JPS60181777A - Extraction electrode formation method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical field of the invention The present invention relates to a method for forming an extraction electrode, particularly in various devices, in which terminal electrode portions are multilayered for connection with external circuits. This invention relates to an electrode forming method.

(2) Background of the technology In recent years, silver,
Various measures are taken to prevent damage or disconnection to the terminal electrodes of the electrode group when forming an electrode group of other conductors and joining a flexible cable or the like to the electrode group. This structure will be explained below.

(3) Problems with the prior art Fig. 1 is a side sectional view schematically showing the lead-out electrode of a conventional EL panel display device, and Figures 2 and 3 are explanatory diagrams for explaining the lead-out electrode forming method. be.

In FIG. 1, reference numeral 1 denotes a substrate made of glass or the like, and a transparent member is selected. A striped transparent electrode 2 is formed on the upper side of the substrate 1 in a direction perpendicular to the paper (Y-axis direction).

An ELiJ film 3 is formed on the transparent electrode 2. This EL thin film 3 is surrounded by an insulating layer (Y 203, etc.) not shown.

As the transparent electrode, tin oxide (SnO2) or indium oxide (In 203) is etched or patterned into stripes. ZnS as EIJJ film:
Mn, ZnS: Cu, Mn, etc. are used. On the EL thin film 3, a plurality of striped electrodes 4 made of aluminum or the like are formed at predetermined intervals in the X-axis direction perpendicular to the extending direction of the transparent electrode 2, with the above-mentioned insulating layer interposed therebetween. do. Note that 5 is a terminal electrode made of nickel or the like formed at the terminal of the electrode 4.

The reason for providing such a terminal electrode is that when connecting to an external circuit via a coat 6 such as a flexible cable, mechanical strength is required to be strongly supported by a spring 7 at the joint part. A terminal electrode 5 is formed to increase the thickness and mechanical strength. In order to increase the mechanical strength, it is possible to make the electrode 4 itself on the back side made of aluminum or the like thicker, but if this is done too much, when the device has dielectric breakdown, the damage in that part will increase and a short circuit will occur. The thickness of the electrode 4 cannot be increased without limit, and the thickness of the electrode 4 is generally selected to be about 2000 mm.

For this purpose, the terminal portion of the electrode is multilayered as shown in FIG.

A conventional embodiment of a manufacturing method for multi-layering the terminal portion as described above will be described with reference to FIG.

FIG. 2 (Al is a plan view seen from the electrode 4 side on the back side of FIG. 1, in which a transparent electrode 2 is formed on a substrate 1.

A conductive material 8 such as aluminum is sputtered over the entire surface of the stacked E-L thin film to form the back electrode 4.

Next, as shown in FIG. 2fb), a metal lO such as nickel is deposited on the terminal electrode forming surface 9 outside the display area.

Next, a resist pattern for the back electrode is created by photolithography, and the terminal electrode forming surface 9 on which nickel 10 is vapor-deposited is first etched with an etching solution, and then the aluminum 8 is etched, as shown in FIG. 2 (C1). An electrode 4 and a terminal electrode 5 are formed.

However, this manufacturing process for terminal electrodes for extraction has the drawback that it is extremely difficult to select and control the type of tinda liquid, making it difficult to obtain striped electrodes 4 with extremely narrow widths.

Figures 3+a) and 3(b) show other examples of the conventional manufacturing method of the terminal electrodes on the back side. A pattern of electrodes 4 is deposited.

Furthermore, as shown in FIG. 3 (bl), a metal 10 such as nickel is deposited on the terminal portion using a mask to form the terminal electrode 5. According to this manufacturing process, there is no problem of etching. The use of a mask required alignment, making it impossible to form high-resolution patterned electrodes.

(4) Purpose of the invention The present invention has been made in view of the above drawbacks.

For forming device electrodes such as panel display devices.

The purpose of the present invention is to provide a method for manufacturing an extraction electrode that can be easily manufactured with high precision without increasing the thickness of the striped electrode portion and without using double etching and masks when forming terminal electrodes into multiple layers. .

(5) Structure of the Invention According to the present invention, the above object includes a step of forming an opaque electrode on a transparent substrate, a step of applying a negative resist on the opaque electrode, and a step of forming an opaque electrode on an end portion of the opaque electrode. a step of disposing a mask on the negative resist surface so as to cover the extraction electrode formation region;

The method includes a step of irradiating and developing the mask and the transparent substrate with light from both sides, and holes of the negative resist formed in a portion that is not irradiated with light and sandwiched between the mask and the extraction electrode forming area of the opaque electrode. This is achieved by providing a method for forming an extraction electrode, which is characterized by comprising a step of vapor depositing a metal on the entire surface of a negative resist, and a step of removing the negative resist to leave the metal in an area for forming an extraction electrode. .

(6) Examples of the invention An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 4 is an assembly process diagram showing the extraction electrode forming method of the present invention. After patterning and forming the EL thin film 3, the aluminum electrode 4 on the back side is patterned in a direction perpendicular to the transparent electrode 2.

Next, as shown in FIG. 4(b) which is a side view of FIG. 4(al), a negative resist 11 (EPPR) is applied to the entire surface of the back surface of the panel display device on which the back electrode 4 is formed.

Next, as shown in FIG. 4 (tc+, dl), a light-shielding mask 12 is placed on the part where the terminal electrode is to be formed by multilayering, and light 13 is irradiated from the back of the display device.
As shown in the side view, light 14 is also emitted from the display surface side of the display device.
irradiate. Because the substrate 1, the transparent electrode 2, and the EL thin film 3 are made transparent by the irradiation of this light 14, FIG.
), light is irradiated onto all areas other than the extraction electrode formation region 15 indicated by diagonal lines.

That is, this stripe pattern portion 15 is the light shielding mask 1.
2 and the aluminum electrode 4, and no light is irradiated. In addition, the light 13 from the back hardens the resist in areas other than the masked areas, resulting in light 13 and 1.
Extraction electrode formation region 15 where both of the lights of 4 are not irradiated.
Only it didn't harden.

As shown in Figure 4 (81), there are holes 1 in the resist area as a result of development.
6 is formed (Selfa line method). In this state, insert a metal such as nickel or aluminum into the hole 16.
and vapor deposited on the entire surface of resist 11.

By removing the resist portion (lift-off method), a terminal electrode 5 made of nickel or aluminum is formed in the hole 16 corresponding to the extraction electrode formation region 15 on the aluminum electrode 4.
(FIG. 1) is formed and multilayered.

(7) Effects of the Invention The present invention has the feature that since the extraction electrode is formed as described above, a lift-off pattern can be constructed using self-aligned lines, so that the terminal electrode can be constructed extremely easily and accurately.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of a conventional EL panel display device. Fig. 2 (fat to fc) is a plan view of the electrode section for explaining the conventional extraction electrode forming method, Fig. 3 (a), Tb
1 is a plan view showing another embodiment similar to FIG. 2 for explaining the conventional extraction electrode forming method. 1 is a plan view and a side view of 1... Substrate, 2... Transparent electrode, 3... EL thin film, 4... Back electrode. 5... Base 11 end electrode, 6... flexi cable,
7... Spring, 8... Conductive material such as aluminum, 9... Terminal electrode forming surface, 10... Metal such as nickel. 11... Negative resist 12... Mask, 13.
14... Light, 15... Extraction electrode formation area,
16... hole. Figure 1 Figure 2 Figure 3 Go to Figure 1

Claims (1)

[Claims] A step of forming an opaque electrode on a transparent substrate, and a step of applying a negative resist onto the opaque electrode. a step of arranging a mask on the negative resist surface to cover the extraction electrode formation region formed in the 0111 portion of the opaque electrode; a step of irradiating light from both sides of the mask and the transparent substrate; and a step of developing the mask and the transparent substrate. A step of vapor depositing metal on the entire surface of the negative resist, including the holes of the negative resist formed in the portion not irradiated with light sandwiched between the extraction electrode forming area of the opaque electrode, and removing the negative resist. A method for forming an extraction electrode, comprising the step of leaving the metal in an area for forming an extraction electrode.