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JPS59109149U - Package for semiconductors - Google Patents

Package for semiconductors

Info

Publication number
JPS59109149U
JPS59109149U JP280383U JP280383U JPS59109149U JP S59109149 U JPS59109149 U JP S59109149U JP 280383 U JP280383 U JP 280383U JP 280383 U JP280383 U JP 280383U JP S59109149 U JPS59109149 U JP S59109149U
Authority
JP
Japan
Prior art keywords
package
lead frame
semiconductors
semiconductor
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP280383U
Other languages
Japanese (ja)
Inventor
浩司 大下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP280383U priority Critical patent/JPS59109149U/en
Publication of JPS59109149U publication Critical patent/JPS59109149U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は本考案の一実施例を示す半導体用パ
ッケージの側面図及び裏面図、第３図及び第４図は本考
案の他の実施例を示す側面図である。　　　。 １・・・封止樹脂本体、２・・・溝部、３・・・リード
フレーム。1 and 2 are side and back views of a semiconductor package showing one embodiment of the present invention, and FIGS. 3 and 4 are side views showing another embodiment of the present invention. . 1...Sealing resin body, 2...Groove portion, 3...Lead frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップをリードフレームに搭載しこれを樹脂封止
した構造の半導体用パッケージにおいて、封止樹脂本体
の底部側の周端面に溝部を′設け、前記封止樹脂本体か
ら突出する前記リードフレームの先端部を折曲して前記
溝部に当接させたことを特徴とする半導体用パッケージ
。In a semiconductor package having a structure in which a semiconductor chip is mounted on a lead frame and the lead frame is sealed with resin, a groove is provided on the peripheral end surface on the bottom side of the sealing resin body, and the tip of the lead frame protrudes from the sealing resin body. A package for a semiconductor, characterized in that a portion is bent and brought into contact with the groove portion.
JP280383U 1983-01-12 1983-01-12 Package for semiconductors Pending JPS59109149U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP280383U JPS59109149U (en) 1983-01-12 1983-01-12 Package for semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP280383U JPS59109149U (en) 1983-01-12 1983-01-12 Package for semiconductors

Publications (1)

Publication Number Publication Date
JPS59109149U true JPS59109149U (en) 1984-07-23

Family

ID=30134454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP280383U Pending JPS59109149U (en) 1983-01-12 1983-01-12 Package for semiconductors

Country Status (1)

Country Link
JP (1) JPS59109149U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197564U (en) * 1987-12-22 1989-06-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197564U (en) * 1987-12-22 1989-06-29

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