JPS60200869A - Ceramic and metal bonding method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a ceramic and metal joint.

Generally, ++-(J) is used for joining ceramics.This is done by inserting a 1"-shape between the mating material and heating it in a furnace at the temperature of the molten brazing material. Therefore, in this method, if there is a large difference in the coefficient of linear expansion between the resimic and the mating material, peeling or cracking will occur during the cooling process. In addition, even if this condition is met, if there is a difference in cooling rate, thermal stress is likely to occur in the joint, and the relative strength of the joint will decrease.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a new method that can minimize the problem of thermal stress during brazing.

The present invention is directed to a metal part at the bonding boundary between a ceramic and a mating material (metallic material) (a mating material, a metallized part of the ceramic, or a brazing material part inserted at the boundary).
The gist of this method is to selectively apply a skin current to the area to selectively heat and melt this area, thereby joining the two.

The basic Mennonism of the present invention is (a) Ceramics are generally not heated by induction.

For this reason, by stacking the ceramic and the metal and applying induction heating from the ceramic side, the ceramic will not be heated.
Only the surface layer of the joint surface of the metal part is selectively heated.

(b) If a design is made in which ceramic and metal are superimposed and a high-frequency current is applied directly to the metal part so that the current flows to the joint surface, no current will flow to the ceramic part in this case either. Therefore, only the surface layer of the joint surface can be selectively heated.

When both bonding materials are metal, it is impossible to flow a high frequency current only to the bonding boundary of the overlap V.

The present invention utilizes the principles of high frequency current (skin current) in (a) and (b).

Next, the present invention will be explained in detail with reference to the drawings.

1 and 2 are explanatory diagrams of the principle of the present invention. FIG. 1 shows a case where induction heating is used, and FIG. 2 shows a case where selective heating is performed by direct energization.
FIG.

In FIG. 1, (1) is a ceramic member, (2) is a mating material (metal), (3) is a metallized layer on the ceramic surface, and (4) is a [ ] −+A layer of gold 1.

When joining, (1) and (2) are overlapped with (4) sandwiched between them. (5) is a high frequency coil, which performs induction heating from the outside of the ceramic. .

The ceramic portion is not heated, but the metallized layer (3) and the surface layer of the brazing material (4) or (2) are selectively heated, and a melt layer of the brazing material appears at the boundary. The metallized surface (1) and the surface (4) are wetted and brazed.

In this case, the heating is localized only to the boundary area and is carried out in a short period of time, so the ceramic and mating material (metal) parts are not affected by heat, and almost no thermal stress is generated even after brazing.

In this case, metallization of the ceramic is not an essential treatment, and is not necessary if it is directly attached to the brazing material.

In FIG. 2, (1) is a ceramic member, (2) is a mating material (metal), (3) is a metallized layer on the ceramic surface, and (4) is a current-carrying electrode.

In this case, a case is exemplified in which a metal is fitted and bonded to the inner surface of a ceramic cylinder, and a brazing material is also exemplified in which the metal surface is coated in advance. In this case, this method is easier to work with.

During bonding, a high frequency current is applied directly from the electrode (4).

Due to the skin action, the current flows through the surface part of the metal (2) or the ceramic metallized layer (3), but does not flow into the ceramic part. Only the joint surface or the metallized surface of the metal (2) is rapidly selectively heated. A melt (brazing material) appears in this part, and wet I, co alloy, Ao, Cu, Zn
Ordinary brazing materials such as can be used. The metallized layer is not limited to gold 1i4, but any material that is wettable with the brazing material can be used.

<Example> Next, examples will be described.

Example 1 Ceramic material: Temporary metallized layer of mullite ceramic: MO-MnlQ J-1-N1-P electroless plating after welding 20 Metal: Mild steel (Ni-1-'20 Metsu1-) brazing material
:N1-P amorphous foil ceramic and metal were superimposed and induction heated from the ceramic side (30M l-IZ).

Pressure is applied during the wax melting stage.

A strong bond was achieved without any cracking or peeling. Moreover, there was almost no overall temperature rise.

Example 2 Ceramic material: Same material as Example 1 (cylindrical) Metal:
Mild steel (self-fusing alloy coating on the surface) metal is processed into the shaft body,
Ceramic mating.

The metallization of the ceramic layer is the same as in Example 1.

High frequency current (30MH2) is applied directly from both ends of the metal shaft.

The interface is selectively heated and a melt layer appears, stopping at the point where wetting occurs.

Overall, there was almost no temperature rise, and the bonding was complete. No cracking or peeling t4t was observed.

As described in detail above, the present invention is a method that can instantaneously join ceramics and metals without giving them any thermal distortion, and without using a furnace like in the past, and in addition, can be bonded in the atmosphere. It has the feature that it can be done at low cost.

In addition, materials with significantly different coefficients of linear expansion can be used as mating materials, and materials other than metals, such as ceramics coated with metal (metalized), can be used as mating materials, and can be used to join a wide range of materials. It is available.

[Brief explanation of drawings]

FIGS. 1 and 2 are diagrams for explaining the principles of the present invention, with FIG. 1 being an explanatory diagram for using induction heating, and diagram 2 for using direct passage 1-R. (1)・-ceramic member, (2)・・-mate H (3L
--Metallized layer, 4)... Brazing material (Figure 1), current-carrying electrode (Figure 2) (5)
... High frequency coil patent applicant Miya Co., Ltd. [J, I Technique 11 J1 Representative
Seiichi Miyata Part 1 (Thursday - How to write procedural amendments) 1. Indication of the case Patent Application No. 55029 of 1982 2. Name of the invention Method for joining ceramic and metal 3. Person making the amendment Relationship with the case Patent Applicant Address: 9-104 Doiki-cho, Nafufu, Shimonoseki, Yamaguchi Prefecture, Agent 6, Subject of amendment: Specification

Claims (1)

[Claims] When joining ceramic and metal, a skin current is selectively applied to the metal part of the bonding surface. how to join