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JPH02263590A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH02263590A
JPH02263590A JP1085422A JP8542289A JPH02263590A JP H02263590 A JPH02263590 A JP H02263590A JP 1085422 A JP1085422 A JP 1085422A JP 8542289 A JP8542289 A JP 8542289A JP H02263590 A JPH02263590 A JP H02263590A
Authority
JP
Japan
Prior art keywords
heat treatment
shape
machined
cutting mode
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1085422A
Other languages
Japanese (ja)
Inventor
Kunihiko Ikuno
生野 邦彦
Tatsuo Ito
伊藤 辰雄
Masayoshi Koyama
雅義 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1085422A priority Critical patent/JPH02263590A/en
Publication of JPH02263590A publication Critical patent/JPH02263590A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To prevent hardening at machining position in a material to be machined and the development of strain caused by heat by making shape of beam for heat treatment larger than shape of beam for cutting and irradiating, at the same time or separated time, the material to be machined with two beams. CONSTITUTION:After dividing the beam 2 generated from a laser generator 1 with beam splitters 3 and 4, by condensing the beam 2 through condenser lenses 5 and 6 having different focal distance, the material 7 to be machined is irradiated with the beams for cutting mode 8 and heat treatment mode 9. In this way, the shape of the beam 9 for heat treatment is made larger than the shape of the beam 8 for cutting mode. In the technical means, at the same time, the beam 8 for cutting mode irradiates or before or after this irradiation, the beam 9 for heat treatment irradiates. By this method, the hardening at the machining position in the material 7 to be machined generated at the time of irradiation of the beam 8 for cutting mode and the strained position caused by the heat can be temperature or annealed. In this result, the development of micro-crack at the machining position can be prevented.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はレーザ加工機に関する。[Detailed description of the invention] Industrial applications The present invention relates to a laser processing machine.

従来の技術 レーザ加工機は、金属材料をはじめ樹脂材料やセラミッ
ク材料等の切断や溶接に広く活用されている。
Conventional laser processing machines are widely used for cutting and welding metal materials, resin materials, ceramic materials, and the like.

発明が解決しようとする課題 しかしながら、従来のレーザ加工機においては、高炭素
鋼等をレーザ加工すると、その熱により加工部位が焼き
入れしたごとく硬くなる。また、セラミック材等をレー
ザ加工すると、その加工部位に熱による歪ができマイク
ロクラックが生じる等の課題があった。
Problems to be Solved by the Invention However, in conventional laser processing machines, when high carbon steel or the like is laser processed, the processed portion becomes hard due to the heat, as if it had been hardened. Further, when ceramic materials and the like are processed by laser, there are problems such as distortion caused by heat and generation of microcracks in the processed area.

本発明は、レーザを照射することで生じる被加工物の加
工部位の硬化や熱による歪を解消するレーザ加工機を提
供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a laser processing machine that eliminates distortion caused by hardening and heat of a processed part of a workpiece caused by laser irradiation.

課題を解決するための手段 本発明は、レーザ加工機に切断用モードのビームと熱処
理用モードのビームを備え、前記切断用モートのビーム
ト熱処理用モードのビームを同時に被加工物の同位置に
照射することを特徴とする。
Means for Solving the Problems The present invention provides a laser processing machine with a cutting mode beam and a heat treatment mode beam, and simultaneously irradiates the beam of the cutting mode and the heat treatment mode beam onto the same position of the workpiece. It is characterized by

あるいは、切断用モードのビームか熱処理用モードのビ
ームのいずれかを照射した直後から、もう一方のビーム
を同位置に照射することを特徴とする特 作用 この技術的手段においては、切断用モードのビームを照
射すると同時、あるいはその前後に熱処理用モードのビ
ームを照射することにより、前記切断用モードのビーム
を照射した時に生じた被加工物の加工部位の硬化や熱に
よって歪んだ箇所を焼き戻す、あるいは焼きなますこと
ができる。その結果、従来、加工部位に生じた材料の硬
化や熱による歪でおきるマイクロクラック等の課題が解
決できる。
Alternatively, in this technical means, the special effect is characterized in that immediately after irradiating either the cutting mode beam or the heat treatment mode beam, the other beam is irradiated to the same position. By irradiating the heat treatment mode beam at the same time as the beam irradiation, or before and after the beam irradiation, it is possible to harden the processed part of the workpiece and temper the parts that are distorted due to heat when the cutting mode beam is irradiated. , or can be annealed. As a result, conventional problems such as microcracks caused by hardening of the material or distortion due to heat, which occur in the processed area, can be solved.

実施例 以下、本発明の実施例を図面にもとずいて説明する。な
お、各図において共通する素子には同一番号を付す。
Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings. Note that common elements in each figure are given the same numbers.

第1図は、集光レンズ5もしくわ6のいずれか一方に焦
点を合わせ、もう一方は焦点をずらせることにより、ビ
ークパワーの高い切断用モードのビーム8とピークパワ
ーの低い熱処理用モードのビーム9を作る方法を用いた
ものである。
FIG. 1 shows that by focusing on either the condenser lens 5 or the hoe 6 and shifting the focus on the other, a beam 8 in a cutting mode with a high peak power and a beam 8 in a heat treatment mode with a low peak power can be generated. This method uses the method of creating beam 9.

第1図の1は、レーザ発振器でレーザ発振器1から発振
し、たビーム2をビームスプリッタ3と4で分岐したの
ち、焦点距離の異なった集光レンズ5と6を通してビー
ムを集光することにより、切断用モードのビーム8と熱
処理用モードのビーム9を被加工物7に照射している。
1 in Fig. 1 is a laser oscillator that oscillates from a laser oscillator 1, splits a beam 2 with beam splitters 3 and 4, and then condenses the beam through condensing lenses 5 and 6 with different focal lengths. The workpiece 7 is irradiated with a beam 8 in a cutting mode and a beam 9 in a heat treatment mode.

上記実施例においては、集光レンズ5には焦点距離の短
いレンズを、集光レンズ6には焦点距離の長いレンズを
用い、被加工物7が集光レンズ3の焦点に一致するよう
に取付けである。しかしながら、被加工物7を集光レン
ズ4の焦点に一致するように取り付けることもできる。
In the above embodiment, a lens with a short focal length is used as the condensing lens 5, a lens with a long focal length is used as the condensing lens 6, and the workpiece 7 is attached so as to match the focal point of the condensing lens 3. It is. However, it is also possible to mount the workpiece 7 so that it coincides with the focal point of the condenser lens 4.

また、被加工物から集光レンズまでの取付は距離を違え
る方法を用いれば焦点距離の同じ集光レンズを使う方法
も同じ効果が得られる。
Furthermore, if the mounting distance from the workpiece to the condenser lens is changed, the same effect can be obtained by using condenser lenses with the same focal length.

さらに、上記実施例においては、被加工物7に対して、
各々の集光レンズを通過したビームの照射位置が異なっ
ているが、集光レンズを通過するビームの光軸を斜め方
向に調整できる構造を設けることで前記ビームの照射位
置は任意に設定することもできる。
Furthermore, in the above embodiment, for the workpiece 7,
Although the irradiation position of the beam passing through each condenser lens is different, the irradiation position of the beam can be arbitrarily set by providing a structure that allows the optical axis of the beam passing through the condenser lens to be adjusted in an oblique direction. You can also do it.

第2図は、非球面レンズ10により意識的に非点収差(
縦収差)を設は切断用モードのビーム部11と熱処理用
モードのビーム部12を作り被加工物7に照射する方法
を示している。
Figure 2 shows the intentional astigmatism (
A method is shown in which a beam section 11 in a cutting mode and a beam section 12 in a heat treatment mode are created and irradiated onto the workpiece 7.

第3図は、偏角プリズム13と集光レンズ14により切
断用モードのビーム15と熱処理用モードのビーム16
を作り被加工物7に照射する方法を示している。
FIG. 3 shows a beam 15 in a cutting mode and a beam 16 in a heat treatment mode using a deflection prism 13 and a condensing lens 14.
The figure shows a method for making and irradiating the workpiece 7.

以上の実施例は、切断用モードのビームと熱処理用モー
ドのビームを同時に被加工物の同位置に照射する方法と
いずれか一方のビームを照射した直後にもう一方のビー
ムを照射する方法を示した。
The above embodiments show a method of simultaneously irradiating the cutting mode beam and a heat treatment mode beam to the same position on the workpiece, and a method of irradiating the other beam immediately after irradiating one of the beams. Ta.

尚、切断用ビームにシングルモードのビームを用い、熱
処理用モードのビームにマルチモードのビームを用い、
同時にあるいは、ある時間的なタイミングを計って被加
工物に照射する方法も本発明を可能にするものである。
In addition, a single mode beam is used for the cutting beam, a multimode beam is used for the heat treatment mode,
A method in which the workpiece is irradiated simultaneously or at certain temporal timings also enables the present invention.

発明の効果 以上のように本発明はにおいては、例えば高炭素鋼等を
レーザ加工すると、その熱により加工部位が焼き入れし
たごとく硬くなったり、またセラミック材等をレーザ加
工すると、その加工部位にマイクロクラックが生じる等
の問題を解消できる。
Effects of the Invention As described above, the present invention has the following advantages: For example, when high carbon steel is processed by laser, the processed area becomes hard due to the heat, as if it were hardened, and when ceramic material is processed by laser, the processed area becomes hard. Problems such as microcracks can be solved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例のレーザ加工機の要部構成図
、第2図および第3図は本発明の異なる実施例のレーザ
加工機の要部構成図である。 1・・レーザ発振器、2・・ビーム、3.4・・ビーム
スプリッタ、5,6・・集光レンズ、7・・被加工物、
8・・切断用モードのビーム、9・・熱処理用モードの
ビーム、10・・非球面レンズ、13・・偏角プリズム
。 代理人の氏名 弁理士 粟野重孝 ほか1名第 図 第 図 第 図 2−ど−ム
FIG. 1 is a block diagram of a main part of a laser processing machine according to one embodiment of the present invention, and FIGS. 2 and 3 are block diagrams of main parts of a laser processing machine according to different embodiments of the present invention. 1. Laser oscillator, 2. Beam, 3.4. Beam splitter, 5, 6. Condensing lens, 7. Workpiece,
8. Beam for cutting mode, 9. Beam for heat treatment mode, 10. Aspherical lens, 13. Deflection prism. Name of agent: Patent attorney Shigetaka Awano and one other person

Claims (1)

【特許請求の範囲】[Claims]  切断用ビーム発生手段と、熱処理用ビーム発生手段を
具備し、被加工物面において前記熱処理用ビームの形状
を前記切断用ビームの形状より大きくするともに、前記
二つのビームを同時もしくは別個に前記被加工物に照射
することを特徴とするレーザ加工機。
A beam generating means for cutting and a beam generating means for heat treatment are provided, and the shape of the heat treatment beam is made larger than the shape of the cutting beam on the surface of the workpiece, and the two beams are simultaneously or separately generated. A laser processing machine that is characterized by irradiating the workpiece.
JP1085422A 1989-04-04 1989-04-04 Laser beam machine Pending JPH02263590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1085422A JPH02263590A (en) 1989-04-04 1989-04-04 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1085422A JPH02263590A (en) 1989-04-04 1989-04-04 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH02263590A true JPH02263590A (en) 1990-10-26

Family

ID=13858385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1085422A Pending JPH02263590A (en) 1989-04-04 1989-04-04 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH02263590A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831774A (en) * 1994-07-12 1996-02-02 Sanyo Electric Co Ltd Metal film removing and processing method and manufacture of photoelectromotive element
US5580473A (en) * 1993-06-21 1996-12-03 Sanyo Electric Co. Ltd. Methods of removing semiconductor film with energy beams
JPH091243A (en) * 1995-06-20 1997-01-07 Amada Metrecs Co Ltd Bending die, method for quenching its die and device therefor
US5728993A (en) * 1995-08-05 1998-03-17 The Boc Group Plc Laser cutting of materials with plural beams
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
CN100421860C (en) * 2001-06-21 2008-10-01 三星电子株式会社 Method and apparatus for cutting a substrate into units by scanning light
CN102319959A (en) * 2011-08-22 2012-01-18 华南理工大学 Surface microstructure-forming system based on coherent laser
WO2012105326A1 (en) * 2011-02-04 2012-08-09 三菱重工業株式会社 Welding method and welding device
WO2020246490A1 (en) * 2019-06-06 2020-12-10 株式会社アマダ Laser machining device and laser machining method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5580473A (en) * 1993-06-21 1996-12-03 Sanyo Electric Co. Ltd. Methods of removing semiconductor film with energy beams
JPH0831774A (en) * 1994-07-12 1996-02-02 Sanyo Electric Co Ltd Metal film removing and processing method and manufacture of photoelectromotive element
JPH091243A (en) * 1995-06-20 1997-01-07 Amada Metrecs Co Ltd Bending die, method for quenching its die and device therefor
US5728993A (en) * 1995-08-05 1998-03-17 The Boc Group Plc Laser cutting of materials with plural beams
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
US6660963B2 (en) 1999-11-24 2003-12-09 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
CN100421860C (en) * 2001-06-21 2008-10-01 三星电子株式会社 Method and apparatus for cutting a substrate into units by scanning light
WO2012105326A1 (en) * 2011-02-04 2012-08-09 三菱重工業株式会社 Welding method and welding device
JP2012161808A (en) * 2011-02-04 2012-08-30 Mitsubishi Heavy Ind Ltd Welding method and welding equipment
CN102319959A (en) * 2011-08-22 2012-01-18 华南理工大学 Surface microstructure-forming system based on coherent laser
WO2020246490A1 (en) * 2019-06-06 2020-12-10 株式会社アマダ Laser machining device and laser machining method
JP2020199507A (en) * 2019-06-06 2020-12-17 株式会社アマダ Laser beam machine and laser processing method

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