JPS59202679A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPS59202679A JPS59202679A JP7693483A JP7693483A JPS59202679A JP S59202679 A JPS59202679 A JP S59202679A JP 7693483 A JP7693483 A JP 7693483A JP 7693483 A JP7693483 A JP 7693483A JP S59202679 A JPS59202679 A JP S59202679A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulating plate
- heat
- radiation
- emissivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
この発明は導電回路を形成する回路基板に等電回路を形
成した回路板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a circuit board in which an isoelectric circuit is formed on a circuit board forming a conductive circuit.
たとえばアルミナ等のセラミックスあるいはポリエステ
ル、エポキシ、ポリイミドなどの樹脂を紙、ガラス繊維
に含浸させた絶縁板に導電回路を形成して回路板とし、
これにＩＣの塔載密度が高まるにつれて発熱量が増大し
、この発熱を放熱によって回路板の温度上昇を防ぐ手段
がいくつか講じられている。たとえば放熱フィン、ファ
ンによる強制冷却などが主なるもので、これらは機器の
小型化カ１要請されている実情に反する。又表面に導電
回路を形成する回路基板の裏面にたとえば銅、アルミ、
鉄などの熱伝導率が絶縁板よりも高い金属材料を層着し
、この金属材料の熱伝導率を利用して冷却効果を狙った
のが知られているが、これでは導電回路が形成される絶
縁板の表面からの放熱が期待できない。すなわち絶縁板
を構成する樹脂あるいはセラミックスの熱伝導率が小さ
いために裏面に形成された金属材料への熱伝達量が少く
かつ絶縁板の放射量が少くしたがって温度降下が少い。For example, conductive circuits are formed on an insulating board made by impregnating paper or glass fiber with ceramics such as alumina or resins such as polyester, epoxy, or polyimide to form a circuit board.
In addition, as the density of ICs increases, the amount of heat generated increases, and several measures have been taken to radiate this heat and prevent the temperature of the circuit board from rising. For example, forced cooling using heat dissipation fins and fans is the main method, which is contrary to the actual situation where equipment is required to be downsized. Also, on the back side of the circuit board that forms a conductive circuit on the front side, for example, copper, aluminum,
It is known that a metal material such as iron, which has a higher thermal conductivity than the insulating plate, is layered and the thermal conductivity of this metal material is used to achieve a cooling effect, but this method does not form a conductive circuit. Heat dissipation from the surface of the insulating plate cannot be expected. That is, since the thermal conductivity of the resin or ceramics constituting the insulating plate is low, the amount of heat transferred to the metal material formed on the back surface is small, and the amount of radiation from the insulating plate is small, so that the temperature drop is small.
因みに絶縁板の放射率を考察してみると５０〜２００℃
に上昇すると表面からはブランクの放射式からも理解さ
れる如く３μ以上の長波長をもった遠赤外線が放射され
、全放射能を示すステファンボルツマンの法則にのって
理想黒体の波長全域にわたる放射率を１とすると、絶縁
板を構成する樹脂の放射率は０．５前後で、セラミック
スの放射率はアルキナで０．８である。By the way, when considering the emissivity of an insulating board, it is 50 to 200℃.
As understood from Blank's radiation formula, far-infrared rays with long wavelengths of 3μ or more are emitted from the surface, and according to Stefan Boltzmann's law, which indicates total radioactivity, the light spans the entire wavelength range of an ideal black body. Assuming that the emissivity is 1, the emissivity of the resin constituting the insulating plate is around 0.5, and the emissivity of the ceramic is 0.8 for Alquina.
この発明は以上の事実に鑑みてなされたもので、絶縁板
の表面から熱を輻射によって汲み出して高い冷却効果を
発揮する回路板を提供するものである。This invention has been made in view of the above facts, and it is an object of the present invention to provide a circuit board that exhibits a high cooling effect by pumping out heat from the surface of an insulating board by radiation.
この発明は遠赤外線の放射層を絶縁仮に形成したことを
特徴とする回路板を提供する。The present invention provides a circuit board characterized in that a far-infrared radiation emitting layer is temporarily formed as an insulator.
以下、この発明を実施例図面に基づいて説明する。第１
図において導電回路を形成した又は形成する絶縁板１の
裏面に遠赤外線の放射層２が形成されている。この放射
層２はアルミナよりも放射率の高いセラミックスたとえ
ばジルコニア、チタニア、ムライトあるいは遷移金属酸
化物たとえば酸化ニッケル、酸化コバルト、酸化鉄など
で与えられる。これらを単独又は混合系で用い塗装又は
溶射などで形成できる。この放射層２は第１図の如く絶
縁板１に導電回路を形成して成る回路板の裏面はもちろ
ん第２図に示す如く、この導電回路を形成した表面であ
ってこの導電回路区域４を除く非導電区域３に形成する
と両面からの放射によって自己冷却効果が高まる。Hereinafter, the present invention will be explained based on the drawings of the embodiments. 1st
In the figure, a far-infrared radiation layer 2 is formed on the back surface of an insulating plate 1 on which a conductive circuit is formed or will be formed. This emissive layer 2 is provided with a ceramic having a higher emissivity than alumina, such as zirconia, titania, mullite, or with a transition metal oxide such as nickel oxide, cobalt oxide, iron oxide, or the like. These can be used alone or in a mixed system, and can be formed by painting or thermal spraying. This radiation layer 2 includes not only the back surface of a circuit board formed by forming a conductive circuit on an insulating plate 1 as shown in FIG. 1, but also the surface on which this conductive circuit is formed as shown in FIG. When formed in the non-conductive area 3, the self-cooling effect is enhanced by radiation from both sides.
この発明は以上の如く構成され、絶縁板の温度上昇に伴
う長波長域の放射を長波長領域で放射率の高い遠赤外線
の放射層によって促進増大されるので熱を汲み出し、自
己冷却効果を有し、しかも機器の小型化に対しては、回
路板の板厚の増大をわずかに犠牲にする程度であるので
従来法のファンなどに比べて効果が大きい。The present invention is constructed as described above, and the radiation in the long wavelength range that accompanies the temperature rise of the insulating plate is promoted and increased by the far-infrared radiation layer that has a high emissivity in the long wavelength range, thereby pumping out heat and having a self-cooling effect. Moreover, in terms of miniaturization of equipment, this method is more effective than conventional methods such as fans because it only requires a slight increase in the thickness of the circuit board.
第１図、第２図はこの発明の実施例に係り異なる斜視図
である。
１・・・・・・絶縁板 ２・・・・・・放射層３・・・
・・・非導電区域
特許出願人
松下電工株式会社
代理人弁理士 竹 元 敏 丸
（ほか２名）
第１図
手続補正書
昭和５９年 ２月 ７日
特許庁長官 殿
１、事件の表示
昭和５８年特許願 第 ０７６９３４号２、発明の名称
回路板
３、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真１０４８番地名
称（５８３）松下電工株式会社
代表者 小 林 郁
４、代理人
住 所 大阪府門真市大字門真１０４８番地
補正の内容
（１）発明の詳細な説明の欄で明細書２頁７行の「熱が
期待できない。」を「熱しか期待できない。」に訂正す
る。
以上FIGS. 1 and 2 are different perspective views of embodiments of the invention. 1... Insulating plate 2... Radiation layer 3...
...Non-conductive area patent applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (and 2 others) Figure 1 Procedural Amendments February 7, 1980 Commissioner of the Japan Patent Office 1. Indication of the case 1982 Patent Application No. 076934 2, Title of Invention Circuit Board 3, Relationship with the Amendment Case Patent Applicant Address 1048 Kadoma, Kadoma City, Osaka Prefecture
Name (583) Matsushita Electric Works Co., Ltd. Representative: Iku Kobayashi 4, Agent address: 1048 Oaza Kadoma, Kadoma City, Osaka Prefecture Contents of the amendment (1) In the detailed description of the invention column, “heat "I can't expect anything but heat." is corrected to "I can only expect heat."that's all
Claims (1)
とする回路板。(1) A circuit board characterized by forming a far-infrared radiation layer on an insulating board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7693483A JPS59202679A (en) | 1983-04-30 | 1983-04-30 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7693483A JPS59202679A (en) | 1983-04-30 | 1983-04-30 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59202679A true JPS59202679A (en) | 1984-11-16 |
Family
ID=13619550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7693483A Pending JPS59202679A (en) | 1983-04-30 | 1983-04-30 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59202679A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08167682A (en) * | 1994-10-12 | 1996-06-25 | Kitagawa Ind Co Ltd | Heat sink |
| JPH0964253A (en) * | 1995-08-21 | 1997-03-07 | Kitagawa Ind Co Ltd | Electronic component with heat radiating function |
-
1983
- 1983-04-30 JP JP7693483A patent/JPS59202679A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08167682A (en) * | 1994-10-12 | 1996-06-25 | Kitagawa Ind Co Ltd | Heat sink |
| JPH0964253A (en) * | 1995-08-21 | 1997-03-07 | Kitagawa Ind Co Ltd | Electronic component with heat radiating function |
| DE19630002B4 (en) * | 1995-08-21 | 2010-11-18 | Kitagawa Industries Co., Ltd., Nagoya | An electronic heat radiating member and a method of manufacturing a heat radiating member |
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