JPH0693552B2 - Shield type flexible circuit board and manufacturing method thereof - Google Patents
Shield type flexible circuit board and manufacturing method thereofInfo
- Publication number
- JPH0693552B2 JPH0693552B2 JP2332880A JP33288090A JPH0693552B2 JP H0693552 B2 JPH0693552 B2 JP H0693552B2 JP 2332880 A JP2332880 A JP 2332880A JP 33288090 A JP33288090 A JP 33288090A JP H0693552 B2 JPH0693552 B2 JP H0693552B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- layer
- insulating base
- shield electrode
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 208000024891 symptom Diseases 0.000 claims 1
- 239000010410 layer Substances 0.000 description 52
- 239000002585 base Substances 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 「産業上の利用分野」 本発明は電磁シールド構造を有する可撓性回路基板及び
その製造法に関する。更に具体的には、本発明はエキシ
マレーザ光によるフォトアブレーション手段等を併用し
て完全な同軸ケーブル状に構成可能なシールド構造を有
する可撓性回路基板及びその為の製造法に関する。The present invention relates to a flexible circuit board having an electromagnetic shield structure and a manufacturing method thereof. More specifically, the present invention relates to a flexible circuit board having a shield structure that can be formed into a complete coaxial cable by using a photoablation means using excimer laser light and the like, and a manufacturing method therefor.
「従来の技術」 可撓性回路基板に於けるこの種のシールド構造として
は、第２図のように可撓性絶縁ベース材１の外面に銅箔
等の導電部材からなる一様な第一のシールド電極層３を
設け、また、絶縁ベース材１の表面には銅箔等で適宜形
成した所要の回路配線パターン２を有し、更にこの回路
配線パターン２の表面側には適当な接着層４を介してこ
の接着層４の側に絶縁フィルム５を備えた銅箔等からな
る第二のシールド電極層６を接合被着したものが知られ
ている。ここで、絶縁ベース材１と回路配線パターン２
と及び第一のシールド電極層３とは、例えば可撓性両面
銅張積層板等の材料を使用してその銅箔の一方に上記回
路配線パターン２を形成することにより構成することが
容易であり、また絶縁フィルム５及び第二のシールド層
６は片面型可撓性銅張積層板等をそのまま使用すること
ができる。このようなシールド構造では、第一並びに第
二の両シールド層３、６を接地処理することにより所要
のシールド機能を発揮できる。"Prior Art" As a shield structure of this kind in a flexible circuit board, as shown in FIG. 2, a uniform first conductive member such as a copper foil is formed on the outer surface of the flexible insulating base material 1. The shield electrode layer 3 is provided, and the surface of the insulating base material 1 has a required circuit wiring pattern 2 appropriately formed of copper foil or the like. Further, a suitable adhesive layer is provided on the surface side of the circuit wiring pattern 2. It is known that a second shield electrode layer 6 made of copper foil or the like having an insulating film 5 is bonded and adhered to the side of the adhesive layer 4 via the adhesive layer 4. Here, the insulating base material 1 and the circuit wiring pattern 2
And the first shield electrode layer 3 can be easily constructed by forming the circuit wiring pattern 2 on one side of the copper foil using a material such as a flexible double-sided copper clad laminate. As the insulating film 5 and the second shield layer 6, a single-sided flexible copper clad laminate or the like can be used as it is. In such a shield structure, a required shield function can be exhibited by grounding the first and second shield layers 3 and 6.
「発明が解決しようとする課題」 しかし、第２図の如き可撓性回路基板のシールド構造で
は、隣接する回路配線パターン２の間に接着層４及び絶
縁フィルム５の一部が介在するだけの構造であるから、
上下方向から来る電磁ノイズには有効なシールド作用を
発揮するが、この回路基板の側面乃至は端面からのノイ
ズにはシールド機能を果たさせることは出来ない。同様
に、回路配線パターン２の間にはシールド部材が存在し
ない為、隣接する回路配線パターン２間のクロストーク
を防止することもできず、また、機器とのインピーダン
ス整合を図ることも困難である。[Problems to be Solved by the Invention] However, in the shield structure of the flexible circuit board as shown in FIG. 2, only a part of the adhesive layer 4 and the insulating film 5 is interposed between the adjacent circuit wiring patterns 2. Because it is a structure,
Although it has an effective shielding effect on electromagnetic noise coming from the up and down direction, it cannot provide a shielding function to noise from the side surface or the end surface of the circuit board. Similarly, since there is no shield member between the circuit wiring patterns 2, it is not possible to prevent crosstalk between the adjacent circuit wiring patterns 2 and it is difficult to achieve impedance matching with a device. .
「課題を解決するための手段」 そこで本発明によるシールド型可撓性回路基板では、上
下方向からの電磁ノイズのみならず横から乃至は端面方
向からのノイズに対しても十分なシールド効果を発揮で
き且つ隣接する回路配線パターン間のクロストークも阻
止可能であって機器とのインピーダンス整合も容易に図
ることの可能な完全な同軸ケーブル状のシールド型可撓
性回路基板とその為の製造法を提供するものである。[Means for Solving the Problems] Therefore, the shield-type flexible circuit board according to the present invention exhibits a sufficient shielding effect not only for electromagnetic noise from the up and down direction but also for noise from the side or end face direction. A shield type flexible circuit board in the form of a perfect coaxial cable, which can prevent crosstalk between adjacent circuit wiring patterns and can easily achieve impedance matching with equipment, and a manufacturing method therefor. It is provided.
その為に本発明では、隣接する回路配線パターン間にも
シールド部材が配置されるように各々の回路配線パター
ンを上下のシールド電極層で完全に包囲するように構成
したものである。それぞれの回路配線パターンを上下の
シールド電極層により確実に包囲させる為の手法として
は、隣接する回路配線パターンの間に存在する絶縁ベー
ス材、絶縁層或いは接着層などを溝状にエキシマレーザ
光によるフォトアブレーション処理等で除去し、この溝
の部位に於いて上下のシールド電極層が互いに電気的に
接合するような手段が採用される。また、上記相互のシ
ールド電極層の接合用溝を形成する際の手法としては、
各回路配線パターンの上方部位に絶縁状態で遮光マスク
の為の金属層を配設することにより、上記の溝を形成す
る為のフォトアブレーション処理を容易迅速に施すこと
が出来る。このようにして構成されたシールド型可撓性
回路基板は完全に同軸ケーブル状の構造となるので、高
機能の製品を提供できる。Therefore, in the present invention, each circuit wiring pattern is completely surrounded by the upper and lower shield electrode layers so that the shield member is arranged between the adjacent circuit wiring patterns. As a method for surely surrounding each circuit wiring pattern by the upper and lower shield electrode layers, an insulating base material, an insulating layer or an adhesive layer existing between adjacent circuit wiring patterns is formed in a groove shape by excimer laser light. A means is adopted in which the upper and lower shield electrode layers are electrically joined to each other at the groove portions by removing them by photoablation treatment or the like. In addition, as a method for forming the joining groove of the mutual shield electrode layers,
By disposing the metal layer for the light-shielding mask in an insulating state above each circuit wiring pattern, the photoablation process for forming the groove can be easily and quickly performed. Since the shielded flexible circuit board thus configured has a completely coaxial cable-like structure, a highly functional product can be provided.
「実施例」 以下、図示の実施例を参照しながら本発明を更に説明す
る。[Examples] Hereinafter, the present invention will be further described with reference to the illustrated examples.
第１図は本発明の一実施例に従って構成されたシールド
型可撓性回路基板の概念的な要部拡大断面構成図を示
し、図中、12は銅箔又はアルミニウム箔等の導電箔から
なる一様な第一のシールド電極層であり、その上面には
所定の間隔を置いて形成され所要の幅に分離した絶縁ベ
ース材10Aを設けてある。11はこの絶縁ベース材10Aの上
面にその幅より僅かに狭い幅で形成された所要の回路配
線パターンを示し、この回路配線パターン11の上面及び
側面には例えばポリイミドワニスをコーティングしキュ
アーして形成した適宜な厚さの絶縁層13Aを備えてい
る。絶縁ベース材10Aはポリイミドフィルム、ポリエス
テルフィルム或いはガラスエポキシ樹脂等からなる適当
な絶縁樹脂シート材料を用いることが出来、また、回路
配線パターン11の材料としては、銅箔又はアルミニウム
箔等の導電箔やその他の導電性ペースト等を使用するこ
とが可能である。FIG. 1 is an enlarged cross-sectional structural view showing a conceptual essential part of a shielded flexible circuit board constructed according to an embodiment of the present invention, in which 12 is a conductive foil such as copper foil or aluminum foil. It is a uniform first shield electrode layer, and an insulating base material 10A is formed on the upper surface of the first shield electrode layer at predetermined intervals and separated into a required width. Reference numeral 11 shows a required circuit wiring pattern formed on the upper surface of the insulating base material 10A with a width slightly narrower than the width, and the upper surface and side surfaces of the circuit wiring pattern 11 are formed by coating and curing polyimide varnish, for example. The insulating layer 13A having an appropriate thickness is provided. As the insulating base material 10A, a suitable insulating resin sheet material made of a polyimide film, a polyester film, a glass epoxy resin, or the like can be used, and the material of the circuit wiring pattern 11 is a conductive foil such as a copper foil or an aluminum foil. Other conductive pastes or the like can be used.
上記のような絶縁ベース材10A、回路配線パターン11及
び絶縁層13Aの積層状の配設態様によれば、隣接するそ
れら構成部材の間に第一のシールド電極層12を部分的に
露出させる溝14を形成することとなるので、この溝14の
部位に露出する第一のシールド電極層12に接合し且つ上
記絶縁層13AのＡ面及びその側面並びに絶縁ベース材10A
の側面に及ぶように例えば銅メッキ、銅蒸着やアルミニ
ウム蒸着等の導電膜の被着手段で第二のシールド電極層
15を形成することにより、各回路配線パターン11を個別
的に上下から完全に包囲した形態であって所謂同軸ケー
ブル状の完全シールド型可撓性回路基板を構成すること
が出来る。According to the laminated arrangement of the insulating base material 10A, the circuit wiring pattern 11, and the insulating layer 13A as described above, the groove for partially exposing the first shield electrode layer 12 between the adjacent constituent members. 14 is formed, it is bonded to the first shield electrode layer 12 exposed at the groove 14 and the A surface and side surface of the insulating layer 13A and the insulating base material 10A.
Second shield electrode layer by means of conductive film deposition such as copper plating, copper vapor deposition, aluminum vapor deposition, etc.
By forming 15, it is possible to form a so-called coaxial cable-like completely shielded flexible circuit board in which each circuit wiring pattern 11 is completely surrounded from above and below individually.
第３図（１）〜（４）はその為の一製造工程図を示すも
のであって、接着層の介在するもの又は無接着剤型の可
撓性両面銅張積層板等の材料を予め用意し、斯かる材料
の一方の導電箔はそのまま第一のシールド電極層12に使
用し、また他方の導電箔に対してはフォトエッチング処
理を施して可撓性の絶縁ベース材10上に所要の回路配線
パターン11を同図（１）の如く形成する。次に、同図
（２）のように回路配線パターン11の上面及びその端面
と露出する絶縁ベース材10の個所に一様に例えばポリイ
ミドワニスをコーティングしキュアーして適当な厚さの
絶縁層13を形成することとなる。そこで、同図（３）に
示す如く、各回路配線パターン11の端面を露出させない
幅で隣接する回路配線パターン11の間に位置する絶縁層
13及び絶縁ベース材10の部位をエキシマレーザ光Ａによ
るフォトアブレーション処理で部分的に除去することに
より第一のシールド電極層12を部分的に露出させるよう
に溝14を形成する。このレーザアブレーション処理によ
って、各回路配線パターン11の上下にはそのパターンの
幅に対応してそれぞれ分離された絶縁層13Aと同幅の絶
縁ベース材10Aが形成される。次いで、同図（４）の如
く、分離された絶縁層13Aの上面とその端面及び絶縁ベ
ース材10Aの端面並びに溝14の個所に露出している第一
のシールド電極層12の部分に無電解銅メッキとその厚付
け手段の他、銅蒸着やアルミニウム蒸着等の導電膜形成
手段か又はその他の導電性ペーストの塗布手段で一様な
厚さに第二のシールド電極層15を形成することにより、
溝14の個所で上下の両シールド電極層12、15が電気的に
接合されると共に、分離された絶縁層13A及び絶縁ベー
ス材10Aを介して各回路配線パターン11を第一及び第二
の両シールド電極層12、15で上下からその周囲を完全に
包囲した形態の所謂同軸ケーブル状の完全シールド方式
の可撓性回路基板を構成することが可能となり、これに
より第１図に示した構造の製品を得ることができる。3 (1) to 3 (4) are views showing a manufacturing process for that purpose, in which materials such as an adhesive layer or a non-adhesive type flexible double-sided copper clad laminate are preliminarily used. One of the conductive foils of such a material is used as it is for the first shield electrode layer 12, and the other conductive foil is photoetched to be required on the flexible insulating base material 10. The circuit wiring pattern 11 is formed as shown in FIG. Next, as shown in FIG. 2B, the upper surface and the end surface of the circuit wiring pattern 11 and the exposed portions of the insulating base material 10 are uniformly coated with, for example, polyimide varnish and cured to form an insulating layer 13 having an appropriate thickness. Will be formed. Therefore, as shown in FIG. 3C, an insulating layer located between the adjacent circuit wiring patterns 11 with a width that does not expose the end face of each circuit wiring pattern 11.
A groove 14 is formed so as to partially expose the first shield electrode layer 12 by partially removing the portion of 13 and the insulating base material 10 by a photoablation process using excimer laser light A. By this laser ablation process, an insulating base material 10A having the same width as the insulating layer 13A separated according to the width of each circuit wiring pattern 11 is formed above and below each circuit wiring pattern 11. Then, as shown in FIG. 4D, electroless electrolysis is performed on the separated upper surface of the insulating layer 13A and its end surface, the end surface of the insulating base material 10A, and the first shield electrode layer 12 exposed at the groove 14. By forming the second shield electrode layer 15 to a uniform thickness by means of a conductive film forming means such as copper vapor deposition or aluminum vapor deposition or other conductive paste applying means in addition to copper plating and its thickening means. ,
Both the upper and lower shield electrode layers 12 and 15 are electrically joined at the location of the groove 14, and each circuit wiring pattern 11 is provided on both the first and second sides through the separated insulating layer 13A and insulating base material 10A. It is possible to construct a so-called coaxial cable-like complete shield type flexible circuit board in which the periphery thereof is completely surrounded by the shield electrode layers 12 and 15, whereby the structure shown in FIG. You can get the product.
上記に於いて、溝14を形成して第一のシールド電極層12
を部分的に露出させる為の手法としては上記の如きフォ
トアブレーション処理の他、適当なマスク用レジスト膜
の併用によるアルカリエッチングやヒドラジンエッチン
グ等の樹脂エッチング手段を採用することも可能であ
る。In the above, the groove 14 is formed to form the first shield electrode layer 12
As a method for partially exposing the photoresist, it is also possible to employ a resin etching means such as alkali etching or hydrazine etching in combination with a suitable mask resist film, in addition to the photoablation treatment as described above.
第４図は本発明の他の実施例に従って構成されたシール
ド型可撓性回路基板の概念的な要部拡大断面構成図であ
って、第１図と同一符号はそれらと同一の構成要素を示
し、この実施例の場合には各回路配線パターン11と第二
のシールド層15との間に各々分離された接着層16と絶縁
フィルム17Aからなる絶縁層を介して第二のシールド層1
5の下面に金属層18を介装した構造に特徴がある。金属
層18は以下の説明の如くエキシマレーザ光によるフォト
アブレーション処理の際の遮光マスクとして有効に機能
するものであって、完全同軸シールド型の可撓性回路基
板をフォトアブレーション処理で迅速に構成する為の手
法に極めて有効である。FIG. 4 is an enlarged cross-sectional view of a shield type flexible circuit board constructed according to another embodiment of the present invention, in which the same reference numerals as those in FIG. 1 denote the same components. In the case of this embodiment, the second shield layer 1 via the insulating layer consisting of the adhesive layer 16 and the insulating film 17A, which are separated between each circuit wiring pattern 11 and the second shield layer 15, respectively.
It is characterized by the structure in which the metal layer 18 is interposed on the lower surface of 5. The metal layer 18 effectively functions as a light-shielding mask in the photoablation process by the excimer laser light as described below, and a complete coaxial shield type flexible circuit board is quickly constructed by the photoablation process. It is extremely effective as a method for
即ち、第５図（１）〜（３）にその製造工程を順次示す
とおり、同図（１）の如く第３図（１）の工程終了後、
先ず例えば可撓性片面銅張積層板等の材料を用意し、こ
の材料に好ましくは予めその導電箔側に溝孔19を形成し
て分離された金属層18を形成しておく。溝孔19は隣接す
る回路配線パターン11の間の所定個所に対応する態様で
設けられるので、回路配線パターン11の上面側に接着層
16を用いてその絶縁フィルム17が位置し且つ分離された
金属層18が外面に位置するように接合することにより、
溝孔19は隣接する回路配線パターン11の間の中間部に配
設されることとなる。金属層18は外面に位置した状態で
配設されているので、同図（２）に示すようにこの金属
層18の上面方向からエキシマレーザ光Ａを照射すること
により、溝孔19の幅に対応した幅で絶縁フィルム17、接
着層16及び絶縁ベース材10の部分をフォトアブレーショ
ン処理で除去すると、その部位には上記実施例と同等な
溝14が容易且つ迅速に形成される。そこで、第３図
（４）と同様な手法に従って既述の第二のシールド電極
層15を同図（３）に示すように容易に形成することが可
能となる。この手法は、金属層18をエキシマレーザ光Ａ
の照射の際の遮光マスクとして機能させ、また、これを
この回路基板の構成要素として残すことが出来る構造と
なる。That is, as shown in FIGS. 5 (1) to 5 (3) in sequence, the manufacturing process is as shown in FIG. 3 (1).
First, for example, a material such as a flexible single-sided copper-clad laminate is prepared, and a groove layer 19 is preferably formed on the conductive foil side of this material in advance to form a separated metal layer 18. Since the slot 19 is provided in a manner corresponding to a predetermined portion between the adjacent circuit wiring patterns 11, an adhesive layer is formed on the upper surface side of the circuit wiring pattern 11.
By bonding so that the insulating film 17 is located using 16 and the separated metal layer 18 is located on the outer surface,
The slot 19 will be arranged in the intermediate portion between the adjacent circuit wiring patterns 11. Since the metal layer 18 is disposed in a state of being located on the outer surface, the width of the groove hole 19 is changed by irradiating the excimer laser light A from the upper surface direction of the metal layer 18 as shown in FIG. When the portions of the insulating film 17, the adhesive layer 16 and the insulating base material 10 having a corresponding width are removed by photoablation, the grooves 14 equivalent to those in the above-described embodiment are easily and quickly formed in the portions. Therefore, it is possible to easily form the above-mentioned second shield electrode layer 15 as shown in FIG. 3C according to the same method as that shown in FIG. 3D. In this method, the metal layer 18 is formed by excimer laser light A
In this structure, the mask can be made to function as a light-shielding mask during the irradiation of, and can be left as a constituent element of this circuit board.
「発明の効果」 本発明に係るシールド型可撓性回路基板によれば、各回
路配線パターンをその周囲から上下の両シールド電極層
で完全に包囲した構造の所謂同軸ケーブル状の完全なシ
ールド型の可撓性回路基板を構成できるので、回路基板
の上下方向の電磁ノイズのみならず横方向乃至は端面方
向からのノイズに対しても確実なシールド効果を発揮
し、また隣接する回路配線パターン間に対してもシール
ド層が完全に介在する構造であるので、回路配線パター
ン間のクロストークをも確実に防止できる。従って、機
器とのインピーダンス整合も十分に容易な構造となるの
で、高周波回路に接続された場合でも十分に対応するこ
とができる。[Advantages of the Invention] According to the shielded flexible circuit board of the present invention, a so-called coaxial cable-shaped complete shielded type having a structure in which each circuit wiring pattern is completely surrounded by both upper and lower shield electrode layers from its periphery. The flexible circuit board can be configured to provide a reliable shield effect against not only electromagnetic noise in the vertical direction of the circuit board but also noise from the lateral direction or the end face direction, and between adjacent circuit wiring patterns. However, since the shield layer completely intervenes, it is possible to reliably prevent crosstalk between circuit wiring patterns. Therefore, the impedance matching with the device is sufficiently easy, and it is possible to sufficiently cope with the case where the device is connected to a high frequency circuit.
そして、このようなシールド型可撓性回路基板はレーザ
アブレーション処理工程等で簡便に製作可能であり、特
に、回路配線パターンに上方部位に金属層を具備する構
造のものでは、この金属層を遮光マスクとして機能させ
ながら迅速且つ容易なフォトアブレーション処理を実施
できる。Further, such a shield type flexible circuit board can be easily manufactured by a laser ablation process step or the like. Especially, in a structure having a metal layer in an upper portion in a circuit wiring pattern, the metal layer is shielded from light. A quick and easy photoablation process can be performed while functioning as a mask.
第１図は本発明の一実施例に従って構成されたシールド
型可撓性回路基板の概念的な要部拡大断面構成図、 第２図は従来の構造に従ったシールド型可撓性回路基板
の概念的な要部拡大断面構成図、 第３図は第１図のシールド型可撓性回路基板の製造工程
図、 第４図は本発明の他の実施例に従って構成されたシール
ド型可撓性回路基板の概念的な要部拡大断面構成図、そ
して、 第５図は第４図のシールド型可撓性回路基板の製造工程
図である。 「符号の説明」 10は可撓性絶縁ベース材、10Aは分離された絶縁ベース
材、11は回路配線パターン、12は第一のシールド電極
層、13は絶縁層、13Aは分離された絶縁層、14は溝、15
は第二のシールド電極層、16は接着層、17Aは分離され
た絶縁フィルム、18は金属層、19は溝孔。FIG. 1 is an enlarged cross-sectional configuration diagram of a conceptual main part of a shield type flexible circuit board constructed according to an embodiment of the present invention, and FIG. 2 is a shield type flexible circuit board according to a conventional structure. FIG. 3 is an enlarged cross-sectional schematic view of a conceptual main part, FIG. 3 is a manufacturing process diagram of the shield type flexible circuit board of FIG. 1, and FIG. 4 is a shield type flexible circuit constructed according to another embodiment of the present invention. FIG. 5 is an enlarged cross-sectional configuration diagram of a conceptual main part of the circuit board, and FIG. 5 is a manufacturing process diagram of the shield-type flexible circuit board of FIG. "Explanation of reference numerals" 10 is a flexible insulating base material, 10A is an isolated insulating base material, 11 is a circuit wiring pattern, 12 is a first shield electrode layer, 13 is an insulating layer, 13A is an isolated insulating layer , 14 is a groove, 15
Is a second shield electrode layer, 16 is an adhesive layer, 17A is a separated insulating film, 18 is a metal layer, and 19 is a slot.
Claims (4)
電極層上に所要の回路配線パターンを支持し且つこの回
路配線パターンの幅に適合した幅の絶縁ベース材を備
え、上記各回路配線パターンの上面と側面には上記絶縁
ベース材と同幅の絶縁層を有し、この絶縁層の外面と上
記絶縁ベース材の側面に被覆形成されると共にその各絶
縁ベース材の隣接部位に露出する上記第一のシールド電
極層部分にも一様に接合された第二のシールド電極層を
具備するように構成したことを特徴とするシールド型可
撓性回路基板。1. An insulating base material supporting a required circuit wiring pattern on a uniform first shield electrode layer made of a conductive member and having a width adapted to the width of the circuit wiring pattern. An insulating layer having the same width as the insulating base material is provided on the upper surface and the side surface of the wiring pattern, and the outer surface of the insulating layer and the side surface of the insulating base material are covered with the insulating layer and exposed at the adjacent portions of each insulating base material A shield type flexible circuit board, characterized in that it is configured so as to include a second shield electrode layer which is evenly bonded to the first shield electrode layer portion.
上記第二のシールド電極層との間に上記絶縁ベース材と
同幅の金属層を配設した請求項（１）のシールド型可撓
性回路基板。2. A shield type flexible substrate according to claim 1, wherein a metal layer having the same width as that of the insulating base material is provided between the insulating layer provided on the circuit wiring pattern and the second shield electrode layer. Flexible circuit board.
ルド電極層を形成すると共にこの絶縁ベース材の他方面
には所要の回路配線パターンを形成し、次いで上記回路
配線パターン及び上記絶縁ベース材の上面に一様に絶縁
層を形成した後、隣接する上記回路配線パターン間に位
置する上記絶縁層及び絶縁ベース材部分をエキシマレー
ザ光によるフォトアブレーション手段か樹脂エッチング
手段で除去して上記第一のシールド電極層部分を溝状に
露出させ、更に上記絶縁層の上面とこの絶縁層及び上記
絶縁ベース材の側面並びに溝状に露出した上記第一のシ
ールド電極層部分に亘って一様に第二のシールド電極層
を被着形成する各工程を含むことを特徴とするシールド
型可撓性回路基板の製造法。3. A uniform first shield electrode layer is formed on one surface of the insulating base material, and a required circuit wiring pattern is formed on the other surface of the insulating base material. After uniformly forming an insulating layer on the upper surface of the insulating base material, the insulating layer and the insulating base material portion located between the adjacent circuit wiring patterns are removed by a photoablation means using excimer laser light or a resin etching means. The first shield electrode layer portion is exposed in the shape of a groove, and the upper surface of the insulating layer, the side surface of the insulating layer and the insulating base material, and the first shield electrode layer portion exposed in the shape of the groove are exposed. A method of manufacturing a shield type flexible circuit board, comprising the steps of depositing and forming a second shield electrode layer.
ルド電極層を形成すると共にこの絶縁ベース材の他方面
には所要の回路配線パターンを形成し、この回路配線パ
ターン上に絶縁層を介して金属層を形成し、この金属層
には上記各回路配線パターンの隣接する個所に上記絶縁
層を露出させる溝孔が形成され、上記金属層を遮光マス
クとして機能させながら上記溝孔に位置する上記絶縁層
及び上記絶縁ベース材部分をエキシマレーザ光によるフ
ォトアブレーション処理で除去して上記上記第一のシー
ルド電極層部分を溝状に露出させ、更に上記金属層の上
面とこの金属層、上記絶縁層及び上記絶縁ベース材の側
面並びに溝状に露出した上記第一のシールド電極層部分
に亘って一様に第二のシールド電極層を被着形成する各
工程を含むことを特徴とするシールド型可撓性回路基板
の製造法。4. A uniform first shield electrode layer is formed on one surface of an insulating base material, and a required circuit wiring pattern is formed on the other surface of the insulating base material, and insulation is performed on this circuit wiring pattern. A metal layer is formed via a layer, and a groove hole for exposing the insulating layer is formed at a location adjacent to each of the circuit wiring patterns in the metal layer, and the groove hole is formed while the metal layer functions as a light-shielding mask. By removing the insulating layer and the insulating base material portion located by the photoablation process with excimer laser light to expose the first shield electrode layer portion in a groove shape, and further, the upper surface of the metal layer and the metal layer. A step of uniformly depositing a second shield electrode layer over the side surfaces of the insulating layer and the insulating base material and the first shield electrode layer portion exposed in a groove shape. Preparation of shielded flexible circuit board according to symptoms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2332880A JPH0693552B2 (en) | 1990-11-29 | 1990-11-29 | Shield type flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2332880A JPH0693552B2 (en) | 1990-11-29 | 1990-11-29 | Shield type flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04199790A JPH04199790A (en) | 1992-07-20 |
| JPH0693552B2 true JPH0693552B2 (en) | 1994-11-16 |
Family
ID=18259832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2332880A Expired - Fee Related JPH0693552B2 (en) | 1990-11-29 | 1990-11-29 | Shield type flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0693552B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3580893B2 (en) * | 1995-03-24 | 2004-10-27 | 日東電工株式会社 | Suspension wiring board for magnetic head |
| JP4318820B2 (en) * | 1999-12-09 | 2009-08-26 | 株式会社日本自動車部品総合研究所 | Magnetic detection antenna |
| JP3565768B2 (en) * | 2000-07-27 | 2004-09-15 | ソニーケミカル株式会社 | Wiring board |
| JP3969523B2 (en) * | 2002-02-25 | 2007-09-05 | 独立行政法人産業技術総合研究所 | Method for manufacturing printed wiring board |
| JP4749166B2 (en) * | 2006-01-30 | 2011-08-17 | 日東電工株式会社 | Printed circuit board |
| US7465884B2 (en) | 2006-04-20 | 2008-12-16 | Nitto Denko Corporation | Wired circuit board |
| JP5198105B2 (en) * | 2008-03-25 | 2013-05-15 | 日本メクトロン株式会社 | Manufacturing method of multilayer flexible printed wiring board |
| US8115117B2 (en) * | 2009-06-22 | 2012-02-14 | General Electric Company | System and method of forming isolated conformal shielding areas |
| JP2012243857A (en) * | 2011-05-17 | 2012-12-10 | Hitachi Ltd | Printed board and manufacturing method of printed board |
| JP5904354B2 (en) * | 2011-07-08 | 2016-04-13 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board with shield, manufacturing method thereof, and electronic device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
-
1990
- 1990-11-29 JP JP2332880A patent/JPH0693552B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04199790A (en) | 1992-07-20 |
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