JPS5849183Y2 - Solder tape structure - Google Patents

Description

[Detailed Description of the Invention] This invention mainly relates to a solder tape structure used for assembling semiconductor devices.

Generally, when soldering pellets to lead frames in the semiconductor device manufacturing process, solder pieces are supplied to fixed positions by cutting a strip of solder tape wound around a reel into a predetermined width. The cut solder tape was supplied to a fixed position using a vacuum suction nozzle or the like.

The solder supply device that supplies the solder pieces has a structure as shown in FIG. A detector detects and outputs a signal when the solder tape 1 wound around the reel 2 runs out; 4 is a feed roller connected to a drive source such as a motor to feed the solder tape 1 in pitch; 5;
is a driven roller for pressing the solder tape 1 against the feed roller 4; this driven roller 5 is rotatably held by a support arm 7 rotatably supported by a pin 6; The end of the support arm 7 is pressed in the direction of the arrow 1 by the elasticity of a spring 8 disposed at the bottom, so that the driven roller 5 held by the support arm 7 comes into pressure contact with the solder tape.

9 is a pair of tape guides installed in front of the rollers 4 and 5, and 10 is a cutter located in front of the tape guide 9.

The solder tape 1, which is intermittently fed by the feeding roller 4 through l pairs of tape guides 9, is then delivered to the cutter 10.
After being cut into a predetermined width by a vacuum suction nozzle 11 or the like, it is transported to a predetermined position.

By the way, since the solder tape 1 used in the solder supply device has a thickness of only about 0.1 to 0.2 mm, the solder tape 1 wound around the reel 3 is transferred between the feed roller 4 and the driven roller 5. In order to guide the tape through the tape guide 9 and then between the pair of tape guides 9 to the location where the cutter 10 is installed,
The disadvantage is that the operator must use tweezers or the like to be careful not to deform the solder tape 1, making it extremely difficult to load the solder tape 10 into the solder supply device.

In view of the above drawbacks, this invention provides a solder tape that can be easily loaded into a solder supply device.The details of this invention will be explained below with reference to the embodiments shown in the drawings.

That is, as shown in FIG. 2, this invention has a guide tape 12 formed of a material that is difficult to plastically deform, such as metal or plastic, at the tip of a solder tape 1 wound around a reel 2.
is attached, and when loading the solder tape 1 wound on the reel 2 into the solder supply device, the guide tape 12 attached to the tip of the solder tape 1 is first passed through the feed roller 4 and the driven roller 5.
and between a pair of tape guides 90 to the tip of the tape guide 9, and then the guide tape 12
, and pull out the solder tape 1 connected to the rear end of the guide tape 12 through between the feed roller 4 and the driven roller 5 and between the pair of tape guides 90 to the location where the cutter 10 is installed. By separating the guide tape 12 attached to the tip of the solder tape 1 from the solder tape 1, the solder tape 10 is loaded into the solder supply device.

The guide tape 120 can be attached to the solder tape 1 by directly soldering the guide tape 12 to the solder tape 1, or by attaching the guide tape 12 to the solder tape 1 using adhesive tape such as double-sided tape. As shown in FIG.
4 may be provided, and the solder tape 1 with its tip folded in half may be held between the guide tape 12 and the locking plate 15.

As explained above, this idea is based on the tip of the solder tape.
A guide tape made of a material that does not easily deform plastically, such as metal or plastic, is attached, and after passing this guide tape that does not easily deform plastically through a predetermined location of the solder supply device, the guide tape is pulled and the solder tape is supplied with solder. Since the solder tape is passed through a predetermined location of the device, it is possible to easily load the solder tape into the solder supply device, which was extremely difficult in the past, and at the same time, the time required for loading can be shortened.

[Brief explanation of drawings]

FIG. 1 is a drawing showing a schematic configuration of a solder supply device, FIG. 2 is a drawing showing a solder tape structure according to this invention, and FIG. 3 is a drawing showing an example of attaching a guide tape to a solder tape according to this invention. be. 1...Solder tape, 2...Reel, 1
2... Guide tape.

Claims (1)

[Scope of utility model registration request] A solder tape structure comprising a band-shaped solder tape wound around a reel, and a guide tape made of a material that is difficult to deform plastically, such as metal or plastic, is attached to the tip of the solder tape.