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JPS5996838U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5996838U
JPS5996838U JP19264882U JP19264882U JPS5996838U JP S5996838 U JPS5996838 U JP S5996838U JP 19264882 U JP19264882 U JP 19264882U JP 19264882 U JP19264882 U JP 19264882U JP S5996838 U JPS5996838 U JP S5996838U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
package
transmission window
semiconductor device
erased
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19264882U
Other languages
Japanese (ja)
Inventor
東　常昭
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP19264882U priority Critical patent/JPS5996838U/en
Publication of JPS5996838U publication Critical patent/JPS5996838U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のＵＶ−ＦＲＯＭの半導体装置を示す斜視
図、第２図は本考案の実施例の半導体装置を示す斜視図
である。尚、図において、１・・・・・・パッケージ、
２，２′・・・・・・紫外線透過窓。FIG. 1 is a perspective view showing a conventional UV-FROM semiconductor device, and FIG. 2 is a perspective view showing a semiconductor device according to an embodiment of the present invention. In addition, in the figure, 1... package,
2, 2'... Ultraviolet transmission window.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パッケージの透過窓を通過した紫外線によって消去され
る記憶素子を内臓した半導体装置において、前記透過窓
は前記パッケージの底面に設けられていることを特徴と
する半導体装置。1. A semiconductor device including a storage element that is erased by ultraviolet light passing through a transmission window of a package, wherein the transmission window is provided on a bottom surface of the package.
JP19264882U 1982-12-20 1982-12-20 semiconductor equipment Pending JPS5996838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19264882U JPS5996838U (en) 1982-12-20 1982-12-20 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19264882U JPS5996838U (en) 1982-12-20 1982-12-20 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5996838U true JPS5996838U (en) 1984-06-30

Family

ID=30414540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19264882U Pending JPS5996838U (en) 1982-12-20 1982-12-20 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5996838U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520225B2 (en) * 1974-07-15 1980-05-31
JPS5619036B2 (en) * 1973-11-07 1981-05-02
JPS5758061A (en) * 1980-09-26 1982-04-07 Hitachi Ltd Effective utilization of cold of blow liquified oxygen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619036B2 (en) * 1973-11-07 1981-05-02
JPS5520225B2 (en) * 1974-07-15 1980-05-31
JPS5758061A (en) * 1980-09-26 1982-04-07 Hitachi Ltd Effective utilization of cold of blow liquified oxygen

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