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JPS60194371U - chip parts - Google Patents

chip parts

Info

Publication number
JPS60194371U
JPS60194371U JP8190384U JP8190384U JPS60194371U JP S60194371 U JPS60194371 U JP S60194371U JP 8190384 U JP8190384 U JP 8190384U JP 8190384 U JP8190384 U JP 8190384U JP S60194371 U JPS60194371 U JP S60194371U
Authority
JP
Japan
Prior art keywords
chip parts
solder paste
chip
chip component
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8190384U
Other languages
Japanese (ja)
Inventor
啓一 村田
大井 輝男
八矢 登志広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8190384U priority Critical patent/JPS60194371U/en
Publication of JPS60194371U publication Critical patent/JPS60194371U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は、従来のチップ部品の断面図、第3図
は、本考案のチップ部品の断面図である。 1・・・・・・チップ部品、2・・・・・・はんだペー
スト、3・・・・・・接着剤。
1 and 2 are cross-sectional views of a conventional chip component, and FIG. 3 is a cross-sectional view of a chip component according to the present invention. 1... Chip components, 2... Solder paste, 3... Adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] はんだペーストを印刷後、接着剤を塗布してチップ部品
において、チップ電極の外側にはんだペーストを供給す
ることにより、チップ部品をプリント基板に密着させる
構造を特徴とするチップ部品。
A chip component characterized by a structure in which the chip component is closely attached to a printed circuit board by printing solder paste and then applying an adhesive to supply the solder paste to the outside of the chip electrode.
JP8190384U 1984-06-04 1984-06-04 chip parts Pending JPS60194371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8190384U JPS60194371U (en) 1984-06-04 1984-06-04 chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8190384U JPS60194371U (en) 1984-06-04 1984-06-04 chip parts

Publications (1)

Publication Number Publication Date
JPS60194371U true JPS60194371U (en) 1985-12-24

Family

ID=30629126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8190384U Pending JPS60194371U (en) 1984-06-04 1984-06-04 chip parts

Country Status (1)

Country Link
JP (1) JPS60194371U (en)

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