JPS60167366U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS60167366U JPS60167366U JP5536884U JP5536884U JPS60167366U JP S60167366 U JPS60167366 U JP S60167366U JP 5536884 U JP5536884 U JP 5536884U JP 5536884 U JP5536884 U JP 5536884U JP S60167366 U JPS60167366 U JP S60167366U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- lead terminal
- pattern
- connecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路を示す部分断面図、第２図
は部品取付用パターンとアース用パターンとが厚膜ペー
ストにより短絡している状態を示す説明図である。第３
図乃至第７図は本考案の実施例を示すものであり、第３
図は混成集積回路を示す部分断面図、第４図乃至第６図
は接続用部材の第１乃至第３の実施例を示す斜視図、第
７図はリード端子と接続用部材とが一体に形成された端
子組立体を示す斜視図である。
２・・・基板、４・・・端子挿入用穴部、５，５′・・
・リード端子、８・・・部品取付用パターン、１０，１
０ａｔ １０ｂｔ １０ｃｔ １０””接続用部
材。FIG. 1 is a partial sectional view showing a conventional hybrid integrated circuit, and FIG. 2 is an explanatory diagram showing a state in which a component mounting pattern and a grounding pattern are short-circuited by a thick film paste. Third
Figures 7 to 7 show embodiments of the present invention, and show the third embodiment.
The figure is a partial sectional view showing a hybrid integrated circuit, FIGS. 4 to 6 are perspective views showing the first to third embodiments of the connecting member, and FIG. 7 is a diagram showing the lead terminal and the connecting member integrated. FIG. 3 is a perspective view showing the formed terminal assembly. 2... Board, 4... Hole for terminal insertion, 5, 5'...
・Lead terminal, 8...Parts mounting pattern, 10,1
0at 10bt 10ct 10"" Connection member.
Claims (2)
入用穴部が穿設された基板と前記穴部に挿入された状態
で前記パターンに接続されるリード端子とを有する混成
集積回路において、前記パターンとリード端子とを接続
用部材を介して接続されていることを特徴とする混成集
積回路。(1) A hybrid integrated circuit having a substrate on which a printed wiring pattern is formed, a terminal and an insertion hole, and a lead terminal connected to the pattern while being inserted into the hole. A hybrid integrated circuit characterized in that a pattern and a lead terminal are connected via a connecting member.
ることを特徴とする実用新案登録請求の範囲第１項記載
の混成集積回路。(2) The hybrid integrated circuit according to claim 1, wherein the lead terminal and the connecting member are formed separately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5536884U JPS60167366U (en) | 1984-04-17 | 1984-04-17 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5536884U JPS60167366U (en) | 1984-04-17 | 1984-04-17 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167366U true JPS60167366U (en) | 1985-11-06 |
Family
ID=30577976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5536884U Pending JPS60167366U (en) | 1984-04-17 | 1984-04-17 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167366U (en) |
-
1984
- 1984-04-17 JP JP5536884U patent/JPS60167366U/en active Pending
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