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JPS60174238U - semiconductor wafer - Google Patents

semiconductor wafer

Info

Publication number
JPS60174238U
JPS60174238U JP6170784U JP6170784U JPS60174238U JP S60174238 U JPS60174238 U JP S60174238U JP 6170784 U JP6170784 U JP 6170784U JP 6170784 U JP6170784 U JP 6170784U JP S60174238 U JPS60174238 U JP S60174238U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
utility
model registration
abstract
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6170784U
Other languages
Japanese (ja)
Inventor
吉村 克信
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP6170784U priority Critical patent/JPS60174238U/en
Publication of JPS60174238U publication Critical patent/JPS60174238U/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案を実施例における半導体ウェハースの平
面図である。 1・・・半導体ウェハース、2・・・ウェハースの周辺
につけられた印。
FIG. 1 is a plan view of a semiconductor wafer in an embodiment of the present invention. 1...Semiconductor wafer, 2...Marks placed around the wafer.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)規則正しく多数の半導体装置が配列される半導体
ウェハースにおいて、該半導体ウェハースのハンドリン
グ位置を明確にする印を該半導体ウェハースの周辺部に
具備することを特徴とする半導体ウェハース。
(1) A semiconductor wafer in which a large number of semiconductor devices are regularly arranged, characterized in that a mark is provided on the periphery of the semiconductor wafer to clarify the handling position of the semiconductor wafer.
(2)ハンドリング位置の印が金属によって形成さ・れ
ていることを特徴とする実用新案登録請求の範囲第(1
)項記載の半導体ウェハース。
(2) Utility model registration claim No. 1 (1) characterized in that the handling position mark is formed of metal.
) Semiconductor wafer described in item 1.
JP6170784U 1984-04-26 1984-04-26 semiconductor wafer Pending JPS60174238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6170784U JPS60174238U (en) 1984-04-26 1984-04-26 semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6170784U JPS60174238U (en) 1984-04-26 1984-04-26 semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS60174238U true JPS60174238U (en) 1985-11-19

Family

ID=30590230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6170784U Pending JPS60174238U (en) 1984-04-26 1984-04-26 semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS60174238U (en)

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