JPS6033451U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6033451U JPS6033451U JP12384483U JP12384483U JPS6033451U JP S6033451 U JPS6033451 U JP S6033451U JP 12384483 U JP12384483 U JP 12384483U JP 12384483 U JP12384483 U JP 12384483U JP S6033451 U JPS6033451 U JP S6033451U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- recorded
- brought
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来構造を示し、第２図乃至第５図はそれぞれ
本考案の実施例を示す。なお、すべての図面において、
ａは平面図、ｂは側面図をそれぞれ示す。
１・・・樹脂部、２・・・外部リード、３・・・リード
（電 ′極部）。FIG. 1 shows a conventional structure, and FIGS. 2 to 5 each show an embodiment of the present invention. In addition, in all drawings,
A shows a plan view, and b shows a side view. 1...Resin part, 2...External lead, 3...Lead (electrode part).
Claims (1)
部に密着せしめたことを特徴とする樹脂封止型半導体装
置。A resin-sealed semiconductor device characterized in that an external lead is brought into close contact with a resin-sealed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12384483U JPS6033451U (en) | 1983-08-10 | 1983-08-10 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12384483U JPS6033451U (en) | 1983-08-10 | 1983-08-10 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6033451U true JPS6033451U (en) | 1985-03-07 |
Family
ID=30282542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12384483U Pending JPS6033451U (en) | 1983-08-10 | 1983-08-10 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033451U (en) |
-
1983
- 1983-08-10 JP JP12384483U patent/JPS6033451U/en active Pending
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