JPS60208008A - Electrically insulating material - Google Patents
Electrically insulating materialInfo
- Publication number
- JPS60208008A JPS60208008A JP6389384A JP6389384A JPS60208008A JP S60208008 A JPS60208008 A JP S60208008A JP 6389384 A JP6389384 A JP 6389384A JP 6389384 A JP6389384 A JP 6389384A JP S60208008 A JPS60208008 A JP S60208008A
- Authority
- JP
- Japan
- Prior art keywords
- photocurable
- insulating material
- acrylate
- present
- diester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012777 electrically insulating material Substances 0.000 title description 2
- 150000005690 diesters Chemical class 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 2
- 239000012772 electrical insulation material Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- -1 I-urethane Polymers 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- ZZXXBDPXXIDUBP-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound C(C=C)(=O)OCO.C(C=C)(=O)OCO ZZXXBDPXXIDUBP-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- WVFBDVFCOCLEFM-UHFFFAOYSA-N 1,1,2,4,4-pentachlorobuta-1,3-diene Chemical compound ClC(Cl)=CC(Cl)=C(Cl)Cl WVFBDVFCOCLEFM-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- ZNAAXKXXDQLJIX-UHFFFAOYSA-N bis(2-cyclohexyl-3-hydroxyphenyl)methanone Chemical compound C1CCCCC1C=1C(O)=CC=CC=1C(=O)C1=CC=CC(O)=C1C1CCCCC1 ZNAAXKXXDQLJIX-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Insulating Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、紫外線、電子線等によって硬化する光硬化型
電気絶縁用材料に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photocurable electrical insulating material that is cured by ultraviolet rays, electron beams, etc.
電気短縁材料は、弱電、強電、家電、通信などの分野で
広く用いられているが、最近、電子部品の小型化、高集
積化に伴ってよシ高性能の材料に対する要求が高まって
いる。Electrical short-edge materials are widely used in fields such as light and strong electrical appliances, home appliances, and communications.Recently, as electronic components become smaller and more highly integrated, the demand for materials with higher performance has increased. .
すなわち、絶縁性を初めとする電気特性に加えて機械的
強度、耐熱性、耐油性、耐湿性、耐水性等の面で優れて
いることが要求されるが、特に電子部品用の絶縁材料と
しては、素子を水や湿気等の外部環境から保護するため
に耐水性や耐湿性に対する要求が増加してきている。In other words, in addition to electrical properties such as insulation, it is required to have excellent mechanical strength, heat resistance, oil resistance, moisture resistance, water resistance, etc. Especially as an insulating material for electronic components. In order to protect devices from external environments such as water and humidity, there is an increasing demand for water resistance and moisture resistance.
一方、大量にエネルギーを消費する加熱硬化方式や長い
乾燥時間を必要とする常温硬化方式に代って、近時、紫
外線や電子線等の光を照射することによって短時間に硬
化する光硬化型電気絶縁材料が注目されている。しかし
、従来から光硬化性樹脂として一般に賞用されているエ
ポキシアクリレート系、ポリウレタンアクリレート系、
ポリエステルアクリレート系などの材料は概して耐水性
や耐湿性に劣り、電気絶縁用材料としては必ずしも充分
なものとけ云えなかった。またこれらの光硬化性樹脂は
しばしば粘度調整等のために光硬化性希釈剤と混合して
用いられるが、そのような場合には上記の欠点がさらに
助長された。On the other hand, instead of the heat curing method that consumes a large amount of energy or the room temperature curing method that requires a long drying time, a photocuring method that cures in a short time by irradiating it with light such as ultraviolet rays or electron beams has recently been introduced. Electrical insulating materials are attracting attention. However, epoxy acrylate, polyurethane acrylate, and
Materials such as polyester acrylate-based materials generally have poor water resistance and moisture resistance, and cannot necessarily be said to be sufficient as electrical insulating materials. Furthermore, these photocurable resins are often used in combination with a photocurable diluent for viscosity adjustment, but in such cases the above-mentioned drawbacks are further aggravated.
そこで本発明者らは従来技術のかかる欠点を改良すべく
鋭意検討を進めた結果、公知の光硬化性成分のがかで、
従来、樹脂成型品用の被ω材料や印刷インキ用の光硬化
性成分として知られていた(特開昭56−2357号、
同57−164163号)トリシクロデカンジメチロー
ル系の材料が特累的に優れた性能を有していることを見
い出し、本発明を完成するに到った。Therefore, the present inventors conducted intensive studies to improve such drawbacks of the conventional technology, and as a result, the inventors of the present invention developed a method using a known photocurable component.
Conventionally, it was known as an ω material for resin molded products and a photocurable component for printing ink (Japanese Patent Application Laid-Open No. 56-2357,
No. 57-164163) It was discovered that tricyclodecane dimethylol-based materials have particularly excellent performance, and the present invention was completed.
かくして本発明によれば、光硬化性成分としてトリシク
ロデカンジメチロール類とα、β−不飽和カルピン酸の
ジエステルを含有することを特徴とする光硬化型電気絶
縁用材料が提供される。Thus, according to the present invention, there is provided a photocurable electrical insulating material characterized by containing tricyclodecane dimethylols and a diester of α,β-unsaturated carpinic acid as a photocurable component.
上記のトリシクロデカンジメチロール類はジシクロイン
タジエンまたはその低級アルキル置換体のオキソ反応に
よって得られるものであり、具体的には3.8−ビス(
ヒドロキシメチル)トリシクロCFl、2.1.0”6
]デカン、4.9−ビス(ヒドロキシメチル)トリシク
ロ[5,2,1,02・6〕デカンなどが例示される。The above tricyclodecane dimethylols are obtained by oxo reaction of dicyclointadiene or its lower alkyl substituted product, and specifically, 3,8-bis(
hydroxymethyl)tricycloCFl, 2.1.0”6
] decane, 4,9-bis(hydroxymethyl)tricyclo[5,2,1,02·6]decane, and the like.
一方、上記のα、β−不飽和カル?ン酸の具体例として
は、アクリル酸メタクリル酸、クロトン酸などが挙げら
れるが、硬化速度の点でアクリル酸がもっとも賞用され
る。On the other hand, the above α,β-unsaturated Cal? Specific examples of phosphoric acids include acrylic acid, methacrylic acid, and crotonic acid, but acrylic acid is most preferred in terms of curing speed.
本発明で用いられるトリシクロデカンジメチロールジエ
ステルは常法に従って合成することができる。例えばト
リシクロデカンジメチロールの水酸基に対してα、β−
不飽和カル?ン酸を1〜3倍モル量使用し、硫酸、p−
トルエンスルホン酸等のような酸触媒の存在下に80〜
120℃の反応温度で、必要に応じてハイドロキノン、
ハイドロキノンモノメチルエーテルなどのような重合禁
止剤を加えて反応することによって容易に得ることがで
きる。The tricyclodecane dimethylol diester used in the present invention can be synthesized according to conventional methods. For example, α, β- for the hydroxyl group of tricyclodecanedimethylol
Unsaturated Cal? Using 1 to 3 times the molar amount of sulfuric acid, p-
80~ in the presence of an acid catalyst such as toluenesulfonic acid etc.
At a reaction temperature of 120°C, hydroquinone, if necessary,
It can be easily obtained by reacting with the addition of a polymerization inhibitor such as hydroquinone monomethyl ether.
本発明においては、かかるトリシクロデカンジメチロー
ルジエステルが電気絶縁材料の光硬化性成分として用い
られる。使用に際しては、かかるトリシクロデカンジメ
チロールジエステルを単独で用いてもよく、また通常使
用されている他の光硬化性樹脂と併用することもできる
。併用しうる光硬化性樹脂の具体例としては、例えばエ
ポキシ樹脂、Iリウレタン、ポリエステル、シリコーン
樹脂、Iリプタジエン、アルキッド樹脂、フェノール樹
脂、石油樹脂等を基材とするアクリレート変性物やメタ
クリレート変性物などが例示される。併用割合は適宜選
択しうるが、硬化性成分全体に対してトリシクロデカン
ジメチロールジエステルを通常10重M%以上好ましく
は15重重量板上とするのが適切である。In the present invention, such tricyclodecane dimethylol diester is used as a photocurable component of an electrically insulating material. When used, such tricyclodecane dimethylol diester may be used alone or in combination with other commonly used photocurable resins. Specific examples of photocurable resins that can be used in combination include acrylate-modified and methacrylate-modified products based on epoxy resin, I-urethane, polyester, silicone resin, I-liptadiene, alkyd resin, phenol resin, petroleum resin, etc. is exemplified. Although the ratio of the combined use can be selected as appropriate, it is appropriate that tricyclodecane dimethylol diester be used in an amount of usually 10% by weight or more, preferably 15% by weight, based on the total curable components.
本発明で用いられるトリシクロデカンジメチロールジエ
ステルはそれ自身きわめて低粘度であるため他の光硬化
性希釈剤を必ずしも必要としないが、他の光硬化性樹脂
を併用して高粘度化したとき々とでは必要に応じて一般
に用いられている光硬化性希釈剤を配合することもでき
、その具体例として、例えばメチルアクリレート、エチ
ルアクリレート、2−ヒドロキシエチルアクリレート、
トリシクロデカンモノメチロールアクリレート、1.4
−ブタンジオールジアクリレート、1,6−ヘキサンノ
オールジアクリレート、ネオインチルグリコールジアク
リレート、zvエチレングリコールジアクリレート、ト
リメチロールプロパントリアクリレート、インタエリス
リトールトリアクリレート、ジにンタエリスリトールへ
キサアクリレート、これらの化合物に対応するメタクリ
レート、N−ビニルピロリドンなどを例示することがで
きる。しかし、この場合であってもトリシクロデカンジ
メチロールジエステルの量を全硬化性成分画シ10重量
%以上、好ましくは15重量係以上とすることが適切で
ある。Since the tricyclodecane dimethylol diester used in the present invention has an extremely low viscosity, it does not necessarily require other photocurable diluents; If necessary, a commonly used photocurable diluent can be added to the diluent, such as methyl acrylate, ethyl acrylate, 2-hydroxyethyl acrylate,
Tricyclodecane monomethylol acrylate, 1.4
-butanediol diacrylate, 1,6-hexaneol diacrylate, neointyl glycol diacrylate, zv ethylene glycol diacrylate, trimethylolpropane triacrylate, interaerythritol triacrylate, diintaerythritol hexaacrylate, these Examples of the compound include methacrylate and N-vinylpyrrolidone. However, even in this case, it is appropriate that the amount of tricyclodecane dimethylol diester be 10% by weight or more, preferably 15% by weight or more based on the total curable components.
本発明においては紫外線等圧よる光硬化を促進させるた
めに一般に用いられている光重合開始剤が配合される。In the present invention, a commonly used photopolymerization initiator is blended to promote photocuring by isobaric ultraviolet rays.
かかる光重合開始剤の具体例とし−c t;j: 例L
if’ ヘンシフエノン、ベンゾイン、ベンツインメ
チルエーテル、ベンゾインエチルエーテル、ベンゾイン
イソプロピルエーテル、ベンジル、々ンジルジメチルケ
タール、ヒドロキシシクロへキシルフェニルケトン、ジ
アセチル、アセトフェノン、ジェトキシアセトフェノン
、アントラキノン等のカル?ニル化合物やジフェニルジ
スルフィド等のスルフィド化合物、ペンタクロロブタジ
ェン等のハロダン化物等が挙げられ、光硬化性成分10
0重量部に対して通常0.1〜10重量部の割合で用い
られる。Specific examples of such photopolymerization initiators are -ct;j: Example L
if' Hensifhenone, benzoin, benzine methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl, dimethyl ketal, hydroxycyclohexylphenyl ketone, diacetyl, acetophenone, jetoxyacetophenone, anthraquinone, etc. Examples include sulfide compounds such as nyl compounds and diphenyl disulfide, and halodane compounds such as pentachlorobutadiene.
It is usually used in a proportion of 0.1 to 10 parts by weight relative to 0 parts by weight.
また必要に応じて、光増感剤を配合することもでき、そ
の具体例として、n−ブチルアミン、ノーn−ジチルア
ミン、トリエチルアミン、2−ジメチルアミノエタノー
ル、N−メチルジェタノ−ルアミン、トリエタノールア
ミン等が例示され、さらに必要に応じて、その他の添加
物、例えば無機フィラー等の充填剤、顔料、可塑剤、密
着性付与剤、熱重合開始剤等を加えてもよい。Further, if necessary, a photosensitizer can be added. Specific examples thereof include n-butylamine, non-n-ditylamine, triethylamine, 2-dimethylaminoethanol, N-methyljetanolamine, and triethanolamine. For example, other additives such as fillers such as inorganic fillers, pigments, plasticizers, adhesion agents, thermal polymerization initiators, etc. may be added as necessary.
本発明に係る光硬化型電気絶縁用材料は、ICなどの高
隼積複合プロ、り、ダイオード、コンデンサー、トラン
ス、抵抗器、スイッチ等の電子部品から、モーター、発
電機、電線やその他各種電気機器用の樹脂成型品まで幅
広く利用することができ、とく圧電子部品用の材料とし
て好適である。The photocurable electrical insulating material of the present invention is suitable for use in high-density composite products such as ICs, electronic components such as diodes, capacitors, transformers, resistors, switches, motors, generators, electric wires, and other various electrical devices. It can be widely used in resin molded products for equipment, and is particularly suitable as a material for piezoelectric components.
これらの用途に応じて塗付、含浸、注型等の処理を施し
たのち、紫外線や電子線等を照射して硬化させる。After applying treatments such as coating, impregnating, and casting depending on the intended use, it is cured by irradiation with ultraviolet rays, electron beams, etc.
光硬化のための光発生源としては、高圧水銀灯やメタル
ハライドランプなどの紫外線発生装置が通常用いられる
が、電子線、X線、γ線などの発生機も用いることがで
きる。As a light source for photocuring, an ultraviolet generator such as a high-pressure mercury lamp or a metal halide lamp is usually used, but generators such as electron beams, X-rays, and γ-rays can also be used.
かくして本発明によれば、短い硬化時間と乾燥工程の省
略による経済性、作業性の改善、並びに優れた耐水性、
耐湿性による電気特性の劣下防止を可能にすることがで
きる。Thus, according to the present invention, economical efficiency and workability are improved due to short curing time and omission of a drying process, as well as excellent water resistance and
It is possible to prevent deterioration of electrical characteristics due to moisture resistance.
次に実施例を挙げて本発明を更に具体的に説明する。な
お、実施例中の部は重量部を表わす。Next, the present invention will be explained in more detail with reference to Examples. Note that parts in the examples represent parts by weight.
実施例1
トリシクロデカンジメチロールジアクリレート30部、
二官能性ビスフェノール型エポキシアクリレート70部
(昭和高分子(株)製、5P−1509)、1−<4−
イソプロピルフェニル)−2−ヒドロキシ−2−メチル
ゾロ/4’ンー1−オン3部(メルク社製ダロキュア1
116 )をよく混合して光硬化性電気絶縁用材料を調
整し、これを膜厚IWmのフィルム状の試験片にする。Example 1 30 parts of tricyclodecane dimethylol diacrylate,
70 parts of bifunctional bisphenol type epoxy acrylate (manufactured by Showa Kobunshi Co., Ltd., 5P-1509), 1-<4-
3 parts of isopropylphenyl)-2-hydroxy-2-methylzolo/4'-1-one (Darocur 1 manufactured by Merck & Co.)
116) to prepare a photocurable electrical insulating material, which is made into a film-like test piece with a film thickness of IWm.
硬化け80W/crnの強度を有する2 kw高圧水銀
ランプ)12000L/6 (東芝電材(株)製)にて
照射距離10crnで6m/minのコンベアスピード
で繰シ返し照射し完全硬化させた@また比較のため上記
トリシクロデカンツメチロールジアクリレートに代えて
各種二官能性希釈剤を用いて相様に硬化させた。表1に
、その結果を示す。For curing, the material was completely cured by repeated irradiation with a 2 kW high-pressure mercury lamp (2 kW high-pressure mercury lamp) 12000 L/6 (manufactured by Toshiba Electric Materials Corporation) having an intensity of 80 W/crn at a conveyor speed of 6 m/min at an irradiation distance of 10 crn. For comparison, various difunctional diluents were used in place of the above tricyclodecanemethylol diacrylate and cured in the same manner. Table 1 shows the results.
表1の結果よシ、本発明の電気絶縁材料は、他の二官能
性希釈剤を用いたものに比較して吸水率および耐水性に
優れ、体積抵抗率の劣化が少なく優れた電気絶縁材料で
あることがわかる。The results in Table 1 show that the electrical insulating material of the present invention is an excellent electrical insulating material with superior water absorption and water resistance, and less deterioration in volume resistivity compared to those using other difunctional diluents. It can be seen that it is.
実施例2
トリシクロデカンジメチロールジアクリレート及び二官
能性ウレタンアクリレート(東亜合成化学工業(株)製
、アロエックスM−1200,20〜30万cps /
50℃)を表2に示す割合で混合し、この混合物10
0部にダロキーア1116 (メルク社製)3部を配合
し電気絶縁材料を調製した。次いで実施例1と同様にし
て試験を行い、その性能を評価した。結果を表2に示す
。Example 2 Tricyclodecane dimethylol diacrylate and bifunctional urethane acrylate (manufactured by Toagosei Kagaku Kogyo Co., Ltd., Aroex M-1200, 200,000 to 300,000 cps/
50°C) in the ratio shown in Table 2, and this mixture 10
0 parts and 3 parts of Darokia 1116 (manufactured by Merck & Co., Ltd.) were blended to prepare an electrical insulating material. Next, a test was conducted in the same manner as in Example 1, and the performance was evaluated. The results are shown in Table 2.
表2の結果が示すように、トリシクロデカンジメチロー
ルジアクリレートを加えた光硬化型電気絶縁用材料は耐
水性に優れていることがわかる。As shown in Table 2, the photocurable electrical insulation material containing tricyclodecane dimethylol diacrylate has excellent water resistance.
特許出願人 日本ゼオン株式会社Patent applicant: Zeon Corporation
Claims (1)
ル類とα、β−不飽和カルデン酸のジエステルを含有す
ることを特徴とする光硬化型電気絶縁用材料。1. A photocurable electrical insulation material containing tricyclodecane dimethylols and a diester of α,β-unsaturated caldicic acid as a photocurable component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6389384A JPS60208008A (en) | 1984-03-31 | 1984-03-31 | Electrically insulating material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6389384A JPS60208008A (en) | 1984-03-31 | 1984-03-31 | Electrically insulating material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60208008A true JPS60208008A (en) | 1985-10-19 |
Family
ID=13242430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6389384A Pending JPS60208008A (en) | 1984-03-31 | 1984-03-31 | Electrically insulating material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60208008A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62225508A (en) * | 1986-03-28 | 1987-10-03 | Mitsubishi Petrochem Co Ltd | Resin for optical materials and its manufacturing method |
EP0264037A2 (en) * | 1986-10-07 | 1988-04-20 | E.I. Du Pont De Nemours And Company | UV-curable dielectric compositions |
WO2016104043A1 (en) * | 2014-12-26 | 2016-06-30 | 日立オートモティブシステムズ株式会社 | Thermally-curable resin composition and rotating electrical machine using same |
-
1984
- 1984-03-31 JP JP6389384A patent/JPS60208008A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62225508A (en) * | 1986-03-28 | 1987-10-03 | Mitsubishi Petrochem Co Ltd | Resin for optical materials and its manufacturing method |
EP0264037A2 (en) * | 1986-10-07 | 1988-04-20 | E.I. Du Pont De Nemours And Company | UV-curable dielectric compositions |
WO2016104043A1 (en) * | 2014-12-26 | 2016-06-30 | 日立オートモティブシステムズ株式会社 | Thermally-curable resin composition and rotating electrical machine using same |
CN107112841A (en) * | 2014-12-26 | 2017-08-29 | 日立汽车系统株式会社 | Compositions of thermosetting resin and the electric rotating machine for having used said composition |
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