JPS59218293A - Laser working device - Google Patents

Abstract

PURPOSE:To enable easy parallel two-line working at an optional width by bisecting a laser beam, condensing respectively the beams, irradiating the same to a work piece from both side faces and driving working heads to adjust the spacing between the beams. CONSTITUTION:A laser beam 1 is bisected by a beam splitter and respective reflected and transmitted laser beams 1 are conducted via totally reflecting mirrors 3 to condenser lenses 4. The laser beams 1 condensed respectively by said lenses are irradiated onto both side surfaces of an upright work piece 7 by which parallel two-line working is simultaneously accomplished. The width of parallel two-line working to the work piece 7 is easily adjusted by moving respective working heads including the lenses 4, the mirrors 3, working head nozzles 5, etc. to a vertical direction by means of driving mechanisms 9. The parallel two-line working is thus accomplished with high quality.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing apparatus capable of performing parallel two-line processing having an arbitrary mt value around the entire circumference of a laser beam.

A conventional laser processing apparatus capable of performing parallel two-line processing with this virtue is shown in FIG. FIG. 1 is a schematic cross-sectional configuration diagram showing a conventional laser processing device capable of performing parallel two-line processing. In the figure, 1 is a laser beam, 2 is a beam splitter, 3 is a total reflection mirror, 4 is a condensing lens, 5 is a processing head nozzle, 6 is a side nozzle, 7 is a workpiece, and 8 is a be.

Next, the operation shown in FIG. 1 will be explained. A laser beam 1 emitted from a laser oscillator (not shown) is split into two by a beam splitter 2, one beam is reflected by the beam splitter 2 and guided vertically downward as a reflected laser beam, and the other beam is is transmitted through the beam splitter 2, becomes a transmitted laser beam, and is conveyed to the total reflection mirror 3, where it is reflected and guided vertically downward. In this way, each reflected and transmitted laser beam parallel to each other is focused onto the surface of the workpiece 70 by the focusing lens 4. During laser processing, a processing head nozzle 5 is attached to each condenser lens 4t in order to simultaneously inject gas in the condensing direction and maintain the condensing lens 4t.In addition, in the case of welding processing, a side nozzle 5 is attached to each condenser lens 4t at the same time. Processing is performed by jetting the scraps in an oblique direction from 6. In order to scatter and absorb the laser beam transmitted through the workpiece 7, a back plate 8 is disposed below the workpiece 7.

Further, during direct machining, the machining head nozzle 5 or the knife and workpiece 7 are made to move relatively.

Since the conventional laser processing device capable of performing parallel 2#j processing has a 4g beam as described above, the diameter of the valley condensing lens 4 and its holding member (not shown) are
Parallel 2IVil processing with a radius of about 51 or less rarely has the disadvantage that the distance is very large.

This invention was made in order to completely eliminate the drawbacks of the conventional ones as described above.
a beam splitter for splitting, a light-coming lens and a total reflection mirror for focusing the split reflected laser beam and transmitted laser beam from opposite directions, respectively;
1. A configuration consisting of a nozzle that injects gas into each of the self-reflected laser beam and the transmitted laser beam, and a drive mechanism that moves the condensing lens, the total reflection mirror, and the nozzle to change the position of light arrival? It is an object of the present invention to provide a laser processing apparatus that can simultaneously perform parallel two-line processing on a workpiece at an arbitrary width easily and with high quality.

Hereinafter, all the drawings of the embodiments of this invention will be explained.

FIG. 2 is a 414-section cross-sectional view showing a laser blade device capable of performing parallel two-win machining, which is an embodiment of the present invention. The same parts as in FIG. , a detailed explanation thereof will be omitted. In the figure, 9 is a condenser lens 4
．． This is a processing head drive mechanism that moves a processing head including a total reflection mirror 3, a processing head nozzle 5, etc., and by operating this processing head drive mechanism 9, the processing head can be moved.
It can be moved to any desired position relative to the main body of the device, for example, via a diaphragm mechanism. Further, in order to condense the valley reflected laser beam and the transmitted laser beam from opposite directions, each light coming lens 4. The total reflection mirror 3, the processing head nozzle 5, etc. are arranged on both sides of the workpiece 7, respectively.

Next, the operation shown in FIG. 2 will be explained. A laser beam 1 emitted from a laser oscillator (not shown) is split into two by a beam sinter 2, one is reflected by the beam sinter 2, becomes a reflected laser beam, and is guided vertically downward, and the other One of the beams passes through the beam splitter 2, becomes a transmitted laser beam, is conveyed to the total anti-reflection W!3, is reflected by the total reflection mirror 3, and is guided vertically downward.In this way, The mutually parallel reflected and transmitted laser beams are each reflected by the total reflection mirror 3,
Two parallel laser beams whose optical axis directions have been changed are set in opposite directions. These two parallel and oppositely directed laser beams are each condensed by a condenser lens 4, and then
Irradiation is applied to both sides of the workpiece 70 that stands upright. Therefore, if the workpiece 7 is caused to travel in a horizontal direction, parallel two-line machining can be performed at the same time. In this case, the width of the parallel two-line machining performed on the workpiece 7 is the width of the condenser lens 4. By moving the total reflection mirror 3, processing head nozzle 5, etc. to each processing area including gold in the vertical direction, the processing can be easily performed.

FIGS. 3, 4, and 5 are cross-sectional configuration diagrams showing a laser processing apparatus capable of performing parallel two-line processing, which is another embodiment of the present invention. What is shown in Fig. 3 is the apparatus shown in Fig. 2 above, when the workpiece 7 that is standing upright is laid down sideways and placed in a horizontal position, and the upper and lower surfaces of the workpiece 7 are This device is configured to focus two parallel laser beams in opposite directions. Also, Figures 4 and 5
In the case shown in the figure, a total reflection mirror 3 is added when all of the two parallel and opposite laser beams are focused onto both sides of the workpiece 7 by the condenser lens 4. By placing the laser beams and reflecting them, the two parallel and oppositely directed laser beams are bent into perpendicular directions, and each laser beam is applied to both sides of the workpiece 7, similar to the apparatus shown in FIGS. 2 and 3 above. This is a device configured to condense light. A detailed explanation of the operations shown in FIGS. 3, 4, and 5 will be omitted.

As described above, according to the laser processing apparatus of the present invention, there is provided a condenser lens for condensing all of the mutually parallel reflected laser beam and transmitted laser beam obtained by dividing the laser beam into two from opposite directions. A total reflection mirror, and gas K1 is applied to the reflected laser beam and the transmitted laser beam, respectively.
- A nozzle for emitting light, and the condensing lens for changing the condensing position.

Since the structure consists of the total reflection mirror and a drive mechanism that moves the entire front GT nozzle, it can be
At the same time, parallel two-wire processing, such as parallel welding metal bath welding, scribing, ribbon cutting, etc., can be easily performed with extremely high processing performance.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional configuration diagram showing a conventional laser processing apparatus capable of performing parallel two-line processing, and FIG. 2 is a cross-sectional configuration diagram showing a laser processing apparatus t capable of performing parallel two-line processing, which is an embodiment of the present invention. 3, 4, and 5 are valley-f plane configuration diagrams showing a laser processing apparatus for performing parallel two-way processing, which is an embodiment of the present invention. In the figure, ■... Laser beam, 2... Beam sinter, 3... Total reflection mirror, 4... Condensing lens, 5
...Processing head nozzle, 6...Side nozzle, 7.
... Tonichi Kozai, 8... Back grade, 9... Kaloe head drive mechanism. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa Figure 2 Figure 3

Claims (1)

[Claims] A beam splitter that splits a laser beam irradiated from a laser oscillator into a reflected laser beam and a transmitted laser beam; and a condenser that focuses the divided reflected laser beam and transmitted laser beam from opposite directions. an optical lens and a total reflection mirror; a nozzle that fully injects gas into the reflected laser beam and the transmitted laser beam, respectively; and a drive mechanism that moves the condenser lens, the total reflection mirror, and the nozzle to change the focusing position. A laser processing device characterized by having a configuration consisting of.