JP2724192B2 - Laser processing method of film coating material - Google Patents

Description

Description of the Invention [Object of the Invention] (Industrial application field) The present invention relates to a laser processing method of film coating for cutting a film coating material such as a vinyl coating material by laser.

(Prior art) Conventionally, as a laser processing method of performing laser cutting on a vinyl coating material as a film coating material with a laser processing machine, for example, a laser beam condensed by a condenser lens is defocused, and only vinyl is first used. Is melted and then the focusing lens is focused to cut the base material, or if laser processing is performed at once, the laser gas enters between the vinyl and the base material. Methods are known.

(Problems to be Solved by the Invention) By the way, in the former method described above, in the former method, the focus of the condenser lens is defocused, the vinyl is first melted, and then the base material is focused to cut the base material. For,
There is a problem that the laser processing time is about twice as long as the normal laser time.

Further, the latter method has a problem that the base material is damaged and that vinyl must be reattached to the base material in a later process.

SUMMARY OF THE INVENTION An object of the present invention is to provide a laser processing method for a film coating material in which the laser cutting of the film coating material is performed in a shorter time than in the past without peeling the film.

[Constitution of the Invention] (Means for Solving the Problems) In view of the above-described conventional problems, the present invention provides a laser beam irradiation method for irradiating a laser beam to a film coating material having a base material coated with a film. When performing, the vicinity of the periphery of the laser beam oscillated from the laser oscillator is focused in a ring shape with an intensity enough to melt the film, the vicinity of the center of the laser beam, the base material of the film coating material The film is melted and cut by the ring-shaped light-collecting portion at the same time as the light-collecting portion in the center while having sufficient strength to melt and cut the film at the center of the ring-shaped light-collecting portion. A laser processing method for a film coating material, wherein the base material is melt-cut with a cutting width smaller than a cutting width of the film.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 4, the laser processing machine 1 guides, for example, a vinyl coating material W as a film coating material on a fixed XY table 3 laid horizontally, and applies the vinyl coating material W with a laser beam LB. This is to cut by heat.

The laser beam LB is oscillated by a laser oscillating device 5 provided in the machine body of the laser beam machine 1, and is guided to a processing head 11 via an intensity adjusting device 7 and a reflecting mirror 9. Processing head 11
Is provided with a condensing lens 13, and the laser beam LB is condensed by the condensing lens 13, and thermally cuts the work W at the focal position. Also, the work W is gripped by the clamp 15,
XY so that the position to be cut is directly under the processing head 11.
The table is horizontally moved on the table 3.

The clamp 15 is driven in the plane X and Y directions by an XY-axis servomotor while holding the workpiece W. The processing head 11 is driven vertically by a Z-axis servomotor. In addition, laser processing machine 1 has NC
A device 17 is provided, and a so-called manual pulse generator 19 is provided on the operation unit of the NC device.

With the above configuration, the laser beam LB oscillated by the laser oscillator 5 is bent by the reflecting mirror 9 via the intensity adjusting device 7 and further condensed by the condensing lens 13. The laser beam LB focused by the focusing lens 13 is a vinyl coating material W
In addition, the vinyl coating material W clamped by the clamp 15 is moved and positioned in the X and Y directions by controlling the NC device 17 so that a thermal cutting process is performed at a desired position of the vinyl coating material W. Will be done.

The condenser lens 13 is composed of a combination lens,
FIG. 1 shows a state in which the laser beam LB condensed by the condensing lens 13 is applied to the vinyl coating material W and cut by the laser beam.

That is, in FIG. 1, plastic coating material W from the matrix W _1, is made from the base material W ₁ on the tensioned plastic W ₂ Prefecture. The condenser lens 13 is a flat lens 13A.
A convex lens 13B provided on the plane lens 13A on the side of incidence of the laser beam LB (upper side in FIG. 1);
It is composed of a combination lens composed of a concave lens 13C isolated on the emission side (lower side in FIG. 1) of the laser beam LB of the plane lens 13A.

With the above configuration, the flat lens 13 of the condenser lens 13
The laser beam LB incident on the combination lens of A and the convex lens 13B has a state of thermal intensity distribution as shown in FIG. 2 (A). In this state, the laser beam LB is
When the laser beam LB1 having a weak thermal intensity distribution shown in FIG.
And a laser beam LB2 having a strong thermal intensity distribution shown in FIG. 2 (C).

This weak laser beam LB1 goes straight without being focused by the plane lens 13A, becomes ring-shaped when viewed from the side where the laser beam LB is incident, and is focused through the concave lens 13C. On the other hand, the laser beam LB2, which has a strong thermal intensity distribution focused from the curved surface, has a concave lens 1 before it is completely focused.
It is incident on 3C and is completely collected.

Moreover, the positions connecting the focal positions of the laser beam LB1 having a weak thermal intensity distribution and the strong laser beam LB2 are different. Further, the laser beam LB1 having a weak heat intensity distribution is located on a circumference separated from the strong laser beam LB2 and having the same center as the strong laser beam LB1.

And Thus, among the strong laser beam LB2 weak laser beam LB1 heat intensity distribution on the same circle on, firstly, a weak laser beam LB1 is located in a ring shape melts the plastic W _2.
To melt the plastic W ₂ is sufficient in this weak laser beam LB1. Next, the strong laser beam LB located in the center
2 As is shown in FIG. 3 by cutting smoothly only preform W _1, vinyl W ₂ is the cutting width L _1, preform W ₁ is cutting width L ₂ (L ₂
<L ₁ ).

Thus, using a combination lens for the condenser lens 13,
By this irradiating the plastic coating material W with the laser beam LB are divided into strong laser beam L2 weak laser beam L1 heat intensity distribution, it can be performed cutting of the molten and the matrix W ₁ vinyl W ₂ at the same time.

Accordingly, without damaging the plastic W _2, also it can be performed off of the plastic coating material W in a short time. In addition, the need to re-tension the vinyl W ₂ in a later step is eliminated.

The present invention is not limited to the above-described embodiment, but can be embodied in other modes by making appropriate changes. In this embodiment, a vinyl coating material has been described as an example of the film coating material, but any other film may be used.

[Configuration of the Invention] As can be understood from the above description of the embodiments, in short, the present invention provides a laser processing method in which a laser beam is applied to a film coating material obtained by coating a film on a surface of a base material. In the vicinity of the periphery of the laser beam oscillated from the oscillator, the light is focused in a ring shape with an intensity enough to melt the film, and in the vicinity of the center of the laser beam, the base material of the film coating material is melted and cut. Focus the light into a point at the center of the ring-shaped light-collecting portion with sufficient strength and melt and cut the film with the ring-shaped light-collecting portion, and at the same time, cut the film with the light-collecting portion at the center. This is a laser processing method of a film coating material for melting and cutting the base material with a smaller cutting width.

As is clear from the above configuration, in the present invention, the vicinity of the periphery of the laser beam is converged in a ring shape with an intensity enough to melt-cut the film coated on the base material, and the vicinity of the center of the laser beam is The light is focused in a point-like manner at the center of the ring-shaped light-collecting portion with sufficient strength to melt-cut the base material. Then, the film is melt-cut by the ring-shaped light-collecting portion, and at the same time, the base material is melt-cut by the dot-shaped light-collecting portion at the center with a cutting width smaller than the cutting width of the film. .

Therefore, according to the present invention, the base material is melted and cut at the same time as the melted and cut portion of the film by the ring-shaped light-collecting portion, and the laser processing of the film coating material can be efficiently performed. is there.

At this time, since the melt cutting width of the base material is smaller than the melt cutting width of the film, it is possible to perform a good cutting without causing a heat effect to carbonize the film at the time of melting cutting of the base material. Can be done.

[Brief description of the drawings]

FIG. 1 shows a main part of the present invention, and is an explanatory view showing a state in which a laser beam condensed by a condenser lens is applied to a film coating material, and FIGS. 2 (A), (B) and (C). ) Is a diagram showing a thermal intensity distribution state of a laser beam, FIG. 3 is a plan view showing a state in which vinyl is melted and a base material is cut by this embodiment, and FIG. 4 is an embodiment embodying the present invention. It is a side view of an example laser beam machine. Reference Signs List 1 laser processing machine 13 condensing lens 13A flat lens 13B convex lens 13C concave lens LB laser beam LB1 laser beam with low heat intensity distribution LB2 laser beam with high heat intensity distribution W vinyl coating material W ₁ … vinyl, W ₂ … base material

Claims (1)

(57) [Claims] When performing laser processing by irradiating a laser beam to a film coating material in which a film is coated on a surface of a base material, the vicinity of a peripheral portion of a laser beam oscillated from a laser oscillator is melted so as to melt the film. Focused in a ring shape with the intensity of, near the center of the laser beam,
At the same time strong enough to melt-cut the base material of the film coating material and focused into a point at the center of the ring-shaped light-collecting portion, and simultaneously melting and cutting the film by the ring-shaped light-collecting portion A laser processing method for a film coating material, wherein the base material is melt-cut with a cutting width smaller than a cutting width of the film by a central condensing portion.