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JPS60208832A - Photomask and manufacture of semiconductor device using the same - Google Patents

Photomask and manufacture of semiconductor device using the same

Info

Publication number
JPS60208832A
JPS60208832A JP59065332A JP6533284A JPS60208832A JP S60208832 A JPS60208832 A JP S60208832A JP 59065332 A JP59065332 A JP 59065332A JP 6533284 A JP6533284 A JP 6533284A JP S60208832 A JPS60208832 A JP S60208832A
Authority
JP
Japan
Prior art keywords
photomask
liquid crystal
pattern
light absorption
electric field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59065332A
Other languages
Japanese (ja)
Inventor
Kazuhiko Tsuji
和彦 辻
Masahide Sugano
菅野 雅秀
Takashi Taniguchi
隆志 谷口
Shiroji Shoren
城二 勝連
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59065332A priority Critical patent/JPS60208832A/en
Publication of JPS60208832A publication Critical patent/JPS60208832A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To eliminate the necessity of preparing a different photomask for each pattern, by using a photomask in which a pattern can be changed arbitrarily by an external driving system while the photomask remains placed in an exposure unit. CONSTITUTION:Liquid crystal of melted dichromatic dye having anisotropy in absorption of visible light in the macroaxis and the brachyaxis directions such as azo-methine dye, for example, nematic liquid crystal 9 having negative dielectric anisotropy whose molecules are configurated vertically by the electric field is provided with transparent substrates 1 and 2 on both sides thereof and a photomask 10 is provided. The substrates 1 and 2 have stripe transparent electrodes 3, 4, 5 and 6. The scanning electrode 14 and the display electrode 15 are driven by an external driving system 13 such that a voltage is applied to a predetermined region of the liquid crystal whereby a pattern 16 on the photomask 10 is rendered light-transmissive.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体装置の製造に用いるフォトマスクおよび
これを用いた半導体装置の製造方法に関するものである
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a photomask used in manufacturing a semiconductor device and a method of manufacturing a semiconductor device using the photomask.

従来例の構成とその問題点 従来半導体装置の製造に用いるフォトマスクは第1図に
示すように、ガラス基板1上にj夕I定のパターンを有
するクロムなどの光じゃへい材2を形成したものを用い
ていた。かかるフットマスクは1枚のガラス基板に所定
の一種類のパターンしか形成できず、曲の種類のパター
ンが必要なときは異なるガラス基板上に形成する必要が
あった。
Structure of the conventional example and its problems As shown in FIG. 1, the conventional photomask used in the manufacture of semiconductor devices consists of forming a light blocking material 2 such as chrome having a uniform pattern on a glass substrate 1. I was using something. With such a foot mask, only one type of predetermined pattern can be formed on one glass substrate, and when patterns of different types of songs are required, it is necessary to form them on different glass substrates.

通常の半導体装置の製造には、数枚から十数枚のフォト
マスクが必要であった。また同一の露光装置を用いて、
種類の異なるパターンを半導体基板に転写する場合には
、種類が異なる毎にフォトマスクを交換し、位置合わせ
をする必要があった。
The manufacture of normal semiconductor devices requires from several to more than ten photomasks. Also, using the same exposure device,
When transferring different types of patterns onto a semiconductor substrate, it was necessary to replace the photomask and align each type of pattern.

発明の目的 本発明は、任意のパターンが書き換え可能なフォトマス
クおよびそのフォトマスクを用いた半導体装置の製造方
法を提供するものである。
OBJECTS OF THE INVENTION The present invention provides a photomask in which any pattern can be rewritten and a method for manufacturing a semiconductor device using the photomask.

発明の構成 本発明は、分子の長軸方向と短軸方向で光吸収に異方性
を持つ二色性染料を、電場により分子配列が変化する液
晶に溶解させ、前記液晶を、たとえば一方向にストライ
プ状に形成した透明4%層からなる走査電極を有する光
透過材と前記と異なる方向にストライプ状に形成した透
明導電層からなる表示電極を有する光透過材「ハ」に設
置し、線順次走査によシ、前記走査電極と表示電極間1
に電圧を印加し、所定の領域の前記液晶の光吸収率を変
化させて所定のパターンを有するフォトマスクを形成す
る。そして、所定のパターンを形成したフォトマスクの
一方から光照射を行ない、他方に設置した半導体基板に
前記フォトマスクの光吸収率の小さい領域を透過した光
を照射し、前記半導体基板に前記フォトマスクパターン
に対応したパターンを形成する方法を提供するものであ
る。
Structure of the Invention The present invention involves dissolving a dichroic dye, which has anisotropy in light absorption in the long and short axis directions of the molecule, into a liquid crystal whose molecular arrangement changes with an electric field. A light transmitting material having a scanning electrode made of a transparent 4% layer formed in a stripe shape and a display electrode made of a transparent conductive layer formed in a stripe shape in a direction different from the above. For sequential scanning, between the scanning electrode and the display electrode 1
A voltage is applied to change the light absorption rate of the liquid crystal in a predetermined region to form a photomask having a predetermined pattern. Then, light is irradiated from one side of the photomask on which a predetermined pattern has been formed, and a semiconductor substrate placed on the other side is irradiated with light that has passed through a region of the photomask with a low light absorption rate, and the semiconductor substrate is irradiated with the photomask. The present invention provides a method for forming a pattern corresponding to a pattern.

実施例の説明 第2図にもとづいて本発明の一実施例を説明する7分子
の長軸方向と短軸方向で可視光の吸収に異方性を持つ二
色性染料たとえばアゾメチン系染料を溶解した液晶、た
とえば電場により分子が垂直配列する誘電異方性が負の
ネマティック液晶9の両側に、ストライプ状透明電極3
,4および6゜6を有する透明基板1,2を形成してフ
ォトマスクとする。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be explained based on FIG. 2 A dichroic dye, such as an azomethine dye, which has anisotropy in absorption of visible light in the long axis direction and short axis direction of seven molecules is dissolved. Striped transparent electrodes 3 are placed on both sides of a nematic liquid crystal 9 with negative dielectric anisotropy in which molecules are vertically aligned by an electric field.
, 4 and 6°6 are formed to form a photomask.

前記ストライブ状透明電極3,4および5,6は、第2
図(A)に示すように二酸化41.素および酸化マグネ
シウム等の絶縁層7,8を介して多層に形成しても、第
2図(B)に示すように透明基板1,2上に所定の間隔
をおいて一層3,6で形成してもよいが高解像度パター
ンを形成するためには第2図(A)に示すように多層に
形成した方がよい。また前記透明電極は一方を走査電極
14他方を表示電極16として、線順次走査により所定
の領域の前記液晶に電圧を印加するだめ、液晶9の両側
のストライプ電極3,4および6,6は互いに直交する
ように設置する。
The striped transparent electrodes 3, 4 and 5, 6 are
As shown in Figure (A), 41. Even if it is formed in multiple layers through insulating layers 7 and 8 made of magnesium oxide and magnesium oxide, it is possible to form single layers 3 and 6 on transparent substrates 1 and 2 at a predetermined interval as shown in FIG. 2(B). However, in order to form a high-resolution pattern, it is better to form it in multiple layers as shown in FIG. 2(A). Further, the transparent electrodes have one side as a scanning electrode 16 and the other side as a display electrode 16. In order to apply a voltage to the liquid crystal in a predetermined area by line sequential scanning, the stripe electrodes 3, 4 and 6, 6 on both sides of the liquid crystal 9 are connected to each other. Install them orthogonally.

第2図(C)は前記フォトマスクの平面図で、所定の領
域の液晶に電界を印加した状態を示す。二色性染料は一
般に棒状の形状をしており、液晶分子と平行に配列して
いるため、液晶の分子配列を電場で変化させることによ
り二色性染料の分子配列も連動的に変化させることがで
きるので、染料の光吸収量を電気的に制御できる。二色
性染料としてアゾメチン系染料を用いれば、通常の写真
食刻露光に用いる超高圧水銀灯のg−1ine (43
61m )に近い43了nmの波長の吸収量を制御でき
、走査電極と表示電極間に電界印加部分たとえば第2図
(C)の点線部分のみ前記波長の光を透過させることが
できる。
FIG. 2(C) is a plan view of the photomask, showing a state in which an electric field is applied to the liquid crystal in a predetermined region. Dichroic dyes generally have a rod-like shape and are arranged parallel to the liquid crystal molecules, so by changing the molecular arrangement of the liquid crystal with an electric field, the molecular arrangement of the dichroic dye can also be changed in conjunction. This makes it possible to electrically control the amount of light absorbed by the dye. If an azomethine dye is used as a dichroic dye, g-1ine (43
It is possible to control the amount of absorption of a wavelength of 43 nm, which is close to 61 nm), and allow light of the wavelength to pass through only the portion where an electric field is applied between the scanning electrode and the display electrode, for example, the dotted line portion in FIG. 2(C).

第3図に本発明によるでオドマスク10を用いパターン
転写法による半導体装置の製造方法を示す。本発明の方
法によ多形成したフォトマスク1oを露光装置たとえば
縮小投影露光装置に設置し、フォトマスク10の1方向
から光Xを照射し、前記フォトマスク10の透過光を縮
小レンズ11で縮小投影し、半導体基板12上にフォト
マスク上のパターンを転写投影する。フォトマスク上の
パターン16は、外部の駆動系13により走査電極14
および表示電極15を駆動して、所定領域の液晶に電圧
を印加して所定領域16のみ前記光透過性とする。
FIG. 3 shows a method of manufacturing a semiconductor device by a pattern transfer method using an odomask 10 according to the present invention. The photomask 1o formed by the method of the present invention is installed in an exposure device, such as a reduction projection exposure device, and the photomask 10 is irradiated with light X from one direction, and the light transmitted through the photomask 10 is reduced by the reduction lens 11. The pattern on the photomask is transferred and projected onto the semiconductor substrate 12. The pattern 16 on the photomask is connected to the scanning electrode 14 by an external drive system 13.
Then, the display electrode 15 is driven to apply a voltage to the liquid crystal in a predetermined region to make only the predetermined region 16 transparent.

前記二色性染料は前記波長のものに限定せず他の波長の
吸収染料でもよいことはいうまでもない。
It goes without saying that the dichroic dye is not limited to those having the above-mentioned wavelengths, and may be dyes that absorb other wavelengths.

また光Xは、超高圧水銀灯以外のレーザー光でもよく、
半合体基板上の感光性樹脂の感光にも、反応性カス中で
の光反応生成物の形成にも用いることができる。
Furthermore, the light X may be a laser beam other than an ultra-high pressure mercury lamp,
It can be used both for photosensitization of photosensitive resins on semi-merged substrates and for the formation of photoreaction products in reactive scum.

発明の効果 本発明によるフォトマスクを用いれば、露光装置に設置
したままで、外部駆動系により任意にパターン変更がで
きるという特徴がある。したがって従来と異なりパター
ン毎に異なるフォトマスクを準備する必要がなく、また
マスク交換の際に生じる欠陥およびゴミの付着などがな
く、フォトマスクの寿命が長いという特徴がある。特定
のパターンをテスト的に形成したい場合、従来法では、
作成したフォトマスクを1回しか使用しないため、フォ
トマスク作成の費用および時間の浪費であった。
Effects of the Invention When the photomask according to the present invention is used, the pattern can be arbitrarily changed by an external drive system while the photomask is installed in an exposure apparatus. Therefore, unlike the conventional method, there is no need to prepare a different photomask for each pattern, and there are no defects or dust adhesion that occur when replacing the mask, and the photomask has a long lifespan. If you want to form a specific pattern on a test basis, with the conventional method,
Since the photomask produced was used only once, the cost and time of producing the photomask was wasted.

本発明によるフォトマスクは、駆動系13をパターン設
計システムと連動させることにより容易にかつ短時間で
パターン形成および変更ができるというすぐれた特畏を
有するものである。
The photomask according to the present invention has the excellent feature that patterns can be formed and changed easily and in a short time by linking the drive system 13 with a pattern design system.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のフォトマスクの構造断面図、第2図(A
)は本発明の一実施例のフォトマスクの製造断面図、第
2図CB)は本発明の他の実施例のフォトマスクの構造
断面図、第2図(C)は同マスクの平面図、第3図は本
発明によるフォトマスクを用いたパターン転写方法を説
明するだめの概略図である。 3.4,5.6・・・・・・ストライプ状透明電極、9
・・・・・・液晶、10・・・・・・フォトマスク、1
2・・・・・・半導体基板、14.15・・・・・・走
査2表示電極。
Figure 1 is a cross-sectional view of the structure of a conventional photomask, and Figure 2 (A
) is a manufacturing cross-sectional view of a photomask according to one embodiment of the present invention, FIG. 2 (CB) is a structural cross-sectional view of a photomask according to another embodiment of the present invention, and FIG. FIG. 3 is a schematic diagram for explaining a pattern transfer method using a photomask according to the present invention. 3.4, 5.6... Striped transparent electrode, 9
...Liquid crystal, 10...Photomask, 1
2...Semiconductor substrate, 14.15...Scan 2 display electrode.

Claims (2)

【特許請求の範囲】[Claims] (1)分子の長軸方向と短軸方向で光吸収に異方性を持
つ二色性染料を、電場により分子配列が変化する液晶に
溶解させ、前記液晶を透明導電層により形成した走査電
極と表示電極間に設置し、線順次走査により所定の領域
の前記液晶の光吸収率を変化させたことを特徴とするフ
ォトマスクっ
(1) A scanning electrode in which a dichroic dye, which has anisotropy in light absorption in the long and short axis directions of the molecule, is dissolved in a liquid crystal whose molecular arrangement changes depending on an electric field, and the liquid crystal is formed by a transparent conductive layer. and a display electrode, and the photomask is characterized in that the light absorption rate of the liquid crystal in a predetermined area is changed by line sequential scanning.
(2)分子の長軸方向と短軸方向で光吸収は異方性を持
つ二色性染料を、電場により分子配列が変化する液晶に
溶角イさせ、前記液晶を透明導電層により形成した走査
電極と表示電極間に設置し、線順次走査により所定の領
域の前記液晶の光吸収率を変化させたフォトマスクの加
定の走査電極と表示電極に電界を印加し、線順次走査に
より前記フォトマスクの所定の領域の光吸収率を変化さ
ぜだパターンを形成した状態で、前記フォトマスクの一
方から光11σ射を行ない、他方に設置した半導体基板
に前記フォトマスクに対応したパターンを形成すること
を特徴とする半導体装置の製造方法。
(2) A dichroic dye whose light absorption is anisotropic in the long and short axis directions of the molecule is melted into a liquid crystal whose molecular arrangement changes by an electric field, and the liquid crystal is formed by a transparent conductive layer. An electric field is applied to the scanning electrode and the display electrode of a photomask which is installed between the scanning electrode and the display electrode, and the light absorption rate of the liquid crystal in a predetermined area is changed by line sequential scanning. With a pattern that changes the light absorption rate of a predetermined region of the photomask formed, 11σ light is emitted from one side of the photomask to form a pattern corresponding to the photomask on a semiconductor substrate placed on the other side. A method for manufacturing a semiconductor device, characterized in that:
JP59065332A 1984-04-02 1984-04-02 Photomask and manufacture of semiconductor device using the same Pending JPS60208832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59065332A JPS60208832A (en) 1984-04-02 1984-04-02 Photomask and manufacture of semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59065332A JPS60208832A (en) 1984-04-02 1984-04-02 Photomask and manufacture of semiconductor device using the same

Publications (1)

Publication Number Publication Date
JPS60208832A true JPS60208832A (en) 1985-10-21

Family

ID=13283852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59065332A Pending JPS60208832A (en) 1984-04-02 1984-04-02 Photomask and manufacture of semiconductor device using the same

Country Status (1)

Country Link
JP (1) JPS60208832A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120741A (en) * 1988-10-31 1990-05-08 Ushio Inc Exposure device and marking method using this device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187970A (en) * 1975-01-31 1976-07-31 Hitachi Ltd
JPS5831525A (en) * 1981-08-18 1983-02-24 Nec Corp Patterning apparatus
JPS58166722A (en) * 1982-03-29 1983-10-01 Hitachi Ltd pattern transfer device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187970A (en) * 1975-01-31 1976-07-31 Hitachi Ltd
JPS5831525A (en) * 1981-08-18 1983-02-24 Nec Corp Patterning apparatus
JPS58166722A (en) * 1982-03-29 1983-10-01 Hitachi Ltd pattern transfer device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120741A (en) * 1988-10-31 1990-05-08 Ushio Inc Exposure device and marking method using this device

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