JPS5946091A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a printed wiring board.

Conventionally, the manufacturing method for printed wiring boards is to print etching resist ink by screen printing.
This method corrodes the copper surface of the areas where the ink is not attached and connects the wires.J) If this screen printing is used, it can be printed in Okawa in a short time.

7 Therefore, 1”, 1
1.
In screen printing, sand is used to print 2 sheets, - (411111) line reproducibility is poor, and high-precision products cannot be satisfied.・In the case of 4', 'i', the photographic method is used, but in this case, it has the disadvantage of being less productive and more expensive. be.

The present invention is superior in ζ thin line reproduction 111 compared to the above-mentioned conventional drawbacks, ;: I'+'+: Erasing 2, S)) phosphor printing method]
1 Moreover, it is possible to print Daisei in a short time, and Toei ° Rin 1
Culm Jr! To provide a method for manufacturing a board・r；−＋−＋
As a target, '=T + "E 4. In the invention, basically, the saw to achieve such a purpose is to use water hand 115j 4'l・+i++le. It is characterized by:

In other words, the present invention uses a water-free 111.11 printing method to print the conductive 4A surface 1. 72. Second process 11-1/1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-11-1/11-1/11-1/11-1/11-1/11-1/11-11-1/11-1/11-1/11-11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/11-1/2003 11-1/11-1/2003 11-11-1/2003 11-11-1/1000-1000-2000-2000-2000-2000-2003-2013-2013-12.

However, such waterless lithographic printing is usually performed by offset printing or double-sided printing.
In general, these printing methods have a small amount of ink transfer; for example, in screen printing, it is difficult to form an ink film thickness of 10 or more layers on the copper surface7, while in lithographic printing, it is difficult to form an ink film thickness of 3 to 511 layers.
Therefore, when using such a lithographic printing method, the resist film thickness is insufficient, so when applied to printed wiring boards, fine line reproducibility is rather poor, and pinpoles occur, resulting in poor accuracy. cause inconvenience. Therefore, in the present invention, we have overcome the drawbacks of such lithographic printing methods, and have created a pudding 1-1 that can be produced with high precision and at a low rate of 1 stroke, which has not been possible with conventional screen printing methods or photographic methods. The present invention has realized a method for manufacturing a wiring board, and as the method, the present invention provides a method for manufacturing a wiring board, in which a photosensitive layer is provided on a substrate having a rubber elastic layer on the surface thereof, and the photosensitive layer is
- A printing plate is produced using a printing original plate with a silicone rubber layer laminated on it, and this printing plate is wound around the plate cylinder of an offset printing machine or a letterpress printing machine, and first, it is rotated twice -U to apply two inks.
11:'(; After applying one layer, the conductive material surface G of the raw substrate for wiring
41; II +-7, (This is characterized in that after IV drying, the surface of the conductive plate is cleaned.

That is, the method of the present invention is described in detail below.
7), and in the present invention, first, as a printing original plate, as shown in FIG.
2) is laminated 7, and then a photosensitive layer (:()) is placed on the surface of this rubber elastic layer (2) and a silicone rubber layer (4) is placed on the surface of the photosensitive layer (3). Using this original printing plate (5), as shown in Figure 2, print the printing plate (
6) Manufacture. The method for producing such a printing plate (6) is the same as the conventional method. For example, a positive film is used to illuminate the surface of Inu 11 summer clothes (5) to i, and the non-printing line is created by the light adhesion. Glue the silicone rubber layer (4) and the photosensitive layer (-1), then -/glue the silicone rubber layer (4) 61-1 as shown in Figure 2. Elasticity of the part excluding the non-printing area (7) (2)
is exposed to form an ink receiving portion (8).

And the printing plate obtained in this way (61&',
Because it is equipped with the elastic layer (3), it is suitable not only for offset printing machines that print after transferring to a plate cylinder, but also for stone printing methods that print directly from the plate cylinder. A sufficient amount of ink transfer can be ensured, and printing can be performed even using a so-called letterpress printing machine. In addition, in this printing plate (6), the depth of the ink receiving part (8) can be up to about 30 μm at the maximum, thereby increasing the amount of ink transfer, and the method by Mitsuru is shown for printing plate I and wiring boards. The ink adhered to the printing plate (6) is once transferred to the printing plate (10), and then transferred to the raw substrate for wiring by the impression cylinder (11). (1
2). In this case, first, the raw board for wiring (1
2) is not passed between the printing plate (10) and the impression cylinder (11), the plate cylinder (9) is rotated once to deposit the ink (=J) on the printing plate (6). Printing is carried out through the substrate (12), and in this way the ink is attached to the printing plate (6).The reason why the ink is attached twice in this way is that it transfers to the copper surface of the raw substrate for wiring. The purpose is to increase the amount of ink applied, and by this method,
Improved the thinness of the ink film, which is a drawback of deck printing.
This ensures the required thickness of the 5' surface. Figure 4 shows the case where overprinting is performed using a letterpress printing press, and in this case, the printing plate (6) of the plate cylinder (9) is transferred to the rectangular wiring base Iff Cl2). be done. In this case as well, +6, first rotate the plate cylinder (9) and spray the ink onto the printing plate (6) without passing the wiring III raw board (12), and then Printing is carried out by passing the raw substrate (12) through the substrate (12) and injecting it twice.

In addition, as shown in Figure 5 (C), the raw substrate for wiring (12) is made of conductive material (+3) with a conductive wire (1).
One layer is used, and seven layers of lean and +r materials are used.
Although there are 1-sible substrates, poly-I'l-film (for example, Kapton, trade name) is most suitable as the substrate (13) for the S/L sible board.

Next 1. J-132U7 is printed with '□I-7,000Nia, force L1, ink 15), and '1Jl (41,... (I2)) for wiring in the figure is printed with ink. (+5)
(7) II V < I2 after fj Eiji.

The ink (15) +27 corroded the outer part, A and B:'
, :C) The ink (15) is peeled off to obtain a printed wiring board (16) as shown in FIG. In particular, the present invention uses UV drying even though it is a lithographic plate that does not require water, so the drying time is quick, and therefore less space is required for drying, which is extremely advantageous in terms of cost.

As will be understood from the following explanation, the present invention has the following advantages: (1) Printed wiring boards can be manufactured by waterless lithographic offset printing or direct printing, instead of the conventional screen printing method or photography. Therefore, it is possible to print in large quantities in a short period of time, and it can be produced with a significantly lower 1 stroke compared to conventional methods. Therefore, compared to screen printing methods that require gauze, it is possible to obtain fine line reproducibility and high precision with fewer pinballs. Despite the fact that U
Since V-drying is performed, drying can be performed in a short time and at a lower cost, which is far superior to conventional methods. In particular, in the present invention, when printing on the wiring board, one ink of the printing plate/＼ is applied twice. But, L, h t! t/j'', 1 to ensure sufficient etching thickness and high precision without any holes.

[Brief explanation of the drawing]

Figure 1 is printed 13; sectional view of the 1st edition, Figure 2 is printed
! Sectional view of the 31st Nro J Offse, 1 printing press, J,
A schematic diagram (not showing the printing machine), Fig. 4 shows the convex 11~printing machine &
, Z , l, Schematic diagram without showing the filter printing method, Figure 5 is for wiring 1
Figure 6 is for wiring after printing /f
:JP, 4 is a plane view, and FIG. 7 is a cross-sectional view of the wiring board). (1) One substrate, +21 'II' J, bullet 1'L layer, (3) - photosensitive layer, (4), /
2-1 layer, (12) - Raw board for wiring, (14
) IAI layer, (15) - Esotine Blaze 1 ink, (16) - wiring board. Patent Applicant: Toyo ♀ 1 (Industry and Stock Ministries Association 1 Representative Patent Attorney 1' Hisashi Masuki ・:・'■, Indication of the case [1#057 Patent Application No. 157035 2, Name of the invention W
Relationship between IT, Printed Wiring Board Manufacturing Method 3, and Personnel Responsible for City Control Patent Applicant Address: Mr. 1-3-18 Ashihara, Naniwa-ku, Hitohana City
Name: Toyo Shigyo Co., Ltd. 4, Jl. Address: ◎550 9F, Yosobashi Shinkosan Building, 5-2 Kitakuro-chome, F1-ku, Osaka 6, Number of inventions to be increased by amendment 7, Subject of amendment Details Book 8, ?ili Correct Contents As shown in the attached sheet, the contents of the correction (1), 1 ink (=I applied state) on page 5, line 18 of the specification, [ink applied twice (t2) Corrected as state I. (2), [Water unnecessary treatment] C, page 5, item 18 of the specification
amend ``in spite of the fact that there is no need for water 1 (in spite of the fact that there is only one deck'').
Correct with True Law 1. I;No1

Claims (1)

[Claims] A printing plate is produced using a printing original plate with a photosensitive layer on a substrate with a rubber elastic layer on the soil surface and a silicone rubber layer laminated on the photosensitive layer, and this printing plate is printed using an offset printing machine or letterpress printing. Wrap it around the plate cylinder of the machine, first turn it twice to apply ink twice, then place it on the same side of the conductive phase surface of the raw substrate for wiring, perform IJ V drying, and then apply the ink to the conductive material surface. A method for manufacturing a printed wiring board, characterized by performing corrosion.