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JPS6042735U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6042735U
JPS6042735U JP13471283U JP13471283U JPS6042735U JP S6042735 U JPS6042735 U JP S6042735U JP 13471283 U JP13471283 U JP 13471283U JP 13471283 U JP13471283 U JP 13471283U JP S6042735 U JPS6042735 U JP S6042735U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
semiconductor
recorded
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13471283U
Other languages
Japanese (ja)
Inventor
植松　伸夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13471283U priority Critical patent/JPS6042735U/en
Publication of JPS6042735U publication Critical patent/JPS6042735U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

、　　　　第１図は従来の半導体装置の一例を示す断面
図、第２図は熱により変化した従来の半導体装置の断面
図、第３図は本考案の一実施例の断面図であり、第４図
は本考案−実施例によるステム部の平面図である。 １・…・・ペレット、２…０・ステム、３…・・壷マウ
ント材、４・・・・・・封入樹脂。, FIG. 1 is a sectional view showing an example of a conventional semiconductor device, FIG. 2 is a sectional view of a conventional semiconductor device changed by heat, FIG. 3 is a sectional view of an embodiment of the present invention, and FIG. The figure is a plan view of a stem portion according to an embodiment of the present invention. 1... Pellet, 2...0 Stem, 3... Jar mount material, 4... Encapsulating resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子搭載部が格子形状又はスリット状になってい
ることを特徴とする半導体装置。A semiconductor device characterized in that a semiconductor element mounting portion has a lattice shape or a slit shape.
JP13471283U 1983-08-31 1983-08-31 semiconductor equipment Pending JPS6042735U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13471283U JPS6042735U (en) 1983-08-31 1983-08-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13471283U JPS6042735U (en) 1983-08-31 1983-08-31 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6042735U true JPS6042735U (en) 1985-03-26

Family

ID=30303459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13471283U Pending JPS6042735U (en) 1983-08-31 1983-08-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6042735U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61265842A (en) * 1985-05-20 1986-11-25 Fujitsu Ltd semiconductor equipment
JPS62153280A (en) * 1985-12-25 1987-07-08 Dainippon Pharmaceut Co Ltd 1,4-diazacycloalkane derivative
JPH0283961A (en) * 1988-09-20 1990-03-26 Hitachi Ltd Method for manufacturing a semiconductor device, semiconductor device obtained thereby, and semiconductor wafer used therein
JPH02125651A (en) * 1988-11-04 1990-05-14 Nec Corp Lead frame

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61265842A (en) * 1985-05-20 1986-11-25 Fujitsu Ltd semiconductor equipment
JPS62153280A (en) * 1985-12-25 1987-07-08 Dainippon Pharmaceut Co Ltd 1,4-diazacycloalkane derivative
JPH0283961A (en) * 1988-09-20 1990-03-26 Hitachi Ltd Method for manufacturing a semiconductor device, semiconductor device obtained thereby, and semiconductor wafer used therein
JPH02125651A (en) * 1988-11-04 1990-05-14 Nec Corp Lead frame

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