JPS60170925A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional Structure and Problems A conventional so-called leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is constructed as shown in FIG. In other words, an anode foil made by roughening aluminum foil and further forming a dielectric oxide film by anodizing,
A cathode foil formed by roughening aluminum foil is wound through a separator and impregnated with a driving electrolyte to form a capacitor element 1, and this capacitor element is housed in a bottomed cylindrical metal case 2. At the same time, the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor, and the lead wire 4 fully drawn out from the aluminum electrolytic capacitor is welded to the comb-shaped terminal 5. Electrical and mechanical connections were made using the method described above, and a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminals 5 to produce a completed product.

Such chip-type aluminum electrolytic capacitors are coated with a molded resin sheath 6 as described above in order to provide solder heat resistance when mounted on a printed circuit board.
Generally, the mold exterior is pressurized at a temperature of 100°C to 150"C and a pressure of 10 kg/clj for about 6 minutes, and under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates. Therefore, the capacitance decreases and the tan
This has the problem of deteriorating characteristics such as an increase in δ, and being extremely expensive due to the extensive molded resin exterior. Furthermore, since it is a horizontal type,
When mounted on a printed circuit board, the inj of the printed circuit board
It occupied a lot of space and was a place where various equipment could be made smaller. Furthermore, in the soldering process performed by the user, there were drawbacks such as deterioration of solder wettability and solderability due to oxidation due to exposure of the external electrodes of the capacitor to the atmosphere.

OBJECTS OF THE INVENTION The present invention is intended to eliminate such conventional drawbacks, and aims to provide a one-dress electronic component that does not cause characteristic deterioration, particularly improves solderability.

Structure of the Invention To achieve this object, the present invention consists of an electronic component main body which is constructed by housing a component element in a case, and in which a lead wire connected to the component element is drawn out from the same end face; an insulating plate provided with a through hole through which the lead wire of the electronic component body is disposed so as to come into contact with the end surface of the drawer, and the lead wire passes through, and the lead wire is connected to the through hole on the outer surface of the insulating plate. The recess is filled with flux, and the tip of the lead wire passing through the through hole is bent so as to be housed in the recess.

With this configuration, when soldering electronic components, the solder flux that exists between the lead wire and the insulating plate will melt out.
Soldering work can be done extremely easily and reliably, simplifying solder mounting work, improving the reliability of solderability, enabling soldering in a short time, and eliminating evaporation of paste due to soldering heat. Characteristic deterioration is eliminated.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 and 3 regarding an aluminum electrolytic capacitor. In addition,
In the figure, d and the same numbers are used for the same parts as in Figure 1.

In the figure, 11 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wrapped with insulating paper in between. The structure is completed by winding the winding and impregnating the winding with a driving electrolyte. This capacitor element 1
is housed in a bottomed cylindrical metal case 2. Further, a halide wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

Then, a sealing member 7 consisting of a two-layer structure consisting of an elastic body 7a and an inelastic body 7a is attached to the open end of the metal case 2, and the publication is closed by drawing. The main body of the part is configured.

Further, the lead wire 4 connected to the capacitor element 1 is
It passes through the sealing part and is drawn out from the same end surface.

8 (d) This is an insulating plate arranged so as to come into contact with the end surface from which the lead wire 4 of the electronic component body is drawn out, and this insulating plate 8 [g,
A through hole 8a is provided through which the lead wire 4 passes.

1, the outer surface of this insulating plate 8 is provided with four parts 8b connected to the through hole 8a, and the four parts 8b are filled with flux 9, and the tip end 4a of the lead wire 4 passes through the through hole 82L. It is bent so as to be accommodated in the recess 8b.

In this case, as shown in Figure 3a and b, the round bar lead wire 4
The tip portion 4a may be flattened and bent, or may be a round bar lead wire twisted.

Effects of the Invention As described above, according to the electronic component of the present invention, an insulating plate having a recess is used, and after filling the recess with flux,
Since the lead wire is housed, there is no tilting or wobbling when mounting it on the printed circuit board, and the flux melts over the entire surface of the terminal, removing the plating and solder of the lead wire, improving solder quality. The mounting work is extremely easy and the speed is increased to 6 units, while the soldering strength is also improved.

Moreover, since no mold resin exterior is used, it is possible to produce electronic components at low cost without deterioration of characteristics.

[Brief explanation of the drawing]

FIGS. 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG. Partially sectioned front view showing one embodiment, FIG. 4a
, b are perspective views showing the shape of a lead according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Capacitor element, 2... Metal case, 4... Lead wire, 7... Sealing member, 8a... Through hole, 8b... recess,
9...Flux. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (α) (Figure 2, Figure 3, Figure 4) (Display of procedural amendment 1 case 1988 Patent Application No. 27556 2 Name of invention Electronic component 3 Person making the amendment it t't= Relationship with 'l!J' flo Application Personnel i!li 1, 1006 Oaza Kadoma, Kadoma City, Osaka (582) Matsushita Electric Industrial Co., Ltd. 14 representatives, 15 Toshihiko Yamashita 4 agents 571 Address 6, Matsushita Electric Industrial Co., Ltd., 1006 Oaza Barpage, Kadoma City, Osaka Prefecture, [Figure 3 a, bJ [Figure 4 a]
, I started correcting bJ first.

Claims (3)

[Claims] (1) An electronic component body that is constructed by housing a component element in a case and in which lead wires connected to the component element are drawn out from the same end surface, and an end surface of the electronic component body from which the lead wire is drawn out. an insulating plate disposed in contact with each other and having a through hole through which the lead wire passes; four parts connected to the through hole are provided on the outer surface of the insulating plate; and the recess is filled with flux. An electronic component characterized in that the tip of the lead wire passing through the through hole is bent so as to be accommodated therein. (2) The electronic component according to claim 1, wherein the tip of the lead wire accommodated in the recess is plate-shaped. (3) The electronic component 0 according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.