JPS59125130U - filter - Google Patents
filterInfo
- Publication number
- JPS59125130U JPS59125130U JP1758183U JP1758183U JPS59125130U JP S59125130 U JPS59125130 U JP S59125130U JP 1758183 U JP1758183 U JP 1758183U JP 1758183 U JP1758183 U JP 1758183U JP S59125130 U JPS59125130 U JP S59125130U
- Authority
- JP
- Japan
- Prior art keywords
- filter
- chip
- substrate
- signal propagation
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例におけるフィルタのチップの
上面図、第２図は同チップと基板とを一体にしたものの
上面図、第３図は同フィルタの断面図である。
１・・・フィルタチップ、２・・・接着シート、４・・
べし形電極部、６・・・基板、８・・・モールド材、９
・・・信号伝搬部、１０・・・振動部。FIG. 1 is a top view of a filter chip according to an embodiment of the present invention, FIG. 2 is a top view of the chip and a substrate integrated, and FIG. 3 is a sectional view of the filter. 1... Filter chip, 2... Adhesive sheet, 4...
Beam-shaped electrode part, 6... Substrate, 8... Mold material, 9
... Signal propagation section, 10... Vibration section.
Claims (1)
チップと基板とを一体にしたものをモールド材に埋設し
てなるフィルタ。A filter in which a chip and a substrate are integrated through an adhesive layer that surrounds an electrode part, a vibration part, and a signal propagation part, and is embedded in a molding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1758183U JPS59125130U (en) | 1983-02-09 | 1983-02-09 | filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1758183U JPS59125130U (en) | 1983-02-09 | 1983-02-09 | filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59125130U true JPS59125130U (en) | 1984-08-23 |
Family
ID=30148815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1758183U Pending JPS59125130U (en) | 1983-02-09 | 1983-02-09 | filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59125130U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6297418A (en) * | 1985-10-23 | 1987-05-06 | Clarion Co Ltd | Packaging method for surface acoustic wave device |
-
1983
- 1983-02-09 JP JP1758183U patent/JPS59125130U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6297418A (en) * | 1985-10-23 | 1987-05-06 | Clarion Co Ltd | Packaging method for surface acoustic wave device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59125130U (en) | filter | |
| JPS60176558U (en) | semiconductor pressure sensor | |
| JPS58147250U (en) | package | |
| JPS6090843U (en) | Heat dissipation device such as IC | |
| JPS6083242U (en) | electronic circuit element | |
| JPS5816999U (en) | piezoelectric speaker | |
| JPS5976198U (en) | piezoelectric buzzer | |
| JPS5915515U (en) | Resin mold support member | |
| JPS5942659U (en) | radio call receiving device | |
| JPS59193097U (en) | piezoelectric sounding body | |
| JPS593691U (en) | Honeycomb diaphragm for speakers | |
| JPS5969598U (en) | speaker | |
| JPS599532U (en) | electronic components | |
| JPS6049662U (en) | Chip component mounting structure | |
| JPS5958104U (en) | Seismic isolation structure | |
| JPS58189698U (en) | Diaphragm for speaker | |
| JPS6020096U (en) | Bubble memory chip mounted board | |
| JPS58156662U (en) | Cushioning material | |
| JPS58182456U (en) | hybrid integrated circuit | |
| JPS59116999U (en) | Sounding body using piezoelectric element with drive circuit | |
| JPS6134737U (en) | Resin molded semiconductor device | |
| JPS58176497U (en) | piezoelectric buzzer | |
| JPS58116234U (en) | Thick film module heat sink | |
| JPS5844843U (en) | semiconductor equipment | |
| JPS5929828U (en) | surface wave filter package |