JPS6047331A - Impregnated type cathode - Google Patents
Impregnated type cathodeInfo
- Publication number
- JPS6047331A JPS6047331A JP58155574A JP15557483A JPS6047331A JP S6047331 A JPS6047331 A JP S6047331A JP 58155574 A JP58155574 A JP 58155574A JP 15557483 A JP15557483 A JP 15557483A JP S6047331 A JPS6047331 A JP S6047331A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- cathode substrate
- electron emission
- cylindrical body
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/13—Solid thermionic cathodes
- H01J1/20—Cathodes heated indirectly by an electric current; Cathodes heated by electron or ion bombardment
- H01J1/28—Dispenser-type cathodes, e.g. L-cathode
Landscapes
- Solid Thermionic Cathode (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は含浸壁カソードに関するものである。[Detailed description of the invention] The present invention relates to impregnated wall cathodes.
含浸をカソードは、高電流密度を得るCとかで@、かつ
、長寿命であることなどのため、進行波管、クライスト
ロン、CRT等の主要電子管の陰極として用いられてい
る。The impregnated cathode is used as the cathode of major electron tubes such as traveling wave tubes, klystrons, and CRTs because it has a high current density, such as C, and has a long life.
第1図はかかる含浸型カソードの構造全説明するための
模式的な断面図である。タングステン粉末を焼結して形
成された多孔質の陰極基体lが、例えばモリブデンの様
な耐熱性金属からなる円筒状のカソードスリーブ2にろ
う材4tl−用いてろう付されている。また、前記陰極
基体1の裏面は、ろう材4會用いて封孔処理が行なわれ
ている。一方、陰極基体1の空孔中には酸化バリウム1
酸化カルシウム及び酸化アルミニウム等からなる電子放
射物質(図示せず)が含浸されている。陰極基体lはヒ
ーター3により所定の温度に加熱され、表面から電子全
放出する。FIG. 1 is a schematic sectional view for explaining the entire structure of such an impregnated cathode. A porous cathode substrate 1 formed by sintering tungsten powder is brazed to a cylindrical cathode sleeve 2 made of a heat-resistant metal such as molybdenum using a brazing material 4tl. Further, the back surface of the cathode substrate 1 is sealed using four fillers of brazing material. On the other hand, barium oxide 1 is present in the pores of the cathode substrate 1.
It is impregnated with an electron emitting material (not shown) made of calcium oxide, aluminum oxide, etc. The cathode substrate 1 is heated to a predetermined temperature by the heater 3, and all electrons are emitted from the surface.
かかる構成の含浸型カソードにおいて、陰極基体1の裏
面全封孔処理する理由は、前述の電子放射物質が蒸発し
てヒーターコイルに付着することを防+hするためであ
る。In the impregnated cathode having such a configuration, the reason why the back surface of the cathode substrate 1 is completely sealed is to prevent the above-mentioned electron emitting substance from evaporating and adhering to the heater coil.
さて、この様なろう付及び封孔処理は、通常、Mo 5
0wt %−Ru 40wt %の粉末全適当なバイン
ダー、例えば硝化綿と酢酸アミルの混合ラッカー音用い
て混練したものを陰極基体1の裏面に塗布(7て還元性
算囲気あるいは不活性雰囲気中で2050〜2100℃
に加熱して行なわれている。しかるに陰極基体1は通常
18〜20チの連続気孔?有する多孔質であるため、ろ
う材が溶融した時に陰極基体中に相当量が吸収され、陰
極基体lとスリーブ2の間に空隙が生じる不都合があっ
た。Now, such brazing and sealing treatment is usually performed using Mo5
A powder of 0 wt % - 40 wt % Ru, mixed with a suitable binder, such as a mixed lacquer of nitrified cotton and amyl acetate, is applied to the back side of the cathode substrate 1 (7. ~2100℃
This is done by heating. However, the cathode substrate 1 usually has 18 to 20 continuous pores. Due to its porous nature, when the brazing filler metal is melted, a considerable amount is absorbed into the cathode substrate, creating an inconvenience that a void is created between the cathode substrate 1 and the sleeve 2.
一方、ろう材會多量に塗布し過ぎると、陰極基体1の奥
深くまでろう材が浸入したり、あるいは陰極の表面、即
ち1gL子放耐放射cまでろう材が流れたりする不都合
があった。特に、第1図に示す様に、陰極表面が凹我の
場合には、中央部付近の電子放射物質の含浸量が少なく
なる恐れがあった。On the other hand, if too much brazing material is applied, there is an inconvenience that the brazing material may penetrate deep into the cathode substrate 1 or may flow to the surface of the cathode, that is, to the 1 gL radiation resistance c. In particular, as shown in FIG. 1, when the cathode surface is concave, there is a risk that the amount of electron emitting material impregnated near the center may be reduced.
本発明は以上の不都合を克服するためになされたもので
、陰極基体の裏面に、該基体と一体に構成された中空円
筒全形成し、該中空円筒の外部に相当する陰極基体の裏
面上のみにろう材を塗布してろう付、及び封孔処理を行
なうことを特徴とし。The present invention has been made in order to overcome the above-mentioned disadvantages, and a hollow cylinder integrally formed with the cathode substrate is entirely formed on the back surface of the cathode substrate, and only on the back surface of the cathode substrate corresponding to the outside of the hollow cylinder. It is characterized by applying brazing filler metal to perform brazing and sealing.
その目的は陰極基体の中央部付近へのろう材の浸入全排
除することによって中央部付近の電子放射材料の含浸不
足全解消することにある。The purpose of this is to completely eliminate the infiltration of the brazing filler metal into the vicinity of the central part of the cathode substrate, thereby completely eliminating the lack of impregnation of the electron emitting material in the vicinity of the central part.
以下、図面を用いて実施例について説明する。Examples will be described below with reference to the drawings.
第2図は本発明にかかる含浸型カソードの要部断面図で
ある。同図中1〜4は第1図と共通するので同一番号を
符して説明全省略する。第2図、5け陰極基体1と一体
構成でれた中空円筒体であり、ろう材4は、陰極基体l
の裏面のうち、中空円筒体5の外側部のみに塗布しであ
る。FIG. 2 is a sectional view of essential parts of the impregnated cathode according to the present invention. 1 to 4 in the same figure are the same as those in FIG. 1, so the same numbers are used and a complete explanation will be omitted. FIG. 2 shows a hollow cylindrical body integrally constructed with a 5-digit cathode substrate 1, and the brazing material 4 is connected to the cathode substrate l.
It is applied only to the outer side of the hollow cylindrical body 5 on the back side of the hollow cylinder 5.
この様な構造から、陰極基体1の肉厚が最も小さい中央
部付近の封孔処理が不要になるため、ろう材の浸入によ
る電子放射材料の含浸不足全解消することができ、より
均一な電子放射特性を有する陰極全提供することができ
た。This structure eliminates the need for sealing near the center of the cathode substrate 1, where the wall thickness is the smallest, which makes it possible to completely eliminate insufficient impregnation of the electron emitting material due to infiltration of the brazing filler metal, and to achieve more uniform electron emission. A cathode with radiation properties could be provided.
更に本発明の別の効果として、ヒーグーコイルがスリー
ブ2と中空円筒体5の内部に挿入されているため、従来
の構造に較べて熱伝導効率が向上した。Furthermore, as another effect of the present invention, since the He-Goo coil is inserted inside the sleeve 2 and the hollow cylindrical body 5, the heat conduction efficiency is improved compared to the conventional structure.
第1図は従来の含浸型カソードの断面図、第2図は本発
明による含浸型カソードの断面図である。
]・・・・・・陰極基体、2・・・・・・カソードスリ
ーブ、3・・・・・・ヒーター、4・・・・・・ろう材
、5・・・・・・中空円筒体。
第1 ノ
第2図FIG. 1 is a sectional view of a conventional impregnated cathode, and FIG. 2 is a sectional view of an impregnated cathode according to the present invention. ]... Cathode base, 2... Cathode sleeve, 3... Heater, 4... Brazing material, 5... Hollow cylindrical body. Figure 1-2
Claims (1)
ソードスリーブを有する傍熱グイプの含浸型カソードに
おいて、前記多孔質タングステン基体の裏面に、該多孔
質タングステン基体と一体に構成された中空円筒体を形
成し、#中空円筒体とカソードスリーブに囲まれる部分
の多孔質タングステン基体の裏面のみを封孔処理したこ
とを特徴とする含浸型カソード。In an impregnated cathode of an indirectly heated type having a porous tungsten base and a cylindrical cathode sleeve made of a heat-resistant metal, a hollow cylindrical body integrally formed with the porous tungsten base is formed on the back surface of the porous tungsten base. An impregnated cathode characterized in that only the back surface of the porous tungsten substrate in the portion surrounded by the hollow cylinder and the cathode sleeve is sealed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58155574A JPS6047331A (en) | 1983-08-25 | 1983-08-25 | Impregnated type cathode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58155574A JPS6047331A (en) | 1983-08-25 | 1983-08-25 | Impregnated type cathode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6047331A true JPS6047331A (en) | 1985-03-14 |
Family
ID=15609019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58155574A Pending JPS6047331A (en) | 1983-08-25 | 1983-08-25 | Impregnated type cathode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6047331A (en) |
-
1983
- 1983-08-25 JP JP58155574A patent/JPS6047331A/en active Pending
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