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JPS59121834U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS59121834U
JPS59121834U JP1396783U JP1396783U JPS59121834U JP S59121834 U JPS59121834 U JP S59121834U JP 1396783 U JP1396783 U JP 1396783U JP 1396783 U JP1396783 U JP 1396783U JP S59121834 U JPS59121834 U JP S59121834U
Authority
JP
Japan
Prior art keywords
wire bonding
bonding equipment
chip
abstract
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1396783U
Other languages
English (en)
Inventor
吉江　潤一郎
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to JP1396783U priority Critical patent/JPS59121834U/ja
Publication of JPS59121834U publication Critical patent/JPS59121834U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１〜３図は、本考案の治具図面であり、第１図は側面
図、第２図は平面図、第３図はＩＣチップ固定治具の立
体図である。 １は基板、２はシュート、３はＩＣチップ固定治具、４
はその真空穴、５はＩＣチップ、６はボンディングワイ
ヤ、７はサライ部、８はコーティングされたシリコンゴ
ム、ａ、ｂは治具上部の面積を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤボンディング工程に於いて、基板の位置決め後、
    ＩＣチップを給材し、チップを真空によって固定し、ワ
    イヤボンディングを行うことを特徴とするワイヤボンデ
    ィング装置。
JP1396783U 1983-02-02 1983-02-02 ワイヤボンデイング装置 Pending JPS59121834U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1396783U JPS59121834U (ja) 1983-02-02 1983-02-02 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1396783U JPS59121834U (ja) 1983-02-02 1983-02-02 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS59121834U true JPS59121834U (ja) 1984-08-16

Family

ID=30145340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1396783U Pending JPS59121834U (ja) 1983-02-02 1983-02-02 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59121834U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244646A (ja) * 1987-04-29 1990-09-28 Lsi Logic Corp リードワイヤボンディング装置及び方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244646A (ja) * 1987-04-29 1990-09-28 Lsi Logic Corp リードワイヤボンディング装置及び方法

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