JPS5833754Y2 - Mounting structure of heat sink - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a mounting structure for a heat sink for a power transistor or the like mounted on a printed wiring board.

Conventionally, this type of heat dissipation plate was made by bending a metal plate with good thermal conductivity, and the edge that contacted the printer I/wiring board was bent to form a mounting leg, and it was fixed with screws, etc., but it was difficult to assemble it. This method has drawbacks such as being troublesome and requiring a large number of parts, resulting in high costs.

The present invention is an improvement on this, and the present invention will be explained with reference to an embodiment shown in the figure below. 1 is a heat sink, and the heat sink 1 is formed into a planar U-shaped cross section by bending two parts at approximately right angles. The surface of the heat sink 1 is erected perpendicularly to the top surface of the printed wiring board 2, and the edge in contact with the printed wiring board 2 is extended downward in an L-shape for engagement with the printed wiring board 2. A hooking claw 3 is formed, and a required mounting hole 4 for mounting a semiconductor device A such as a power transistor is formed in the plate surface facing the hooking claw 3, and the semiconductor device A such as a power transistor is inserted between the holes. Attachment: A connection plate 5, which also serves as a ground terminal, is inserted into the mounting screw portion and led out from below the printed circuit board.

On the other hand, holes 6 large enough to fit the hooking claws 3 are formed in the printed wiring board 2 at required locations, and holes 7 are drilled into which the connecting plates 5 are inserted while the hooks are hooked.

In the above-mentioned takeover, insert the hook 3 into the hole 6 of the pudding 1 to the wiring board 2, slide it sideways and hook it to the side edge of the same size 2, and insert the connection plate 5 into one hole 7. In this state, the connection board 5 is connected to the copper foil of the printed wiring board 2 by soldering.

As explained above, the heat dissipation plate 1 can be fixed to the print board 1 to the wiring board 2 by the hooking claws 3 and the connection plate 5.

Such installation does not require troublesome tightening processes such as snap-locking, and can be easily installed by simply inserting and adding solder.

Note that the connection plate 5 provided at a position facing the hook 3 is fixed using the mounting screws of the element, so the connection plate 5 can be attached to the heat sink without using specific screws, making it impossible to solder. It is possible to easily combine a heat sink with good heat dissipation effect and a connection board that can be soldered. Also, the heat sink can reinforce the printed circuit board 1 to the wiring board, and various electrical components (resistors, capacitors, etc.) can be mounted on the enclosed printed circuit board. , diodes, coils, etc.), the printed circuit board can be used efficiently.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of a heat sink, and FIG. 2 is a side view showing how the heat sink is attached to a printed wiring board. In the figure, 1 is a heat sink, 2 is a printed wiring board, 3 is a hook, 4 is a mounting hole, 5 is a connection plate, and 6 and 7 are holes.

Claims (1)

[Scope of utility model registration request] When fixing a heat sink holding a semiconductor element such as a power 1 transistor to a wiring board 1, the heat sink is bent at two points at approximately right angles to form a planar U-shaped cross section.
The plate surface of the heat sink is placed upright on the printed wiring board in a planar three-dimensional shape, and the edges of the heat sink in contact with the printed wiring board are L-shaped to engage holes etc. provided in the printed wiring board. The hooks are extended downward, and the required mounting holes for mounting the semiconductor elements such as the power transistors are opened on the other side edge of the heat sink facing the hooks, and the semiconductor elements are screwed into the same places. Attach a connecting plate that also serves as a ground terminal to the same threaded part and make it protrude downward. With the hook hook hooked on the board, insert the end of the connecting plate into the copper foil part on the back of the board, and solder. A mounting structure for a heat sink, characterized in that it is attached and fixed.