the lower conductor 14 is attached to one end, and a metal electrode 12 connected to the upper conductor 16 is attached to the other end of the thick film thermistor. Production method. 2. The method of manufacturing a thick film thermistor according to claim 1, wherein the metal electrodes 11 and 12 are press-fitted when attached to the rod-shaped thermistor 13. 3. The method of manufacturing a thick film thermistor according to claim 1, wherein the metal electrodes 11 and 12 are bonded to the rod-shaped thermistor 13 using a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53157437A JPS60922B2 (en) | 1978-12-22 | 1978-12-22 | Manufacturing method of thick film thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53157437A JPS60922B2 (en) | 1978-12-22 | 1978-12-22 | Manufacturing method of thick film thermistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5585002A JPS5585002A (en) | 1980-06-26 |
| JPS60922B2 true JPS60922B2 (en) | 1985-01-11 |
Family
ID=15649621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53157437A Expired JPS60922B2 (en) | 1978-12-22 | 1978-12-22 | Manufacturing method of thick film thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60922B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547444Y2 (en) * | 1986-10-22 | 1993-12-14 |
-
1978
- 1978-12-22 JP JP53157437A patent/JPS60922B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5585002A (en) | 1980-06-26 |
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