JPS59151449U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59151449U JPS59151449U JP4550383U JP4550383U JPS59151449U JP S59151449 U JPS59151449 U JP S59151449U JP 4550383 U JP4550383 U JP 4550383U JP 4550383 U JP4550383 U JP 4550383U JP S59151449 U JPS59151449 U JP S59151449U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- box
- semiconductor equipment
- semiconductor device
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の部分波断側面図、第２図は
別の従来の半導体装置の部分破断側面図、第３図はこの
考案による半導体装置の縦断側面図である。
１・・・金属基板、２・・・箱体、３・・・接着剤、５
・・・半導体素子、９・・・接着剤広がり防止用の溝。FIG. 1 is a partially cutaway side view of a conventional semiconductor device, FIG. 2 is a partially cutaway side view of another conventional semiconductor device, and FIG. 3 is a longitudinal side view of a semiconductor device according to this invention. 1... Metal substrate, 2... Box, 3... Adhesive, 5
...Semiconductor element, 9...Groove for preventing adhesive from spreading.
Claims (1)
箱体で囲んだ上記金属基板の上面に半導体素子を取付け
、上記箱体の外周縁部近傍の上記金属基板に接着剤広が
り防止用の溝を凹設してなる半導体装置。A box made of an insulator is glued onto a metal substrate, a semiconductor element is mounted on the top surface of the metal substrate surrounded by the box, and an adhesive is applied to the metal substrate near the outer periphery of the box. A semiconductor device with a recessed groove to prevent spreading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550383U JPS59151449U (en) | 1983-03-28 | 1983-03-28 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550383U JPS59151449U (en) | 1983-03-28 | 1983-03-28 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59151449U true JPS59151449U (en) | 1984-10-11 |
Family
ID=30176018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4550383U Pending JPS59151449U (en) | 1983-03-28 | 1983-03-28 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59151449U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812446U (en) * | 1981-07-16 | 1983-01-26 | 天竜精機株式会社 | Roll attachment/detachment mechanism of small rotary printing press |
-
1983
- 1983-03-28 JP JP4550383U patent/JPS59151449U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812446U (en) * | 1981-07-16 | 1983-01-26 | 天竜精機株式会社 | Roll attachment/detachment mechanism of small rotary printing press |
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