JPS59144153A - Cooling structure for integrated circuit package - Google Patents

Abstract

PURPOSE:To improve the cooling efficiency while maintaining high maintainability by mounting a conductive plate formed with a groove to be engaged with a heat sink on a substrate, on which an integrated circuit package with a heat dissipating heat sink and mounting a cooling plate provided with a cooling coolant passage on the conductive plate. CONSTITUTION:A conductive plate 8 provided with a groove 8b to be engaged with a heat dissipating heat sink 4 is mounted at the prescribed interval through a spacer 7 on a substrate 1, on which an LSI package 2 having the heat sink 4 is disposed. A cooling plate 10 provided with a cooling coolant passage 10a is mounted on the plate 8. Then, it can be cooled more efficiently than air cooling. Since the prescribed small interval is provided between the heat sink 4 and the plate 8, unreasonable force is not applied to the package 2. Further, since it is not necessary to fill filler of high thermal conductivity between the heat sink 4 and the plate 8, the removal of the plate 8 can be facilitated, thereby providing high maintainability.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling structure for cooling a performance circuit package mounted on a board.

Traditionally, forced air cooling methods, in which a blower is attached to the equipment and blows air through it, have often been used to cool circuit packages such as large-scale integrated circuit (LSI) packages mounted on printed wiring boards or ceramic boards. ing. However, due to the improvement in the business performance of Yuko Chikate and the advancement of high-density packaging technology by Sakuko, the power density has become so large that it is no longer possible to keep up with air-cooled systems. In other words, a large blower with a large air volume and high pressure is required to exhaust a large amount of heat from the dense interior, but this large blower generates a very loud noise and can damage the equipment in the room where the equipment is installed. On the other hand, it has disadvantages such as requiring a large air volume ◎ On the other hand, it is a well-known fact that liquid cooling systems have a much smaller cooling capacity than air cooling systems, but they efficiently transfer heat from the heat generating part to the refrigerant. No structure has yet been proposed that allows for good transmission and allows easy separation of the LSI package mounting section and cooling section.

SUMMARY OF THE INVENTION An object of the present invention is to provide a twisting liquid cooling type cooling structure that has a small temperature drop and is easy to maintain.

The structure of the present invention is a cooling structure for completely cooling a plurality of integrated circuit packages mounted on a substrate such as a printed distribution board or a ceramic substrate and having a heat sink for heat dissipation on the surface. a flat plate having a plurality of grooves formed in a shape that matches the outer shape of the heat sink on an opposing surface; a fixing means for fixing the substrate and the flat plate at a predetermined interval; and a cooling refrigerant that completely passes through. The surface of the flat plate not facing the substrate @JVC It is equipped with an attached cooling plate.

Next, the present invention will be explained in detail with reference to the drawings. ◎ Figure 1 is a perspective view of an embodiment of the present invention, and Figure 2 (
b) is a sectional view taken along the line AA after assembly in FIG. 1, and FIGS. 2(a) and 2(C) are sectional views taken along the line CC and BB in FIG. 2(b), respectively.

In this embodiment, a heat sink 4 having a plurality of flat fins on its upper part is fixed to the upper surface of an LSI package 2 with a fixing agent 3 such as a half-layer or adhesive. It is located in The fixed frame 5 and the spacer 7 are attached to the peripheral part of the board 1 through all the screws 6.Furthermore, the spacer 6 and the conductive plate 8 are fixed through the screws 9.At this time, the conductive plate 8Vc, Precise alignment is achieved by aligning the formed guide hole 8a with the guide pin 7a formed on the spacer 7. The head of the screw 9 does not protrude from the surface of the conductive plate due to the counterbore hole 8C formed in the conductive plate. On the side of the conductive plate 8 facing the heat sink 4, a groove 8 whose width is slightly larger than the fin thickness is formed at a position corresponding to the fin of the heat sink 4.
b is formed and this alignment is possible, so ssb
The gap between the heat sink 4 and the heat sink 4 can be made very small.

Furthermore, since the heat sink 4 and the conductive plate 8 can be structured so as not to come into contact with each other, it is possible to prevent excessive force from being applied to the LSI package 2.

A cooling plate 1o having a flow path 10a formed therein is fixed to the upper surface of the conduction plate 8 via screws 2. Water or 7 Leon is used as the refrigerant, and flows from the injection pipe 11a,
During the process of passing through the flow path 10a, the heat generated from the SI package 2 is completely absorbed and flows out from the discharge pipe 10b. LSI
The heat generated in the package 2 moves in the order of LSI package 2 → adhesive 3 → heat sink 4 → conduction plate 8 → cooling plate 10 → coolant, and LSI package 2 is maintained at a predetermined temperature.

In this embodiment, since the gap between the heat sink 4 and the conductive plate 8 where the air rush is present is small, the temperature drop in this gap can be reduced, and as a result, the heat is inversely proportional to the area where the heaton faces. In the embodiment, the fins of the heat sink 4 are #
Since it faces the inner circumferential surface of the heat sink 8b, the opposing area is the surface area of the heat sink, which is several tens of times larger than when there is no heat sink 9, and its enlargement ratio can reduce the temperature drop.

In addition, the conductive plate 8 is formed of a material with low thermal conductivity,
If attention is paid to the finish of the contact surface between the conductive plate 8 and the cooling plate 1O, the temperature drop can be sufficiently reduced, and as a result, even an LSI that generates a large amount of heat can be maintained at a predetermined temperature or lower. Furthermore, since the thermal conductivity is high in the gap between the heat sink 4 and the conductive plate 8, there is no peace of mind when using a filler.
Since the conductive plate 8 can be completely removed at once, repairs and adjustments can be made in a short time.

[Brief explanation of the drawing]

Is Fig. 1 an embodiment of the present invention? Exploded perspective view shown in Figure 2 (
b) is a sectional view taken along line AA in FIG. 1, and FIGS. 2(a) and (9) are sectional views taken along line C-C and line BB in FIG. 2(b), respectively. In the figure, 2b shows: 1... Board, 2... LSI package, 3... Adhesive, 4... Heat sink, 5... Fixed frame, 6...Screw, 7...
...Spacer, 7a...Guide pin, 8.
...Conduction plate, 8a...Guide hole, 8b.
...Monument, 8c...Zagushiana, 9...
...Screw, 10...Cooling plate, 10a...
・Flow path, lla...Injection pipe, llb...
・Discharge pipe, 12...screw. pier'L kun

Claims (1)

[Claims] In a cooling structure for cooling a plurality of circuit packages mounted on a board in front of a printed wiring board or a ceramic board and having a heat sink for heat dissipation on the surface, the outer shape of the heat sink is provided on the opposite surface facing the package mounting surface of the board. a flat plate formed with a plurality of grooves shaped to engage at least a portion of the substrate; a fixing means for fixing the substrate and the flat plate at a predetermined interval; a cooling plate that has a space provided in the space, an injection port for injecting the refrigerant into the space, and a discharge port for discharging the refrigerant from the space, and is attached to a side of the flat plate that does not face the substrate; The performance circuit cage cooling structure is modeled after having the following features.