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JPS59187186U - Circuit board seal structure - Google Patents

Circuit board seal structure

Info

Publication number
JPS59187186U
JPS59187186U JP8195483U JP8195483U JPS59187186U JP S59187186 U JPS59187186 U JP S59187186U JP 8195483 U JP8195483 U JP 8195483U JP 8195483 U JP8195483 U JP 8195483U JP S59187186 U JPS59187186 U JP S59187186U
Authority
JP
Japan
Prior art keywords
circuit board
seal structure
board seal
circuit
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8195483U
Other languages
Japanese (ja)
Inventor
園田 眞夫
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP8195483U priority Critical patent/JPS59187186U/en
Publication of JPS59187186U publication Critical patent/JPS59187186U/en
Pending legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図は、それぞれ本考案の一実施例である回
路基板のシール構造の外観図、断面図を示し、1は放熱
板、2.は回路パターン配線、3は実装部品、4は基板
、5は接着層、6はコネクター、7はシールカバー、8
はコネクターリード9と回路パターン配線2とのはんだ
材部、9はコネクターリードをそれぞれ示す。
1 and 2 respectively show an external view and a cross-sectional view of a sealing structure of a circuit board, which is an embodiment of the present invention, in which 1 is a heat sink; 2 is a heat sink; is a circuit pattern wiring, 3 is a mounting component, 4 is a board, 5 is an adhesive layer, 6 is a connector, 7 is a seal cover, 8
9 indicates a solder material portion between the connector lead 9 and the circuit pattern wiring 2, and 9 indicates the connector lead, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に回路を形成したその基板と、その基板を覆うカ
バーとを、加熱重合形接着剤を用いて密着し、前記回路
からの引き出し線が前記加熱重合形接着剤中を通って前
記カバーの外へ引き出されていることを特徴とする回路
基板のシール構造。
A circuit board on which a circuit is formed and a cover covering the board are closely attached using a heat-polymerizing adhesive, and a lead wire from the circuit passes through the heat-polymerizing adhesive and is attached to the cover. A circuit board seal structure characterized by being drawn out.
JP8195483U 1983-05-31 1983-05-31 Circuit board seal structure Pending JPS59187186U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8195483U JPS59187186U (en) 1983-05-31 1983-05-31 Circuit board seal structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8195483U JPS59187186U (en) 1983-05-31 1983-05-31 Circuit board seal structure

Publications (1)

Publication Number Publication Date
JPS59187186U true JPS59187186U (en) 1984-12-12

Family

ID=30211902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8195483U Pending JPS59187186U (en) 1983-05-31 1983-05-31 Circuit board seal structure

Country Status (1)

Country Link
JP (1) JPS59187186U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5824463U (en) * 1981-08-10 1983-02-16 トヨタ自動車株式会社 Electronically controlled fuel injection engine restart device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5824463U (en) * 1981-08-10 1983-02-16 トヨタ自動車株式会社 Electronically controlled fuel injection engine restart device

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