JPS6072688A - Electron beam working method - Google Patents
Electron beam working methodInfo
- Publication number
- JPS6072688A JPS6072688A JP58180157A JP18015783A JPS6072688A JP S6072688 A JPS6072688 A JP S6072688A JP 58180157 A JP58180157 A JP 58180157A JP 18015783 A JP18015783 A JP 18015783A JP S6072688 A JPS6072688 A JP S6072688A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- workpiece
- cracks
- processing
- processing point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010894 electron beam technology Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 6
- 238000003754 machining Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 8
- 238000003672 processing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005553 drilling Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- -1 electron beam Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Laser Beam Processing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は′電子ビーム加工法に係シ、特に、脆性材料の
加工に適した成子ビーム加工法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an electron beam processing method, and more particularly to a child beam processing method suitable for processing brittle materials.
電子ビームによシ、シリコン、ルビーなどの単結晶や、
ソーダガラス、アルミナセラミックに代表される竜性材
料の切断または穴あけ加工を行なうと、従来、被加工物
の加工点の周囲に割れやクラックが生じ、良好な加工結
果を得ることが困難であった。特に、脆性材料では割れ
やクランクが発生し易かった。Single crystals such as electron beam, silicon, ruby, etc.
Traditionally, when cutting or drilling durable materials such as soda glass and alumina ceramics, cracks would occur around the processing point on the workpiece, making it difficult to obtain good processing results. . In particular, brittle materials tend to crack or crack.
この割れやクラックがりｂ生する原因は、別工時に生ず
る熱ひずみによるものである。The cause of this cracking and cracking is due to thermal strain that occurs during separate machining.
電子ビーム加工法は、被加工物のｆｉｒｌ工点に高エネ
ルギ密度の電子ビームを照射し、当該加工物を局部的に
加熱して層温状態ないし蒸発状態にし、ビーム照射によ
って生成された溶融物を、それ自体の蒸気で吹飛ばすこ
とにより加工が進行するものである。In the electron beam processing method, a high-energy-density electron beam is irradiated to the firl point of the workpiece, the workpiece is locally heated to a layer temperature state or an evaporation state, and the molten material produced by the beam irradiation is Processing proceeds by blowing away the material with its own steam.
しかし、電子ビームが高エネルギ密１グであるため、加
工点と加工点近傍との温度差がきわめて大きく、急峻な
温度勾配を生じ、この時６１及勾配によって被加工物に
大きな熱ひずみを生じ、これが前記した割れやクラック
の原因となっていた。However, because the electron beam has a high energy density, the temperature difference between the processing point and the vicinity of the processing point is extremely large, resulting in a steep temperature gradient, and at this time, the 61 and gradient causes large thermal strain in the workpiece. This was the cause of the cracks and cracks mentioned above.
本発明は、上記した従来技術の欠点を除去して、割れや
クラックを発生ずることなく脆性材料を加エすることが
できる電子ビーム刃口工法の提供を、その目的とするも
のである。An object of the present invention is to provide an electron beam cutting method that eliminates the drawbacks of the prior art described above and is capable of processing brittle materials without causing cracks or cracks.
本発明に係るぢ、子ビーム加工法の構成は、被加工物の
加工点に電子ビームを照射するとともに、との電子ビー
ムの照射範囲を包含する範囲にレーザビームを照射する
ことにより、前記加工点と加工点近傍との温度差が前記
被加工物に割れやクラックを生ぜしめない程度に小さく
７７：るように加熱しながら、前記電子ビームによって
前記加工点を加工するようにしたものである。According to the present invention, the configuration of the sub-beam processing method is such that the processing point of the workpiece is irradiated with an electron beam and a laser beam is irradiated to a range that includes the irradiation range of the electron beam. The processing point is processed by the electron beam while being heated so that the temperature difference between the point and the vicinity of the processing point is small enough to not cause cracks or cracks in the workpiece. .
実施例の説明に入るまえに、本発明に係る基本的事項を
説明する。Before entering into the description of the embodiments, basic matters related to the present invention will be explained.
電子ビーム加工において、被加工物、特に脆性材料に生
ずる割れやクラックは、前述したように、加工点と加工
点近傍との）晶度差が大きいことによるものである。そ
こで、前記加工点を包含する、電子ビーム照射範囲より
も広い範囲にレーザビームを照射して被加工物を加熱す
れば、加工点近傍の湿間は、′電子ビームのみを照射し
た」賜金（従来の人士ビーム加工法の場合）よりも１°
１−８Ｓい？ｆＭ度に保たれる。したがって、加工点と
加工点近傍との温度差が小さくなり、これによって割れ
やクラックの生じない加工を可能にすることができる。In electron beam machining, cracks that occur in the workpiece, particularly in brittle materials, are due to the large difference in crystallinity between the machining point and the vicinity of the machining point, as described above. Therefore, if the workpiece is heated by irradiating the workpiece with a laser beam over a wider area than the electron beam irradiation range, which includes the processing point, the damp area near the processing point will be irradiated with only the electron beam. 1° compared to the conventional human beam machining method)
1-8S? It is maintained at fM degrees. Therefore, the temperature difference between the processing point and the vicinity of the processing point becomes small, thereby making it possible to perform processing without causing cracks or cracks.
なお、加工点近傍を加熱する手段として、前記レーザビ
ームの代シに別の次子ビーム（以下、加熱用ビームとい
う）を使用することも考えられるが、この加熱用ビーム
による電界の効果および被加工物を螢電させる効果によ
って、加工のための電子ビームの収束が困誰になるとい
う障害がある。Note that as a means of heating the vicinity of the processing point, it is possible to use another secondary beam (hereinafter referred to as a heating beam) in place of the laser beam, but the effect of the electric field due to this heating beam and the There is a problem in that the effect of electrifying the workpiece makes it difficult to converge the electron beam for processing.
これに対して、レーザビームを使用した場合には前記障
害がないので、本発明においては、加熱用熱源としてレ
ーザビームを１更用するようにしだ。On the other hand, when a laser beam is used, the above problem does not occur, so in the present invention, a laser beam is used as a heating heat source.
以下本発明を実施例によって説明する。The present invention will be explained below with reference to Examples.
第１図は、本発明の一実施例に係るし子ビーム加工法の
実施に供せられる加工装置の一例を示ず略示図、稟２図
は、４１図における被加工物の加工点近傍の詳細を示す
要部平面図である。FIG. 1 is a schematic diagram showing an example of a machining device used for carrying out a beam machining method according to an embodiment of the present invention, and FIG. FIG. 2 is a plan view of main parts showing details.
各図において、３ａは、被加工物３の加工点、１は、電
磁レンズ２によって細く集光され、前記加工点３ａに照
射される電子ビーム、７は、レーザ発振器４から発振し
、反射鏡５で反射し、レンズ６でビーム径ｄが調節され
、前記加工点３ａに照射されるレーザビームである。こ
の場合、レーザビーム７の照射範囲７ａは、電子ビーム
１の照射範囲１ａを完全に包含するものである。In each figure, 3a is a processing point of the workpiece 3, 1 is an electron beam narrowly focused by an electromagnetic lens 2 and irradiated to the processing point 3a, and 7 is an electron beam oscillated from a laser oscillator 4, and a reflecting mirror 5, the beam diameter d is adjusted by a lens 6, and the laser beam is irradiated onto the processing point 3a. In this case, the irradiation range 7a of the laser beam 7 completely includes the irradiation range 1a of the electron beam 1.
このように構成したものにおいて、電子ビーム１を被加
工材３の加工点３ａへ向けて、電子ビーム照射範囲１ａ
に照射するとともに、この電子ビーム照射範囲１ａを包
含するレーザビーム照射範囲７ａにレーザビーム７を照
射する。このとき、加工点３ａと加工点近傍との温度差
が、仮加工物３に割れやクラックを生せしめない程度に
小さくなるように（具体例については後述する。）、レ
ーザビーム７の強度をレーザ発振器４によシ、またビー
ム径ｄをレンズ６によりそれぞれ調節する。In this configuration, the electron beam 1 is directed toward the processing point 3a of the workpiece 3, and the electron beam irradiation range 1a is
At the same time, a laser beam 7 is irradiated onto a laser beam irradiation range 7a that includes this electron beam irradiation range 1a. At this time, the intensity of the laser beam 7 is adjusted so that the temperature difference between the processing point 3a and the vicinity of the processing point is small enough to prevent cracks from occurring in the temporary workpiece 3 (specific examples will be described later). The beam diameter d is adjusted by the laser oscillator 4 and the beam diameter d by the lens 6, respectively.
前記電子ビーム１．レーザビーム７を照射すれた被加工
物３は、電子ビーム１によって加工点３ａが加工され、
レーザビーム７によってその周囲が加熱されで、力［１
工点３ａとＪＪ１１工点近傍点近傍１度差が従来よりも
小さくなって、割れやクランクがその周囲に全くない加
工部が祷られる。The electron beam 1. The workpiece 3 irradiated with the laser beam 7 is processed at the processing point 3a by the electron beam 1,
The surrounding area is heated by the laser beam 7, and a force [1
The 1 degree difference between the work point 3a and the JJ11 work point is smaller than before, and a machined part with no cracks or cranks is expected.
以上説明した実施例によれば、電子ビーム！：Ｑ射範囲
１ａを包含する範囲にレーザビーム７を照射するように
したので、加工点３ａと加工点近傍との温度差が小さく
なシ、熱ひずみが小さくなシ、割れやクラックを発生す
ることなく脆性材料を加工することができるという効果
がある。According to the embodiment described above, an electron beam! : Since the laser beam 7 is irradiated to the range including the Q radiation range 1a, the temperature difference between the processing point 3a and the vicinity of the processing point is small, the thermal strain is small, and cracks and cracks occur. This has the effect of allowing brittle materials to be processed without any problems.
以下、板厚１１１１１１１のアルミナセラミックスに穴
加工する具体例によってｉ兄明する。A specific example of drilling a hole in alumina ceramics having a thickness of 1111111 will be explained below.
従来、ビームパワー１．２ｋＷ、 ビーム径０．２８胴
の電子ビーム１を１ｍｓ照射して穴加工を行なっていだ
が、加工穴縁にクラックが発生し、良好な穴加工ができ
なかった。Conventionally, holes were drilled by irradiating the electron beam 1 with a beam power of 1.2 kW and a beam diameter of 0.28 mm for 1 ms, but cracks occurred at the edges of the drilled holes and good hole drilling was not possible.
これに対して、前記電子ビーム１を包含するように、ビ
ームパワー０．２ｋＷ、 ビーム径ｄ ＝ ２ ｍｍの
レーザビーム７を照射しながら、前記重子ビーム１で同
じ穴加工を行なったところ、加工穴縁に全くクラックの
ない穴を加工することができだ。On the other hand, when the same hole was machined using the deuteron beam 1 while irradiating the laser beam 7 with a beam power of 0.2 kW and a beam diameter d = 2 mm so as to include the electron beam 1, It is possible to machine holes with absolutely no cracks on the hole edges.
なお、本実施例においては、レーザビーム７をレーザ照
射範囲７ａに照射させるために反射鏡５ら直接様加工物
３上に照射するようにしても、本実施例と同様の効果を
奏するものである。In this embodiment, even if the laser beam 7 is irradiated directly onto the workpiece 3 from the reflecting mirror 5 in order to irradiate the laser irradiation range 7a, the same effect as in this embodiment can be obtained. be.
以上群−；’ｌ！Ｉ Ｋ説明したように本発明によれば
、割れやクラックを発生することなく脆性材料を加工す
ることができる電子ビーム加工法を提供することができ
る。The above group-;'l! IK As described, according to the present invention, it is possible to provide an electron beam processing method that can process brittle materials without generating cracks or cracks.
第１図は、本発明の一実施例に径る成子ビーム加工法の
実施に供せられる加工装置の一例を示す略示図、第２図
は、嬉１図における被加工物の加季
傍点近傍の詳、・１１を示す容部平面図である。
１・・・肩；子ビーム、１ａ・・・電子ビーム照射範囲
、３・・・被加工物、３ａ・・・加工点、７・・・レー
ザビーム、７ａ・・・１／−ザビーム照射範囲、ｄ・・
・レーザビームのビーム径。
茅ｌ 目
＄２ 目FIG. 1 is a schematic diagram showing an example of a processing device used for carrying out the laser beam processing method according to an embodiment of the present invention, and FIG. It is a plan view of the container part showing details of the vicinity. 1... Shoulder; Child beam, 1a... Electron beam irradiation range, 3... Workpiece, 3a... Processing point, 7... Laser beam, 7a... 1/- the beam irradiation range , d...
・Beam diameter of laser beam. Eyes $2
Claims (1)
、との破子ビームの照射範囲を包含する範囲にレーザビ
ームを照射することにょシ、前記加工点と加工点近傍と
の温度差が前記被加工物に割れやクランクを生せしめな
い程度に小さくなるように加熱しながら、前記餉、子ビ
ームによって前記加工点を加工するようにしたことを特
徴とする電子ビーム加工法。1. In addition to irradiating the processing point of the workpiece with an electron beam, the laser beam is irradiated to a range that includes the irradiation range of the shako beam, and the temperature difference between the processing point and the vicinity of the processing point is An electron beam machining method characterized in that the machining point is machined using the bar and the beam while heating the workpiece to the extent that cracks or cranks are not generated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58180157A JPS6072688A (en) | 1983-09-30 | 1983-09-30 | Electron beam working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58180157A JPS6072688A (en) | 1983-09-30 | 1983-09-30 | Electron beam working method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6072688A true JPS6072688A (en) | 1985-04-24 |
Family
ID=16078390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58180157A Pending JPS6072688A (en) | 1983-09-30 | 1983-09-30 | Electron beam working method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072688A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2313231A4 (en) * | 2008-07-09 | 2017-04-05 | Fei Company | Method and apparatus for laser machining |
-
1983
- 1983-09-30 JP JP58180157A patent/JPS6072688A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2313231A4 (en) * | 2008-07-09 | 2017-04-05 | Fei Company | Method and apparatus for laser machining |
| US10493559B2 (en) | 2008-07-09 | 2019-12-03 | Fei Company | Method and apparatus for laser machining |
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