JPS6045918A - Production of thin film magnetic head - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION 1M) Technical Field of the Invention The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to an improvement in a method for forming an upper magnetic layer constituting a thin film magnetic head.

佽）Technological background In order to increase the recording density and efficiency of magnetic heads, their shapes and dimensions are becoming smaller and more precise, and in addition to this, mass-producible, low-cost magnetic heads It is requested.

As a magnetic head that satisfies these conditions, a compact thin-film magnetic head has been put into practical use that has a steep head magnetic field distribution that contributes to recording, can perform high-density recording, and can achieve lower costs and uniform characteristics through bulk production. Various types have been proposed.

(C) Prior art and problems By the way, the conventional thin-film magnetic belly button F' described above is shown in the top view in FIG. 1 and in the sectional view of the main part in FIG. 2 along the cutting line nn' shown in FIG. 1. As shown in FIG.
After depositing a lower magnetic layer 2 consisting of the following by a Subanok ring method or a vapor deposition method, a predetermined pattern is formed using a photolithography method, and a gap forming film 3' such as 5i02 is formed on the upper surface of the lower magnetic layer 2. An insulating layer 3 is deposited. Next, a conductor such as Cu is deposited on the surface by sputtering or vapor deposition, and then the thin film coil 4 is formed by photolithography. Next, on the insulating layer 3 including the thin film coil 4, an insulating layer 5 and an upper magnetic layer 6 are laminated in order as shown in the figure, and the upper magnetic layer 6 is further patterned into a predetermined pattern shape by photolithography. The lower magnetic layer 2 and the upper magnetic IW 6 form a gap forming film 3 in terms of a magnetic circuit.
' is formed into a U-shape.

However, in a magnetic head formed of a thin film as described above, the thickness of the stepped portions of the upper magnetic layer 6 shown by A and B in the figure is greater than that of other portions, especially the portion C of the surface facing the magnetic recording medium. The problem arises that the magnetic flux is inevitably thinner than the thickness, and during magnetic recording/reproduction, the magnetic flux is saturated before reaching the tip of the gap, especially at the stepped portion A of the upper magnetic layer 6, and the magnetic resistance increases.As a result, There was a drawback that magnetic recording/reproducing efficiency decreased.

(d) Purpose of the Invention In order to eliminate the above-mentioned drawbacks of the conventional art, the present invention makes the thickness of the upper magnetic layer constituting the thin-film magnetic head larger than the predetermined thickness at the tip of the gap. The object of the present invention is to provide a method for manufacturing a novel thin-film magnetic head that can improve magnetic recording and reproducing efficiency.

le) Structure and object of the invention According to the present invention, after a lower magnetic layer is formed on a substrate in a predetermined pattern, a coil is formed on the lower magnetic layer via a gap layer and an insulating layer. In a method for manufacturing a thin film magnetic head in which a conductive layer, an insulating layer, and an upper magnetic layer are sequentially laminated and the upper magnetic layer is patterned into a predetermined pattern, after forming the upper magnetic layer, when patterning the upper magnetic layer, After selectively depositing a resist mask layer on the tip of the upper magnetic layer, a magnetic layer is deposited on the upper magnetic layer including on the resist mask layer, and then a magnetic layer is deposited on the upper magnetic layer including on the resist mask layer. After simultaneously removing the upper magnetic layer by melting and removing the resist mask layer, the lower upper magnetic layer and the upper upper magnetic layer are removed by -
This is achieved by providing a method for manufacturing a thin film magnetic head, which is characterized in that it is patterned into a predetermined pattern shape.

(fl Embodiments of the Invention Below, embodiments of the present invention will be described in detail with reference to the drawings.

FIGS. 3 to 8 are cross-sectional views of essential parts showing an embodiment of the method for manufacturing a thin film magnetic head according to the present invention in the order of steps.

First, as shown in Figure 3, glass, crystallized glass, ceramic, alumina titanium carbide (^1203
On a substrate 11 that also serves as a slider made of Ti-C) or the like,
Amorphous such as Co-Zr, or permalloy (Ni)
After depositing the lower magnetic layer 12 made of polycrystalline material such as -Fe) by sputtering, vapor deposition, or plating,
A predetermined pattern is formed using photolithography. Next, on the upper surface of the lower magnetic layer 12, 5t02, A120 a
The insulating layer 13 including the gap forming film 13' made of
It is deposited by a sputtering method or the like and patterned into a predetermined pattern. Then Cu or Al5Au is applied to the surface.
After a conductor such as the above is deposited by a sputtering method, a vapor deposition method, or the like, a thin film or coil 14 is formed by a photolithography method.

Thereafter, on the insulating layer 13 including the thin film coil 14, an insulating material [15] made of 5T(h), A120a, etc., and an amorphous material such as Co-Zr, or permalloy (
The upper magnetic layer 16 is made of polycrystalline material such as Ni-Fe).
For example, on the 0th order upper magnetic layer 16 which is laminated in order as shown in the figure by a sputtering method or a vapor deposition method, etc.
2 After applying the resist film, hard beta treatment is performed,
Furthermore, a titanium (Ti) film is deposited on the upper surface, and the titanium film is patterned into a predetermined pattern by plasma etching using a reactive gas of CF4+02 (10%), using the titanium film pattern 17 as a mask. Continued 02
The ^Z resist film is etched by plasma etching using gas to form a resist mask 1i111B at the tip of the gap on the upper magnetic layer 16.

Next, as shown in FIG. 4, the resist mask film 18 is
A second upper magnetic layer 19 made of an amorphous material such as Co--Zr or a polycrystalline material such as permalloy (Ni--Fe) is formed on the upper magnetic layer 16 by sputtering, vapor deposition, or the like. Then, as shown in FIG. 5, the second upper magnetic layer 1 is formed on the resist mask film 18.
9 is removed at the same time by dissolving and removing the resist mask film 18 with a solvent or the like.

Thereafter, as shown in FIG. 6, for example, a titanium film 20 and an aluminum (^l) film 21 are deposited on the upper surfaces of the upper magnetic layer 16 and the second upper magnetic layer 19, and then an aluminum (^l) film 21 is deposited. ) II! 21 is patterned into a predetermined pattern by ordinary photolithography.

Next, using the aluminum film 21 as a mask, the exposed titanium film 20 is patterned by plasma etching using a reactive gas of CF4+02 (10%). And the above-mentioned arthrotonic film 21 and titanium film 20
Using the pattern as a mask, the upper magnetic layer 16 and the second
The upper magnetic layer 19 is all at once patterned into a predetermined shape by ion milling. After that, the aluminum 1ii21 was selectively removed, and the titanium 1m! Protect 20 patterns! Use it as is as 22. Next, as shown in FIG. 7, when the medium facing surface is formed using the lower magnetic layer 112, the thickness of the upper magnetic layer 16 is adjusted to a predetermined thickness at the tip of the gap and the thickness at other parts as shown in FIG. Since it is possible to make the film thicker, especially at the step portion, the conventional magnetic flux saturation phenomenon is eliminated, and a thin film magnetic head with good magnetic recording and reproducing efficiency can be obtained.

(Effects of the Invention As is clear from the above explanation, according to the method for manufacturing a thin film magnetic head according to the present invention, the thickness of the upper magnetic layer 16 can be adjusted to
Since the thickness of other parts, especially the step part, can be made thicker than the predetermined film thickness at the tip of the gap, the conventional saturation phenomenon caused by an increase in magnetic flux density at the step part of the upper magnetic layer is eliminated. Therefore, it becomes possible to obtain a thin film magnetic head with excellent magnetic recording/reproducing efficiency. Therefore, it is extremely effective when applied to the manufacture of various step-type thin film magnetic heads.

[Brief explanation of the drawing]

FIG. 1 is a top view illustrating a conventional method for manufacturing a thin film magnetic head, FIG. 2 is a cross-sectional view taken along the cutting line shown in FIG. 1, and FIGS. l! FIG. 3 is a cross-sectional view of a main part showing an example of a method for manufacturing a film magnetic head in the order of steps. In the drawing, 11 is a substrate, 12 is a lower magnetic layer, 13.
15 is an insulating layer, 13' is a gap forming film, 14 is a thin film coil, 16 is an upper magnetic layer, 17 is a titanium film pattern, 1
8 is a resist mask film, 19 is a second upper magnetic layer, 20
21 is a titanium film, 21 is an aluminum film, and 22 is a protective layer. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] After depositing the lower magnetic layer on the substrate in a predetermined pattern,
A method for manufacturing a thin film magnetic head, comprising sequentially laminating a coil conductor layer, an insulating layer, and an upper magnetic layer on a nucleon magnetic layer via a gap layer and an insulating layer, and further patterning the upper magnetic layer into a predetermined pattern shape. After forming the upper magnetic layer and performing patterning, a resist mask layer is selectively deposited on the tip of the upper magnetic layer, and then a resist mask layer is formed on the upper magnetic layer including the top of the resist mask layer. After depositing a magnetic layer and then simultaneously removing the upper magnetic layer on the resist mask layer by dissolving and removing the resist mask layer, the lower upper magnetic layer and the upper upper magnetic layer are removed. - A method for manufacturing a thin film magnetic head, characterized in that the head is patterned into a predetermined pattern.