JPS60213388A - Laser working device - Google Patents

Abstract

PURPOSE:To prevent heating, etc. of an unnecessary part by disposing a work, bender mirrors, etc. in such a way that the optical axis of the laser beam irradiated to a work has an advance angle with the surface of the work. CONSTITUTION:The laser beam 1 is bisected by a beam splitter 2 and is conducted via plural bender mirrors 3 as parallel beams toward condenser lenses 4. Such beams are irradiated to the surface of the work 5 disposed with an inclination at a prescribed angle. The direction of the optical axis of the beam 1 has consequently the angle of advance alpha with the surface of the work 5 and the backward going of the light reflected from the work 5 to the incident optical path is obviated. The reflected light does not pass through the lenses 4 and therefore the heating of the unnecessary part and the operator's burn are prevented.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a laser processing device that performs processing such as drilling, cutting, or welding by focusing a laser beam on a predetermined position on the surface of a workpiece. In particular, when the L1 beam splitter of this invention is used to simultaneously laser process multiple locations, the reflected light from the surface of the workpiece travels backwards along the incident optical path and is reflected again in an undesirable direction by the beam splitter. It is an object of the present invention to provide a laser processing device that does not cause laser beams to pass through, heat unnecessary parts, or cause burns to workers.

[Prior art]

1 and 2 are a plan view and a side view showing a conventional laser processing apparatus using a beam sinter. (1) is a laser beam irradiated from a laser oscillator (not shown), (2) a beam splitter that splits the fi laser beam (1) into two, (3) is a plurality of pender mirrors, and (4) is a plurality of condensing beams. A lens, (5) a workpiece, (6) a plurality of processing heads, and (7) a plurality of nozzles.

Since the conventional laser processing device is configured as described above, the laser beam (1) irradiated from the laser oscillator (not shown) is split into two by the beam splitter (2), (3) to heat a workpiece (5) that is guided as a mutually parallel laser beam toward a plurality of adjacent condenser lenses (4) and placed at a position perpendicular to the optical axis of the laser beam (1). The light is focused on the desired surface. Each nozzle (7) is installed in this condensing part.
Laser processing is performed by blowing air or oxygen gas from a source.

In a conventional laser processing device, as shown in Fig. 1, a laser beam (1) is irradiated onto the surface of a workpiece (5).
The reflected light travels backwards along the incident optical path and passes through the beam splitter (2).
When the laser beam returns to the oscillator, it is divided into a reflected beam (I) that travels toward the laser oscillator and a reflected beam (I) that deviates from the incident optical path, which may destabilize the oscillation output of the laser oscillator.
This method has the drawback of heating unnecessary parts of the workpiece (5) or causing burns to the worker.

[Summary of the invention]

This invention was made with attention to this point. at a predetermined angular position, or by placing a beam splitter, pender mirror, or processing head at a predetermined angular position so that reflected light from the workpiece surface reverses the incident optical path and is undesired by the beam splitter. Laser processing equipment that does not cause the oscillation output of the laser oscillator to become unstable by being reflected or transmitted again in the direction, heating unnecessary parts of the workpiece, or causing burns to workers. This is what we are trying to provide.

[Embodiments of the invention]

6 to 5 all show one embodiment of the present invention, FIG. 6 is a plan view, FIG. 4 is a side view, and FIG. 5 is an explanatory diagram of the laser beam, and each component is The conventional one mentioned above (
The same components as in FIGS. 1 and 2 are designated by the same reference numerals. However, as shown in FIG. 4, there is a difference in that the workpiece (5) is arranged at a predetermined angle with respect to the irradiated parallel laser beam (1). In this way, by tilting the workpiece (5) at a predetermined angle, the direction of the optical axis of the laser beam (1) irradiated to the workpiece (5)K is adjusted relative to the surface of the workpiece (5). "Advance angle" (α)
In this case, the reflected light from the workpiece (5) does not go back to the incident optical path as in the conventional case, but the reflected light from each processing head (6) Since it does not pass through the condensing lens (4), it is inevitably scattered, and the energy is attenuated by propagation over an extremely short distance, so it does not heat unnecessary parts of the workpiece as in the case of conventional methods. There is no such thing. Note that the laser beam (
The "advancing angle" (αL) that the direction of the optical axis of 1) has with respect to the surface of the workpiece (5) is ) The laser beam (1) t moves from the unprocessed part (8) of the workpiece (5) in the direction of the arrow to the molten part (9) of the welded part (10) by an advancing angle J(α). - Refers to the angle of inclination; if this is a "reverse advance angle", the laser beam (1) will further unnecessarily raise the temperature of the already melted molten part (9), and the implicit effect will be Don't be an idiot who won't be used,
If the optical axis of the laser beam (1) is tilted in a plane perpendicular to the welding direction, the weld bead will be tilted from the thickness direction, which is not preferable.

In other embodiments shown in FIGS. 6 and 7, the workpiece (5) is not tilted as in the above-mentioned embodiment, but the beam splitter (2), the pendulum mirror (3) or the processing head (6) is The workpiece (5) is tilted to a predetermined angle position.
The direction of the original axis of the laser beam (1) irradiated on the surface of the workpiece (5) has an "advancing angle" (α) with respect to the surface of the workpiece (5). It's exactly the same as the example.

〔Effect of the invention〕

As described above, according to the present invention, the workpiece (5)
The direction of the optical axis of the laser beam (1) irradiated to the workpiece (5), the beam splitter (2), or the pendamirror is adjusted so that the direction of the optical axis has an "advancing angle" with respect to the surface of the workpiece (5). (3), or because the processing head (6) etc. are arranged, the reflected light from the surface of the workpiece (5) goes all the way back, and is reflected again in an undesirable direction by the beam brick (2), υ, Or, it has an excellent effect of not transmitting it and destabilizing the oscillation output of the laser oscillator, heating unnecessary parts of the workpiece, or causing burns to workers.

[Brief explanation of the drawing]

1 and M2 show a conventional laser processing apparatus, with FIG. 1 being a plan view and FIG. 2 being a side view. Figure 6~
Each of FIG. 5 shows an embodiment of the present invention.
FIG. 4 is a plan view, FIG. 4 is a side view, and FIG. 5 is an explanatory diagram of the advancing angle of the laser beam. FIGS. 6 and 7 are a plan view and a side view showing another embodiment of the present invention. In the figure, (1) is the U laser beam, (2) is the beam splitter, (3) is the pender mirror, (4) is the condenser lens, (5) is the workpiece, (6) is the processing head, and (7) is the It's a nozzle. Note that the same reference numerals in the figures indicate the same or corresponding parts. Representative Patent Attorney Sanro Kimura Cause 1 ++ Figure 2 ← Figure 3 Figure 4 Figure 6 Procedural amendment (voluntary) 7114/1985 To the Commissioner of the Japan Patent Office 1, Indication of matter f'1゛Special Gansho 59-67402 No. 2,
Name of the invention: Raded processing device 3, Person making the correction 6, Contents of the correction (11 “Air” on page 3, line 4 of the specification is corrected to “argon gas”. (2) Specification, page 3, line 12 Delete "of workpiece (5)" in the line. (3) Delete "workpiece" in line 5 of page 4 of the specification. (4) Delete "of workpiece (5)" in line 12 of page 4 of the specification. In the explanatory diagram, "" is corrected to "in the explanatory diagram of advance angle,". (5) Clear ms, page 5, line 6, [delete J of workpiece.

Claims (2)

[Claims] (1) The workpiece or pender mirror or processing head should be set so that the direction of the optical axis of the laser beam irradiated onto the workpiece via the pender mirror and processing head has an "advance angle" with respect to the surface of the workpiece. A laser processing device characterized in that: is arranged at a predetermined angular position. (2) A laser processing apparatus according to claim 1, characterized in that a laser beam irradiated onto a workpiece is divided into two parts by a beam splitter, and pressure is applied to simultaneously perform laser processing on a plurality of locations.