JPS5856464U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5856464U JPS5856464U JP14879281U JP14879281U JPS5856464U JP S5856464 U JPS5856464 U JP S5856464U JP 14879281 U JP14879281 U JP 14879281U JP 14879281 U JP14879281 U JP 14879281U JP S5856464 U JPS5856464 U JP S5856464U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- integrated circuit
- line package
- dual line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はＤＩＰ−ＩＣの斜視図、第２図は従来のプリン
１配線基板の部品実装図、第３図は本考案のプリント配
線基板の一実施伝の説明図、第４図１． −及び第５図
は他の実施例の説明図である。
図中符号５．５′は部品、７ａは主プリント配線基板、
７ｂは補助プリント配線基板、９はＤＩＰ−ＩＣ，Ｉ
Ｑはフレキシブルリード、１２はＩＣソケットである。FIG. 1 is a perspective view of a DIP-IC, FIG. 2 is a component mounting diagram of a conventional Print 1 wiring board, FIG. 3 is an explanatory diagram of an embodiment of the printed wiring board of the present invention, and FIG. - and FIG. 5 are explanatory diagrams of other embodiments. In the figure, 5.5' is a component, 7a is a main printed wiring board,
7b is an auxiliary printed wiring board, 9 is DIP-IC, I
Q is a flexible lead, and 12 is an IC socket.
Claims (2)
プリント配線基板においモ、前記プリント配線基板の一
面に他のプリント配線基板を直立して設けてなり、該プ
リント配線基板及び該他のプリント配線基板に鎖孔され
た穴に前記デュアルラインパッケージ集積回路のピンを
挿入して半田付けするよう構成したことを特徴とするプ
リント配線基板。 ７(1) Dual Line Package A printed wiring board on which an integrated circuit is mounted is provided with another printed wiring board standing upright on one surface of the printed wiring board, and the printed wiring board and the other printed wiring 1. A printed wiring board, characterized in that the pins of the dual line package integrated circuit are inserted into holes made in the board and soldered thereto. 7
を設けてなり、前記デュアルラインパッケージ集積回路
のピンを該集積回路端子用ソケットに差し込むよう構成
したことを特徴とする実用新案登録請求の範囲第１項記
載のプリント配線基板。(2) The printed wiring board is provided with an integrated circuit terminal socket, and the pins of the dual line package integrated circuit are inserted into the integrated circuit terminal socket. The printed wiring board according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14879281U JPS5856464U (en) | 1981-10-08 | 1981-10-08 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14879281U JPS5856464U (en) | 1981-10-08 | 1981-10-08 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5856464U true JPS5856464U (en) | 1983-04-16 |
Family
ID=29941594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14879281U Pending JPS5856464U (en) | 1981-10-08 | 1981-10-08 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856464U (en) |
-
1981
- 1981-10-08 JP JP14879281U patent/JPS5856464U/en active Pending
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