JPS60245115A - Aluminum electrolytic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Structure of conventional example and its problems Conventional so-called leadless electronic components of this type, such as chip-type aluminum electrolytic capacitors, are No. 1a.

It is configured as shown in Figure b. That is, the surface of the aluminum foil is roughened and then anodized to give it a dielectric strength of 3S.

A capacitor element 1 is constructed by winding an anode foil formed with an electrolytic oxide film and a cathode foil formed by roughening an aluminum foil through a separator and impregnating it with a driving electrolyte,
This capacitor element 1 is housed in a bottomed cylindrical metal case 2, and the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor, and then pulled out from the aluminum electrolytic capacitor. The lead wire 4 is electrically connected to the comb-shaped terminal 5 by a method such as welding.
After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 6, resulting in a completed product.

When mounting such chip-type aluminum electrolytic capacitors on a printed circuit board, in order to have soldering heat resistance,
As mentioned above, the molded resin exterior 6 is applied, but the molded resin exterior is generally pressurized at a temperature of 100°C to 150''C and a pressure of 109/c4 for about 5 minutes, and cannot be used under such harsh conditions. Below, the problem is that the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tan δ, and also that the capacitor becomes extremely expensive due to the molded resin exterior 6. It had a point.

OBJECTS OF THE INVENTION The present invention eliminates these conventional drawbacks, and aims to provide an inexpensive leadless electronic component that does not suffer from characteristic deterioration.

Structure of the Invention To achieve this object, the present invention provides a lead which is constructed by housing a component element in a case and sealing it with a sealing member having a two-layer structure of an elastic body and an inelastic body, and which is connected to the component element. An electronic component body formed by wires drawn out from the same end surface, and a bottomed resin case provided with a through hole through which the lead wires pass, the bottom of which is arranged such that the bottom abuts the end surface of the electronic component body from which the lead wires are drawn out. A recess connected to the through hole is provided on the outer surface of the bottomed resin case, and the tip of the lead wire passing through the through hole is bent so as to fit into the recess. be.

This configuration allows electronic components to be mounted on a printed circuit board.
.

When installing, the tip of the lead wire is stored in the recess provided in the bottomed resin case, so there is no convexity on the surface of the bottomed resin case that contacts the printed circuit board, that is, the lead wire is Because of the bottomed resin case and the so-called truncated position, there is no tilting or wobbling of the electronic components, and the electronic components are stable, making it possible to perform the mounting work extremely well and at high speed.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. 2 and FIGS. 3a and 3b for an aluminum electrolytic capacitor.

In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one,
A high-purity aluminum foil is electrochemically roughened and then anodized to form a dielectric oxide film.The anode foil is wound with insulating paper between the roughened cathode aluminum foil. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a bottomed cylinder 6 in a 7-shaped metal case 2. Further, a lead wire 4 is connected to the anode foil and the cathode foil of the capacitor element 1.

The open end of the metal case 2 is sealed with a two-layer structure consisting of an elastic body 7a made of styrene-butadiene rubber with a thickness of 0.5 mm and an inelastic body 7b made of polytetrafluoroethylene with a thickness of 1.0 mm. The member 7 is attached and sealed by drawing, thereby forming an electronic component body.

Further, the lead wire 4 connected to the capacitor element 1 is
It penetrates the sealing member 7 and is drawn out from the same end surface. The elastic body 7a of the sealing member 7 is made of ethylene propylene terpolymer or impropylene rubber in addition to the styrene butadiene rubber.

Any one of inbutyl isopropylene rubber, fluororubber, and in addition to the above-mentioned polytetrafluoroethylene as a non-elastic material, one of tetrafluoroethylene hexafluoropropylene copolymer and ethylene tetrafluoroethylene copolymer. It can be composed of more than one type.

At 7.

Reference numeral 8 denotes a bottomed resin case configured to allow insertion of the lead wire 4 of the electronic component main body, and the bottomed resin case 8 is provided with a through hole 8a through which the lead wire 4 passes.

Further, a recess 8b is provided on the outer surface of the bottom and side surfaces of the bottomed resin case 8, and the recess 8b is connected to the through hole 8a.
The tip portion 4a of the lead wire 4 passing through the through hole 8a is bent so as to fit within the recess 8b.

In this case, as shown in Fig. 4a and b, the round bar lead wire 4
The leading end portion 4a may be flattened and bent, or may be a round bar lead wire as it is.

Effects of the Invention As described above, according to the electronic component of the present invention, since a bottomed resin case having four parts is used and the lead wires are housed in the four parts, there is no tilting or wobbling when mounting on a printed circuit board. The mounting work can be done extremely well and at high speed. Moreover, since there is no molded resin exterior,
The effect is that electronic components without characteristic deterioration can be manufactured at low cost.

[Brief explanation of the drawing]

1A and 1B are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and FIGS. 3A and 3B are FIGS. 4A and 4B are perspective views showing a lead shape according to an embodiment of the present invention. FIGS. 1 ・Capacitor element, 2...-metal case, 4...
-Lead wire, 7...Sealing member, 8...Bottomed resin case, 8a -Through hole, 8b Four parts. Name of agent: Patent attorney Toshio Nakao (1st person)
Figure (α) Cb) Figure 2 Figure 3 ((2,) b Figure 4 (a) (Phantom 40L4α

Claims (3)

[Claims] (1) An electronic device in which a component element is housed in a case and sealed with a sealing member having a two-layer structure of an elastic body and an inelastic body, and a lead wire connected to the component element is drawn out from the same end face. It consists of a component body and a bottomed resin case that is arranged so that its bottom is in contact with the end surface from which the lead wires are drawn out of the electronic component body and has a through hole through which the lead wires pass, and the bottomed resin case has a through hole through which the lead wires pass through. An electronic component characterized in that a recess connected to the through hole is provided on the outer surface of the case, and a tip of a lead wire passing through the through hole is bent so as to fit within the recess. (2) The electronic component according to claim 1, wherein the recess is formed on the bottom outer surface and the side outer surface of the bottomed resin case, and the bottom recess and the side recess are connected. (3) Styrene-butadiene rubber with a thickness of 0.2 to 0.7μ, ethylene propylene 2 as a two-layer structure sealing member,
. An elastic body made of terpolymer, isopropylene rubber, isobutyl isopropylene rubber, or fluororubber; The electronic component according to claim 1, comprising an inelastic body made of any one of fluorinated ethylene copolymers.