JPS59150329A - Through-hole inspection equipment - Google Patents
Through-hole inspection equipmentInfo
- Publication number
- JPS59150329A JPS59150329A JP1139683A JP1139683A JPS59150329A JP S59150329 A JPS59150329 A JP S59150329A JP 1139683 A JP1139683 A JP 1139683A JP 1139683 A JP1139683 A JP 1139683A JP S59150329 A JPS59150329 A JP S59150329A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- light
- printed board
- hole inspection
- illumination means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title claims description 11
- 230000007547 defect Effects 0.000 claims description 13
- 238000005286 illumination Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 7
- 239000011800 void material Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）発明の技術分野
本発明はプリント板に形成されたスルホールのボイド又
は欠陥を検査するスルーホール検査装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a through-hole inspection device for inspecting voids or defects in through-holes formed in a printed circuit board.
（ロ）技術の背景
プリント板の表面と裏面の導電部を相互に電気的に接続
するためプリント板にスルーホールを設けてそのスルー
ホールの内面を銅等の導電層によって被覆することによ
ってスルーホール処理を行−なう。このようにしてスル
ーホール処理がなされたスルーホールは信頼性の面から
ボイド又は欠陥は絶対に避けなければならない。(b) Background of the technology In order to electrically connect the conductive parts on the front and back sides of a printed board, a through hole is provided in the printed board and the inner surface of the through hole is covered with a conductive layer such as copper. Let's do the processing. From the viewpoint of reliability, voids or defects must be absolutely avoided in the through-holes processed in this manner.
（／（従来技術と問題点
従来スルーホールは幅又は径が約］闘厚さが約１ｍｍの
大きさであったためにスルーホールの内壁のボイド等を
検査するのに目視検査が行なわれていた。しかしながら
牛導体装置の集積度向上技術と相俟ってスルーホールの
幅又は径は徐々に小さく変化せしめられ約０．２ ｗｓ
と小さくなった。一方スルーホールの厚さは約３ｍと増
加せしめられスルーホール形状が細長くな９目視検査は
実質的に不可能となった。そこで第１図に示されるよう
な装置を用いて光学的に漏光金検知する方法が行なわれ
るようになった。、第１図によればプリント板Ｊにスル
ーホール２が設けられており該スルーホール２の内壁に
導電層３が被覆されている。該導電層３にはスルーホー
ルボイド又は欠陥４が形成されている。光源（図示せず
）から発せられた光５はスルーホール開口部に設けられ
た遮光マスク６以外を通過しプリント板内に入る。この
時１部の光７は該スルーホールボイド又は欠陥４からス
ルーホール内へ漏れ、レンズ８を介してＣＣＤなどの検
知器９によって検知される。光検知器９に裏って検知さ
れるものは第２図に示すように導電層３１Ｆ３の円形の
光７ａ（漏光）である。第１図に示したようなスルーホ
ールボイド検査装置は光源と遮光マスクが分離している
ため光源とマスクそれぞれにホルダーが必要でありまた
相互の位置調整が必要であっｆｃ、、又従来の装置はプ
リン１［の両側に光学系が必要であり空間的にも不都合
であった。(/(Prior art and problems) Conventional through-holes had a width or diameter of approximately 1 mm, so a visual inspection was required to inspect the inner wall of the through-hole for voids, etc. However, as technology improves the integration of conductor devices, the width or diameter of the through hole is gradually reduced to about 0.2 ws.
It became smaller. On the other hand, the thickness of the through hole has been increased to approximately 3 m, and the shape of the through hole is elongated, making visual inspection virtually impossible. Therefore, a method of optically detecting metal leakage using a device as shown in FIG. 1 has been used. According to FIG. 1, a through hole 2 is provided in a printed circuit board J, and the inner wall of the through hole 2 is coated with a conductive layer 3. Through-hole voids or defects 4 are formed in the conductive layer 3 . Light 5 emitted from a light source (not shown) passes through a portion other than the light-shielding mask 6 provided at the through-hole opening and enters the printed board. At this time, a portion of the light 7 leaks from the through-hole void or defect 4 into the through-hole, and is detected by a detector 9 such as a CCD via a lens 8. What is detected behind the photodetector 9 is circular light 7a (light leakage) from the conductive layer 31F3, as shown in FIG. In the through-hole void inspection device shown in Fig. 1, the light source and the light-shielding mask are separated, so a holder is required for each of the light source and mask, and mutual position adjustment is required. This required optical systems on both sides of the pudding 1 and was inconvenient in terms of space.
に）発明の目的
上記欠点全鑑み本発明の目的は光学系の調整が容易なス
ルーホール検査装局を提供することであ本発明の他の目
的は装置全体が占める空間を小さくせしめたスルーホー
ル検査装置を提供することである。B) Object of the Invention In view of all the above-mentioned drawbacks, the object of the present invention is to provide a through-hole inspection device whose optical system can be easily adjusted.Another object of the invention is to provide a through-hole inspection device that allows the entire device to occupy a smaller space. The purpose of the present invention is to provide an inspection device.
（ホ）発明の構成
本発明の目的はプリント板に形成されたスルーホールの
ボイド又は欠陥を検査するスルーホール検査装置におい
て；−少なくとも２つの照明手段と、該照明手段から発
せられた光を該スルーホールの開口部に入らぬように遮
光せしめる遮光手段と、該照明手段から発せられた光が
該ボイ゛ド又は欠陥から漏れた光を検知する光検知ｌｉ
ｔとを具備し且つ該照明手段、該遮光手段及び光検知装
置が該プリント板に対して同一側に配設せしめられてい
ること′ｆ：特徴とするスルーホール検査装置によって
達成される。(E) Structure of the Invention An object of the present invention is to provide a through-hole inspection device for inspecting voids or defects in through-holes formed in a printed board; A light shielding means for blocking light from entering the opening of the through hole, and a light detection device for detecting light emitted from the illumination means and leaking from the void or defect.
t, and the illumination means, the light shielding means, and the light detection device are arranged on the same side with respect to the printed board. 'f: Achieved by the through-hole inspection apparatus characterized by:
（へ）発明の実施例 以下本発明の実施例を図面に基づいて説明する。(f) Examples of the invention Embodiments of the present invention will be described below based on the drawings.
第３図は本発明に係る実施例？ｆ−説明するための概略
断面図である。Is Fig. 3 an embodiment according to the present invention? f - A schematic cross-sectional view for explanation.
第３図において−２つの照明灯１５がプリント板ＩＪに
形成されたスルーホール】２の側面全照明するように配
設されており、又スルーホール１２開口部近傍には、２
組の遮光板１６ａ及び遮光用ロールＪ６ｂが接続されて
対向丁芯ように配設されている。これら遮光板３６ａ及
び遮光ロールＪ６ｂがスルーホール開口付近に設けられ
且つ該ロール１６ｂがプリント板上を移動するようにな
っているため照明灯１５の光が開口部に入らないように
なっている。またスルーホール１２を構成する導電層に
ボイド又は欠陥Ｊ４からスルーホール内へ漏れた光を検
知する例えばテレビカメラＣＣＤ等の光検知装置１９が
ロール１６ｂ’（７））ユソ中央上方部に設けられてい
る。In FIG. 3, two illuminating lights 15 are arranged to illuminate the entire side of the through hole 2 formed in the printed board IJ, and near the opening of the through hole 12,
A pair of light shielding plates 16a and a light shielding roll J6b are connected and arranged so as to face each other. The light shielding plate 36a and the light shielding roll J6b are provided near the through-hole opening, and the roll 16b moves on the printed board, so that the light from the illumination lamp 15 does not enter the opening. Further, a light detection device 19 such as a television camera CCD for detecting light leaking into the through hole from a void or defect J4 in the conductive layer constituting the through hole 12 is provided at the upper center of the roll 16b' (7)). ing.
上ｉピ本発明のスルーホール検査装置を用いてスルーホ
ールを検査する方法を以下説明する。A method for inspecting through holes using the through hole inspection apparatus of the present invention will be described below.
移動ステージ１０上にスルーホール１２ ’ｅ再ｆるプ
リント板ＩＪｉ載置し、該スルーホールの開口部付近に
本装置を移動させる７照明灯１５をっけスルーホール１
２を側面から照明する。スルーホールを構成する導を層
に欠陥１４があれば照明灯１５から出た発はその欠陥１
４からスルーホール１２同一・漏れ、光学的に該漏光全
検知すべく配設されている元栓装置によって検知される
。照明灯１５から出た光をスルーホールの開口部から入
らないように遮光する装置で且つプリント板と接する部
分に用いる遮光手段は、プリント板上で移動しやすくし
かもプリント板を損傷しないためにもロールであること
が好ましくその拐質はゴム、等が好丑しい。またスルー
ホール１２をはさんで対向的に位置させたロールの間隙
はスルーホールの内径に応じて予め適宜セットされて因
るのが好ましい。Place the printed board IJi through the through hole 12 on the moving stage 10, and move the device to the vicinity of the opening of the through hole.
2 is illuminated from the side. If there is a defect 14 in the conductive layer constituting the through hole, the light emitted from the lighting lamp 15 will be caused by that defect 1.
4 through the through hole 12. Leakage is detected by a main plug device that is arranged to optically detect all of the leakage light. The light shielding device is a device that blocks the light emitted from the illumination lamp 15 from entering through the opening of the through hole, and the light shielding means used in the part that comes into contact with the printed board is designed so that it is easy to move on the printed board and does not damage the printed board. It is preferably a roll, and the material is preferably rubber. Further, it is preferable that the gap between the rolls placed opposite to each other across the through hole 12 is set appropriately in advance according to the inner diameter of the through hole.
（ト） 発明の詳細
な説明したように本発明に係る装置はプリント板に対し
て同一側に配設されているために両側配設を必要とする
従来装着に比して利用空間が小さく、各装置の調整も容
易に行なうことが可能となる。(g) As described in detail, the device according to the present invention is installed on the same side of the printed board, so the available space is smaller than in the conventional installation which requires installation on both sides. It also becomes possible to easily adjust each device.
第１図及び第２図は従来技術′ｆｃ説明するための概略
断面図及び平面図であり、第３図は本発明の１つの実施
例を説明するための概略断面図である。
Ｊ 、））・・・・・・プリント板、２．１２・・・・
・・スルーホール、３．Ｊ３・・・・・・導電層、４．
Ｊ４・・・・・・ボイド又は欠陥％５・・・・・・光、
６・・・・・・スルーホール遮蔽用遮光マスク、７，７
ａ・・・・・・漏光、８．】８・・自・・レンズ、９・
・・・・・光検知器、ｌＯ・旧・・移動ステージ、Ｊ５
・・・・・・ボイド又は欠陥検知用照明灯、１６ａ・・
・・・・遮光板、１６ｂ・・・・・・遮光ロール、１９
・・・・・・光検知装置。
特許出願人
富士通株式会社
特許出願代理人
弁理士 青 木 朗
弁理士 西 舘 和 之
弁理士 内 １）幸 男
鶏２図
−３図1 and 2 are a schematic sectional view and a plan view for explaining the prior art, and FIG. 3 is a schematic sectional view for explaining one embodiment of the present invention. J,))...Printed board, 2.12...
...Through hole, 3. J3... Conductive layer, 4.
J4...Void or defect%5...Light,
6... Light shielding mask for shielding through holes, 7,7
a...Light leakage, 8. ] 8. From... Lens, 9.
・・・・Photodetector, IO・Old・・Moving stage, J5
...Illuminating light for void or defect detection, 16a...
... Light shielding plate, 16b ... Light shielding roll, 19
......Light detection device. Patent applicant: Fujitsu Ltd. Patent agent: Akira Aoki, patent attorney Kazuyuki Nishidate, patent attorney (1) Sachi Otori Figures 2 and 3
Claims (1)
を検査するスルーホール検査装置において、少なくとも
２つの照明手段と、該照明手段から発せられた光を該ス
ルーホールの開口部に入らぬように遮光せしめる遮光手
段と、該照明手段から発せられた光が該ボイド又は欠陥
から漏れた光を検知する光検知装置とを具備し且つ該照
明手段、該遮光手段及び光検知装置が該プリント板に対
して同一側に配設せしめられていること？特徴とするス
ルーホール検査装置。A through-hole inspection device for inspecting voids or defects in through-holes formed in a printed circuit board, including at least two illumination means and blocking light emitted from the illumination means so that it does not enter the opening of the through-hole. A light-shielding means, and a light detection device that detects light emitted from the illumination means leaking from the void or defect, and the illumination means, the light-shielding means, and the light detection device are connected to the printed board. Are they placed on the same side? Characteristic through-hole inspection equipment.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1139683A JPS59150329A (en) | 1983-01-28 | 1983-01-28 | Through-hole inspection equipment |
| US06/554,543 US4560273A (en) | 1982-11-30 | 1983-11-23 | Method and apparatus for inspecting plated through holes in printed circuit boards |
| DE8383307291T DE3377527D1 (en) | 1982-11-30 | 1983-11-30 | Method and apparatus for inspecting plated through holes in printed circuit boards |
| EP83307291A EP0111404B1 (en) | 1982-11-30 | 1983-11-30 | Method and apparatus for inspecting plated through holes in printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1139683A JPS59150329A (en) | 1983-01-28 | 1983-01-28 | Through-hole inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59150329A true JPS59150329A (en) | 1984-08-28 |
| JPH0332732B2 JPH0332732B2 (en) | 1991-05-14 |
Family
ID=11776847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1139683A Granted JPS59150329A (en) | 1982-11-30 | 1983-01-28 | Through-hole inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59150329A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920840A (en) * | 1982-07-28 | 1984-02-02 | Fujitsu Ltd | Defect inspection equipment |
-
1983
- 1983-01-28 JP JP1139683A patent/JPS59150329A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920840A (en) * | 1982-07-28 | 1984-02-02 | Fujitsu Ltd | Defect inspection equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0332732B2 (en) | 1991-05-14 |
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