JPS6071170U - Parts mounting mechanism - Google Patents
Parts mounting mechanismInfo
- Publication number
- JPS6071170U JPS6071170U JP16384983U JP16384983U JPS6071170U JP S6071170 U JPS6071170 U JP S6071170U JP 16384983 U JP16384983 U JP 16384983U JP 16384983 U JP16384983 U JP 16384983U JP S6071170 U JPS6071170 U JP S6071170U
- Authority
- JP
- Japan
- Prior art keywords
- mounting mechanism
- parts mounting
- circuit board
- printed circuit
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の部品取付構造を示す断面図、第２図はこ
の考案の一実施例である部品取付構造を示す断面図であ
る。
図中１はプリント基板、２は銅箔パターン、３は半田レ
ジストマスク、４は半田、５はリードレス部品電極、６
はリードレス部品素体、７は接着剤、８は銅箔パターン
、９はすず膜である。なお、図中、同一符号は同一ある
いは相当する部分を示すものとする。FIG. 1 is a sectional view showing a conventional component mounting structure, and FIG. 2 is a sectional view showing a component mounting structure which is an embodiment of this invention. In the figure, 1 is a printed circuit board, 2 is a copper foil pattern, 3 is a solder resist mask, 4 is solder, 5 is a leadless component electrode, 6
1 is a leadless component body, 7 is an adhesive, 8 is a copper foil pattern, and 9 is a tin film. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
し、半田付けするものにおいて、上記プリント基板上の
接着剤塗布部に捨てパターンを設け、このパターン上に
半田より高融点の金属膜を形成したことを特徴とする部
品取付機構。In devices where leadless components are temporarily attached to a printed circuit board via adhesive and soldered, a sacrificial pattern is provided in the adhesive application area on the printed circuit board, and a metal film with a higher melting point than the solder is formed on this pattern. A parts mounting mechanism characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16384983U JPS6071170U (en) | 1983-10-21 | 1983-10-21 | Parts mounting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16384983U JPS6071170U (en) | 1983-10-21 | 1983-10-21 | Parts mounting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6071170U true JPS6071170U (en) | 1985-05-20 |
Family
ID=30359385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16384983U Pending JPS6071170U (en) | 1983-10-21 | 1983-10-21 | Parts mounting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6071170U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031470U (en) * | 1989-05-22 | 1991-01-09 |
-
1983
- 1983-10-21 JP JP16384983U patent/JPS6071170U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031470U (en) * | 1989-05-22 | 1991-01-09 |
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