JPS60215714A - Hardening apparatus - Google Patents
Hardening apparatusInfo
- Publication number
- JPS60215714A JPS60215714A JP59074263A JP7426384A JPS60215714A JP S60215714 A JPS60215714 A JP S60215714A JP 59074263 A JP59074263 A JP 59074263A JP 7426384 A JP7426384 A JP 7426384A JP S60215714 A JPS60215714 A JP S60215714A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- thermal energy
- divided
- heated
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/06—Surface hardening
- C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〈発明の技術分野〉
この発明は、作業性を向上するようにした焼入装置に関
する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a quenching apparatus that improves workability.
〈従来技術〉
従来、溝の内周面をビーム状熱エネルギーで加熱し、熱
処理するものとして、実開昭５７−１５４７６０に第１
図のものが示されている。図のものは、被加熱材（１）
に設けられた溝（２）に加工ヘッド（６）を挿入し、レ
ーザビーム（３）をレンズ（７）で集光した熱エネルギ
を、反射鏡（８）を介して照射窓（６ａ）から溝（２）
の内周面（２ａ）に照射するようにされている。<Prior art> Conventionally, the inner circumferential surface of the groove was heated with beam-shaped thermal energy for heat treatment, and the first method was published in 1983-154760.
The one in the figure is shown. The one shown is the material to be heated (1)
The processing head (6) is inserted into the groove (2) provided in the groove (2), and the thermal energy of the laser beam (3) is focused by the lens (7) through the irradiation window (6a) via the reflecting mirror (8). Groove (2)
It is arranged to irradiate the inner peripheral surface (2a) of the.
ところが従来のものは、＃１Ｉ（２）の内周（２ａ）を
一度の工程で加熱することが不可能で、例えば内周（２
ａ）の一方と他方及び底面を加熱する複数の工程が必要
となり、作業能率の向上が困難であるという欠点があっ
た。However, with the conventional method, it is impossible to heat the inner periphery (2a) of #1I (2) in one step.
There is a drawback that a plurality of steps of heating one side and the other side and the bottom surface of a) are required, making it difficult to improve work efficiency.
また、複数回の工程による加熱では、加熱面の隣接部に
再加熱が発生しやすく、硬化後の再加熱で焼戻し軟化層
が生じ易いという問題がある。Further, in heating through multiple steps, there is a problem that reheating tends to occur in adjacent areas of the heated surface, and a temper softening layer is likely to be generated by reheating after hardening.
〈発明の概要〉
この発明は上記欠点を解消するためになされたもので、
熱エネルギー発生源から発振されたビーム状熱エネルギ
ーを分割鏡でビーム軸から所定の角度で２分割し、分割
されたビーム状熱エネルギーをそれぞれ反射鏡で溝の一
半を照射するように反射させる構成とすることにより、
作業性の向上を図るようにした焼入装置を提供する。<Summary of the invention> This invention was made to solve the above drawbacks.
A configuration in which a beam-shaped thermal energy oscillated from a thermal energy generation source is divided into two parts at a predetermined angle from the beam axis by a splitting mirror, and each divided beam-shaped thermal energy is reflected by a reflecting mirror so as to illuminate one half of the groove. By doing so,
A hardening device designed to improve workability is provided.
〈発明の実施例〉
第２図にこの発明の一実施例を示す。図において、（１
）は被加熱材、（２）は溝、（２ａ）は加熱される内周
、（３）はビーム状熱エネルギーで例えばレーザビーム
である。（４）は分割鏡で、レーザビーム（３）をビー
ム軸から４５°以上の所定の角度で２分割するように構
成されている。（５）は分割鏡（４）で分割されたそれ
ぞれのレーザビーム（３）を所定の角度で反射し、溝（
２）の−半に照射可能に配置された凸面鏡などの反射鏡
である。<Embodiment of the Invention> FIG. 2 shows an embodiment of the invention. In the figure, (1
) is the material to be heated, (2) is the groove, (2a) is the inner periphery to be heated, and (3) is beam-shaped thermal energy, for example a laser beam. (4) is a splitting mirror, which is configured to split the laser beam (3) into two at a predetermined angle of 45° or more from the beam axis. (5) reflects each laser beam (3) divided by the split mirror (4) at a predetermined angle, and the groove (
2) is a reflecting mirror such as a convex mirror arranged so as to be able to irradiate the light.
このような第２図のものは、レーザビーム（３）が溝（
２）の中央部に照射されるように被加熱材（１）が配、
置され、分割鏡（４）で２方向に分割されたレーザビー
ム（３）が、それぞれの凸面鏡（５） （５）で溝（２
）の内周（２ａ）の−半にそれぞれ照射される。したが
って、溝（２）の長手方向にレーザビーム（３）が照射
されるように、被加熱材（１）とレーザビーム（３）の
一方を移動させることにより、内周（２ａ）の加熱を１
工程で行うことができる。In the case shown in Fig. 2, the laser beam (3) is inserted into the groove (
The material to be heated (1) is arranged so as to be irradiated to the central part of 2),
The laser beam (3) is split into two directions by the split mirror (4), and the laser beam (3) is split into two directions by the convex mirror (5).
) is irradiated to the -half of the inner periphery (2a). Therefore, by moving one of the heated material (1) and the laser beam (3) so that the laser beam (3) is irradiated in the longitudinal direction of the groove (2), the inner circumference (2a) can be heated. 1
It can be done in a process.
〈発明の効果〉
以上説明したようにこの発明によれば、ビーム状熱エネ
ルギを分割鏡でビーム軸に対して所定の角度で２分割し
、分割されたビーム状熱エネルギをそれぞれ反射鏡で溝
の一半に照射する構成としたことにより、一工程で溝の
内周を加熱することができる。これにより、作業性の向
上が可能となる。<Effects of the Invention> As explained above, according to the present invention, a beam-shaped thermal energy is divided into two parts at a predetermined angle with respect to the beam axis by a splitting mirror, and each divided beam-shaped thermal energy is divided into grooves by a reflecting mirror. By irradiating one half of the groove, the inner periphery of the groove can be heated in one step. This makes it possible to improve workability.
第１図は従来のものを示す正面図、第２図はこの発明の
一実施例の正面図である。図において、（１）は被加熱
材、（２）は溝、Ｃ２ａ）は内周面、（：Ｊ）はビーム
状熱エネルギ、（４）は分割鏡１． （５）は反射鏡で
ある。
なお各図中同一符号は同−又は相当部分を示す。
代理人 大岩増雄FIG. 1 is a front view of a conventional device, and FIG. 2 is a front view of an embodiment of the present invention. In the figure, (1) is the material to be heated, (2) is the groove, C2a) is the inner peripheral surface, (:J) is the beam-shaped thermal energy, and (4) is the split mirror 1. (5) is a reflecting mirror. Note that the same reference numerals in each figure indicate the same or equivalent parts. Agent Masuo Oiwa
Claims (2)
ム状熱エネルギを照射して上記溝の内周面を焼入するも
のにおいて、上記ビーム状熱エネルギを分割鏡でビーム
軸に対して所定の角度で２分割し、分割された上記ビー
ム状熱エネルギをそれぞれ反射鏡で上記溝の一半に反射
するように構成したことを特徴とする焼入装置。(1) In a device that hardens the inner peripheral surface of the groove by irradiating the groove of the material to be heated with beam-shaped thermal energy oscillated from a thermal energy source, the beam-shaped thermal energy is directed against the beam axis using a split mirror. A hardening device characterized in that the heat energy is divided into two at a predetermined angle, and each of the divided beams of thermal energy is reflected onto one half of the groove by a reflecting mirror.
熱エネルギ源の発振出力を制御することを特徴とする特
許請求の範囲第１項記載の焼入装置。(2) The quenching apparatus according to claim 1, wherein the oscillation output of the thermal energy source is controlled so that the thermal energy impinging on the irradiation surface is substantially constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59074263A JPS60215714A (en) | 1984-04-11 | 1984-04-11 | Hardening apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59074263A JPS60215714A (en) | 1984-04-11 | 1984-04-11 | Hardening apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60215714A true JPS60215714A (en) | 1985-10-29 |
Family
ID=13542065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59074263A Pending JPS60215714A (en) | 1984-04-11 | 1984-04-11 | Hardening apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60215714A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5922224A (en) * | 1996-02-09 | 1999-07-13 | U.S. Philips Corporation | Laser separation of semiconductor elements formed in a wafer of semiconductor material |
-
1984
- 1984-04-11 JP JP59074263A patent/JPS60215714A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5922224A (en) * | 1996-02-09 | 1999-07-13 | U.S. Philips Corporation | Laser separation of semiconductor elements formed in a wafer of semiconductor material |
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