JPS6047981B2 - Jig for detecting internal temperature of horizontal heat treatment furnace - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a jig for detecting temperature inside a horizontal heat treatment furnace.

As a method for diffusing impurities into semiconductor wafers, there is a method in which a plurality of semiconductor wafers are arranged in an upright manner inside a horizontal heat treatment furnace, and impurity gas is introduced into the furnace to perform the diffusion treatment.

By the way, the temperature distribution inside such a horizontal heat treatment furnace is not necessarily uniform. In heat treatment, treatment temperature is one important factor that determines quality, and it is necessary to accurately understand the temperature distribution state in the furnace for quality control. Conventionally, temperature inside a heat treatment furnace has been detected by placing a quartz tube containing a thermocouple at the bottom of the furnace and moving the tube or thermocouple.

However, the temperature inside the heat treatment furnace differs depending on whether there are semiconductor wafers to be processed and a wafer holding jig inside, and it is important to know for quality control whether there are semiconductor wafers inside the furnace or not. Although this is the temperature state when there are wafers and wafer holding jigs, conventionally the temperature distribution has only been carried out when there are no wafers or the like in the furnace. Therefore, it is an object of the present invention to provide a jig that can measure the temperature inside a horizontal heat treatment furnace under the same conditions as when a semiconductor wafer and a wafer holder are inserted into the horizontal heat treatment furnace.

One embodiment of the present invention to achieve the above object is a horizontal heat treatment furnace in which a plurality of wafers are heat-treated in a state in which the wafers are stood upright and are housed with wafer holders arranged perpendicularly to the main surfaces of the wafers. In the internal temperature detection jig, a dummy holder that has the same thermal conductivity as the wafer holder and can hold a plurality of wafers upright and arranged in a direction perpendicular to the main surface of the wafers; It consists of a plurality of dummy wafers having almost the same shape and thermal conductivity as the wafer 5 held in each holding part, and a quartz tube attached to the dummy wafer in a direction perpendicular to the main surface of the plurality of dummy wafers. , is characterized in that the thin tube has a built-in thermocouple temperature detection device.

The present invention will be explained below with reference to Examples.

Figures 1 to 3 show one embodiment of the present invention, in which Figure 1 is a sectional view of the main part of the heat treatment furnace in a temperature measuring state, Figure 2 is a front view of the temperature detection jig, and Figure 3 is a front view of the temperature detection jig. The figure is a perspective view of the temperature detection jig. A dummy holder 1 holds a dummy wafer in an upright state, and a dummy wafer 2 (for example, a semiconductor wafer) is held in the dummy holder 1 and has a hole in its center for passing a quartz tube.

3 is each quartz tube inserted into the through hole of the tummy wafer 2,
4a to 4c are thermocouples for temperature detection inserted into the quartz tube, 4a is a thermocouple for detecting the temperature in the inner part of the furnace;
A thermocouple b is used to detect the temperature at the center of the furnace, and a thermocouple 4c is used to detect the temperature near the entrance and exit of the furnace.

5 is horizontal heat treatment.

6 is a heater.

This kind of temperature detection jig is constructed in almost the same way as the semiconductor wafer and its holder, which are the objects to be processed, so even if it is inserted into the heat treatment furnace, it maintains the same temperature inside the furnace as during heat treatment. do.

Therefore, with this jig, it is possible to detect the temperature state inside the furnace during heat treatment.
2. If it is desired to grasp the temperature distribution state more precisely, temperature measurement is performed by changing the temperature detection position by moving a thermocouple or a quartz tube. In this embodiment, a quartz tube containing a thermocouple for temperature detection is inserted into a through hole in the center of the semiconductor wafer, so it is suitable for understanding the temperature distribution state near the center of the semiconductor wafer. As shown in FIG. 4, it is also possible to implement the method in such a manner that a quartz tube passes through the periphery of the semiconductor wafer so that the state of temperature distribution in the periphery of the semiconductor wafer can be grasped.

The number of thermocouples inserted into the quartz tube does not need to be limited to three, and can be any number.

If there is only one thermocouple, the temperature distribution can be detected by moving the thermocouple. However, in the case of a plurality of thermocouples, it is possible to detect the temperature distribution state during sawing by changing the positions of the built-in thermocouples.

As described above, according to the present invention, the temperature distribution state can be detected under the same conditions as during heat treatment by using as a temperature detection jig a device having almost the same structure as the wafer that is the object to be processed and its holder. This enables good quality control.

[Brief explanation of the drawing]

Figures 1 to 3 show one embodiment of the present invention, in which Figure 1 is a sectional view of the main part in a temperature measurement state, Figure 2 is a front view of the temperature detection jig, and Figure 3 is a temperature detection jig. It is a perspective view of a detection jig. FIG. 4 is a front view of a temperature detection jig according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Dummy holder, 2... Tummy wafer, 3... Quartz capillary, 4a-4c... Thermocouple, 5
...Horizontal heating furnace, 6...Heater.

Claims (1)

[Claims] 1. In a jig for detecting the internal temperature of a horizontal processing furnace in which a plurality of wafers are heat-treated with a wafer holder arranged vertically vertically to the main surface of the wafers inside, the jig has the same thermal conductivity as the wafer holder. A dummy holder that can hold multiple wafers upright and arranged in a direction perpendicular to the main surface of the wafers; each holding part of this dummy holder has approximately the same shape and thermal conductivity as the above-mentioned wafers. It consists of a plurality of dummy wafers having the same temperature and a quartz capillary tube attached to the dummy wafer in a direction perpendicular to the main surface of the plurality of dummy wafers, and a thermocouple for temperature detection is built into the capillary tube. A jig for detecting the internal temperature of horizontal heat treatment.