JPS6322701U - - Google Patents
Info
- Publication number
- JPS6322701U JPS6322701U JP11585386U JP11585386U JPS6322701U JP S6322701 U JPS6322701 U JP S6322701U JP 11585386 U JP11585386 U JP 11585386U JP 11585386 U JP11585386 U JP 11585386U JP S6322701 U JPS6322701 U JP S6322701U
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- chip
- insulating substrate
- electrode
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
第１図は本考案の実施例、第２図は本考案の他
の実施例、第３図は従来のサーミスタを示す図面
である。
１，７，１３……サーミスタ素子、２，８，１
４……サーミスタ電極、９，１５……サーミスタ
リード線、３，１０……基板、４，１１……基板
電極、５，１２，１６……ガラス被覆、６……導
電性塗料による焼付け部分。
FIG. 1 shows an embodiment of the present invention, FIG. 2 shows another embodiment of the present invention, and FIG. 3 shows a conventional thermistor. 1, 7, 13...Thermistor element, 2, 8, 1
4... Thermistor electrode, 9, 15... Thermistor lead wire, 3, 10... Substrate, 4, 11... Substrate electrode, 5, 12, 16... Glass coating, 6... Part baked with conductive paint.
Claims (1)
状サーミスタチツプと、 両面をコの字状に覆う電極を両端にそれぞれ有
する絶縁基板とを有し、 該絶縁基板の一方の面の両電極間に、前記サー
ミスタチツプをその少くとも一方の電極を該絶縁
基板の電極面に接触させて接続するとともに、該
サーミスタチツプを該一方の絶縁基板面とともに
硝子被覆してなり、該絶縁基板の他方の面の両電
極によつてプリント基板等に接触して装着し得る
ことを特徴とする硝子封止チツプ形サーミスタ。 (2) 前記サーミスタチツプを覆う硝子被覆が成
形加工されていることを特徴とする実用新案登録
請求の範囲第１項記載の硝子封止チツプ形サーミ
スタ。 (3) 前記サーミスタチツプの一方の電極が前記
絶縁基板の一方の電極に対して平行に密着接続さ
れているとともに、該サーミスタチツプの他方の
電極と前記絶縁基板の他方の電極とがリード線に
よつて接続されていることを特徴とする実用新案
登録請求の範囲第１項または第２項記載の硝子封
止チツプ形サーミスタ。 (4) 前記サーミスタチツプの両端の電極面が前
記絶縁基板の両電極に対してそれぞれ垂直に接触
接続されていること を特徴とする実用新案登録請求の範囲第１項また
は第２項記載の硝子封止チツプ形サーミスタ。[Scope of Claim for Utility Model Registration] (1) A rectangular plate-shaped thermistor chip having electrodes on opposing surfaces, and an insulating substrate having electrodes covering both surfaces in a U-shape at each end, the insulating substrate The thermistor chip is connected between both electrodes on one surface of the insulating substrate with at least one electrode in contact with the electrode surface of the insulating substrate, and the thermistor chip and the surface of the one insulating substrate are coated with glass. A glass-sealed chip thermistor characterized in that it can be mounted in contact with a printed circuit board or the like by means of both electrodes on the other side of the insulating substrate. (2) The glass-sealed chip thermistor according to claim 1, wherein the glass coating covering the thermistor chip is molded. (3) One electrode of the thermistor chip is closely connected in parallel to one electrode of the insulating substrate, and the other electrode of the thermistor chip and the other electrode of the insulating substrate are connected to a lead wire. A glass-sealed chip thermistor according to claim 1 or 2, characterized in that the glass-sealed chip thermistor is connected in this way. (4) The glass according to claim 1 or 2, wherein the electrode surfaces at both ends of the thermistor chip are connected perpendicularly to both electrodes of the insulating substrate, respectively. Sealed chip thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11585386U JPS6322701U (en) | 1986-07-28 | 1986-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11585386U JPS6322701U (en) | 1986-07-28 | 1986-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322701U true JPS6322701U (en) | 1988-02-15 |
Family
ID=30999899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11585386U Pending JPS6322701U (en) | 1986-07-28 | 1986-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322701U (en) |
-
1986
- 1986-07-28 JP JP11585386U patent/JPS6322701U/ja active Pending
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